Flip chip

Industry

CPC
H05K2201/10674

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/10674Flip chip

Industries

Patents Grantslast 30 patents

Information Patent Grant
Wiring substrate and semiconductor device
- Patent number 12,133,330
- Issue date Oct 29, 2024
- Shinko Electric Industries Co., Ltd.
- Akihiro Takeuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Double-sided flexible circuit board
- Patent number 12,089,326
- Issue date Sep 10, 2024
- Chipbond Technology Corporation
- Yin-Chen Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Devices and methods related to metallization of ceramic substrates...
- Patent number 12,058,806
- Issue date Aug 6, 2024
- Skyworks Solutions, Inc.
- Shaul Branchevsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Portable electronic device and image-capturing module thereof
- Patent number 12,028,595
- Issue date Jul 2, 2024
- Azurewave Technologies, Inc.
- Chih-Yuan Chuang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Radio frequency front-end module, manufacturing method thereof and...
- Patent number 12,022,616
- Issue date Jun 25, 2024
- Shenzhen Newsonic Technologies Co., Ltd.
- Guojun Weng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High density organic bridge device and method
- Patent number 12,002,762
- Issue date Jun 4, 2024
- Intel Corporation
- Mihir K. Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 11,997,788
- Issue date May 28, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Sang Hoon Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of package structure
- Patent number 11,895,780
- Issue date Feb 6, 2024
- Unimicron Technology Corp.
- Kai-Ming Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layout structure of a flexible circuit board
- Patent number 11,812,554
- Issue date Nov 7, 2023
- Chipbond Technology Corporation
- Yu-Chen Ma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure and method for manufacturing a circuit boar...
- Patent number 11,792,941
- Issue date Oct 17, 2023
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure and electronic device including the same
- Patent number 11,770,898
- Issue date Sep 26, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seung Eun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 11,737,214
- Issue date Aug 22, 2023
- INNOLUX CORPORATION
- Chen-Lin Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and electronic component package
- Patent number 11,729,910
- Issue date Aug 15, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Chan Hoon Ko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module
- Patent number 11,716,813
- Issue date Aug 1, 2023
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing an electronic module and electronic module
- Patent number 11,716,816
- Issue date Aug 1, 2023
- IMBERATEK, LLC
- Antti Iihola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier circuit
- Patent number 11,677,358
- Issue date Jun 13, 2023
- Murata Manufacturing Co., Ltd.
- Masatoshi Hase
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Bump-on-trace design for enlarge bump-to-trace distance
- Patent number 11,658,143
- Issue date May 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Yu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnection for a catheter
- Patent number 11,617,542
- Issue date Apr 4, 2023
- Murata Manufacturing Co., Ltd.
- Heikki Kuisma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Transporting light within circuit board profile
- Patent number 11,598,911
- Issue date Mar 7, 2023
- Arista Networks, Inc.
- Matthew Albert Moe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for contacting and rewiring an electronic component embedded...
- Patent number 11,570,904
- Issue date Jan 31, 2023
- AT&S Austria Technologie & Systemtechnik
- Wolfgang Schrittwieser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 11,553,601
- Issue date Jan 10, 2023
- Ibiden Co., Ltd.
- Kazuyuki Ueda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
LED assembly with omnidirectional light field
- Patent number 11,543,081
- Issue date Jan 3, 2023
- Epistar Corporation
- Hong-Zhi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module installation on printed circuit boards with embedded trace t...
- Patent number 11,502,010
- Issue date Nov 15, 2022
- Intel Corporation
- Quan Qi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible circuit board and heat spreader thereof
- Patent number 11,503,698
- Issue date Nov 15, 2022
- Chipbond Technology Corporation
- Yi-Ling Hsieh
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Method and system for bonding a chip to a substrate
- Patent number 11,476,228
- Issue date Oct 18, 2022
- Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Gari Arutinov
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and method for fabricating base for semicondu...
- Patent number 11,469,201
- Issue date Oct 11, 2022
- Mediatek Inc.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and electronic device
- Patent number 11,452,210
- Issue date Sep 20, 2022
- Shinko Electric Industries Co., Ltd.
- Takayuki Matsumoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,445,617
- Issue date Sep 13, 2022
- Unimicron Technology Corp.
- Kai-Ming Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module
- Patent number 11,419,215
- Issue date Aug 16, 2022
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate and method for manufacturing the same
- Patent number 11,398,421
- Issue date Jul 26, 2022
- Advanced Semiconductor Engineering, Inc.
- Chun-Che Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS OF PACKAGING MICROELECTRONIC DEVICES UTILIZING PANELS AND R...
- Publication number 20240357747
- Publication date Oct 24, 2024
- MICROCHIP TECHNOLOGY INCORPORATED
- J. Andrew Kovats
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD
- Publication number 20240321762
- Publication date Sep 26, 2024
- Intel Corporation
- Mihir K. Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240276643
- Publication date Aug 15, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Sang Hoon Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Transmitter Charging Module for Light Detection and Ranging (Lidar)...
- Publication number 20240215169
- Publication date Jun 27, 2024
- WAYMO LLC
- Augusto Tazzoli
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REDISTRIBUTION SUBSTRATE, SEMICONDUCTOR PACKAGE INCLUDING THE SAME,...
- Publication number 20240213133
- Publication date Jun 27, 2024
- Samsung Electronics Co., Ltd.
- Hyungjun PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED PASSIVES WITH CAVITY SIDEWALL INTERCONNECT IN GLASS CORE A...
- Publication number 20240114622
- Publication date Apr 4, 2024
- Intel Corporation
- Kristof Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240074049
- Publication date Feb 29, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Tae Kyun Bae
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARDS, PRINTED WIRING BOARD ASSEMBLIES, AND ELECTRO...
- Publication number 20240064906
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- Kristopher D. Hamrick
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240040691
- Publication date Feb 1, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Kwon Su YUN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240040698
- Publication date Feb 1, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Sang Min AHN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE WIRING BOARD
- Publication number 20230371186
- Publication date Nov 16, 2023
- TOPPAN INC.
- Masashi SAWADAISHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230345637
- Publication date Oct 26, 2023
- Fuji Electric Co., Ltd.
- Yoshihiro KODAIRA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY FRONT-END MODULE, MANUFACTURING METHOD THEREOF AND...
- Publication number 20230292438
- Publication date Sep 14, 2023
- Shenzhen Newsonic Technologies Co., Ltd.
- Guojun WENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bump-on-Trace Design for Enlarge Bump-to-Trace Distance
- Publication number 20230253358
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sheng-Yu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING PROCESS FOR EMBEDDED CHIPS
- Publication number 20230230929
- Publication date Jul 20, 2023
- Guangdong ZECHENG Technology Co., LTD
- CHIA-MING LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED PRINTED CIRCUIT BOARD
- Publication number 20230199967
- Publication date Jun 22, 2023
- Shinko Electric Industries Co., Ltd.
- Seiji Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230171888
- Publication date Jun 1, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Sang Hoon Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE
- Publication number 20230130183
- Publication date Apr 27, 2023
- Shinko Electric Industries Co., Ltd.
- Akihiro TAKEUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRANSPORTING LIGHT WITHIN CIRCUIT BOARD PROFILE
- Publication number 20230066177
- Publication date Mar 2, 2023
- Arista Networks, Inc.
- Matthew Albert Moe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PORTABLE ELECTRONIC DEVICE AND IMAGE-CAPTURING MODULE THEREOF
- Publication number 20230068132
- Publication date Mar 2, 2023
- AZUREWAVE TECHNOLOGIES, INC.
- Chih-Yuan Chuang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
LAYOUT STRUCTURE OF FLEXIBLE CIRCUIT BOARD
- Publication number 20230044345
- Publication date Feb 9, 2023
- Chipbond Technology Corporation
- Yu-Chen Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE
- Publication number 20220346235
- Publication date Oct 27, 2022
- MURATA MANUFACTURING CO., LTD.
- Yoshihito OTSUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND ELECTRONIC COMPONENT PACKAGE
- Publication number 20220192017
- Publication date Jun 16, 2022
- Samsung Electro-Mechanics Co., Ltd.
- Chan Hoon KO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAYOUT STRUCTURE OF A FLEXIBLE CIRCUIT BOARD
- Publication number 20220104354
- Publication date Mar 31, 2022
- Chipbond Technology Corporation
- Yu-Chen Ma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAYOUT STRUCTURE OF A FLEXIBLE CIRCUIT BOARD
- Publication number 20220037238
- Publication date Feb 3, 2022
- Chipbond Technology Corporation
- Yu-Chen Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED ORGANIC INTERPOSER FOR HIGH BANDWIDTH
- Publication number 20210327851
- Publication date Oct 21, 2021
- Invensas Corporation
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SAME
- Publication number 20210289629
- Publication date Sep 16, 2021
- Samsung Electro-Mechanics Co., Ltd.
- Seung Eun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF PACKAGE STRUCTURE
- Publication number 20210195761
- Publication date Jun 24, 2021
- Unimicron Technology Corp.
- Kai-Ming YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND ELECTRONIC DEVICE
- Publication number 20210153355
- Publication date May 20, 2021
- Shinko Electric Industries Co., Ltd.
- Takayuki Matsumoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULE
- Publication number 20210136917
- Publication date May 6, 2021
- MURATA MANUFACTURING CO., LTD.
- Yoshihito OTSUBO
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wiring substrate and semiconductor device

Double-sided flexible circuit board

Devices and methods related to metallization of ceramic substrates...

Portable electronic device and image-capturing module thereof

Radio frequency front-end module, manufacturing method thereof and...

High density organic bridge device and method

Printed circuit board and method of manufacturing the same

Manufacturing method of package structure

Layout structure of a flexible circuit board

Circuit board structure and method for manufacturing a circuit boar...

Substrate structure and electronic device including the same

Electronic device

Printed circuit board and electronic component package

Module

Method for manufacturing an electronic module and electronic module

Power amplifier circuit

Bump-on-trace design for enlarge bump-to-trace distance

Electrical interconnection for a catheter

Transporting light within circuit board profile

Method for contacting and rewiring an electronic component embedded...

Wiring board and method for manufacturing the same

LED assembly with omnidirectional light field

Module installation on printed circuit boards with embedded trace t...

Flexible circuit board and heat spreader thereof

Method and system for bonding a chip to a substrate

Semiconductor package and method for fabricating base for semicondu...

Wiring substrate and electronic device

Package structure and manufacturing method thereof

Module

Semiconductor substrate and method for manufacturing the same

Patents Applicationslast 30 patents

METHODS OF PACKAGING MICROELECTRONIC DEVICES UTILIZING PANELS AND R...

HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

Transmitter Charging Module for Light Detection and Ranging (Lidar)...

REDISTRIBUTION SUBSTRATE, SEMICONDUCTOR PACKAGE INCLUDING THE SAME,...

EMBEDDED PASSIVES WITH CAVITY SIDEWALL INTERCONNECT IN GLASS CORE A...

PRINTED CIRCUIT BOARD

PRINTED WIRING BOARDS, PRINTED WIRING BOARD ASSEMBLIES, AND ELECTRO...

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

PRINTED CIRCUIT BOARD

COMPOSITE WIRING BOARD

SEMICONDUCTOR DEVICE

RADIO FREQUENCY FRONT-END MODULE, MANUFACTURING METHOD THEREOF AND...

Bump-on-Trace Design for Enlarge Bump-to-Trace Distance

PACKAGING PROCESS FOR EMBEDDED CHIPS

EMBEDDED PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE

TRANSPORTING LIGHT WITHIN CIRCUIT BOARD PROFILE

PORTABLE ELECTRONIC DEVICE AND IMAGE-CAPTURING MODULE THEREOF

LAYOUT STRUCTURE OF FLEXIBLE CIRCUIT BOARD

MODULE

PRINTED CIRCUIT BOARD AND ELECTRONIC COMPONENT PACKAGE

LAYOUT STRUCTURE OF A FLEXIBLE CIRCUIT BOARD

LAYOUT STRUCTURE OF A FLEXIBLE CIRCUIT BOARD

EMBEDDED ORGANIC INTERPOSER FOR HIGH BANDWIDTH

SUBSTRATE STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SAME

MANUFACTURING METHOD OF PACKAGE STRUCTURE

WIRING SUBSTRATE AND ELECTRONIC DEVICE

MODULE