Flow barrier

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H01L2224/24997

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/24997Flow barrier

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package for improving reliability
- Patent number 11,557,560
- Issue date Jan 17, 2023
- Samsung Electronics Co., Ltd.
- Yeohoon Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor structure
- Patent number 10,373,932
- Issue date Aug 6, 2019
- NANYA TECHNOLOGY CORPORATION
- Po-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die having fine pitch electrical interconnects
- Patent number 8,829,677
- Issue date Sep 9, 2014
- Invensas Corporation
- Keith Lake Barrie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure comprising blind vias intended to be metalized
- Patent number 8,482,130
- Issue date Jul 9, 2013
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Damien Saint-Patrice
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE FOR IMPROVING RELIABILITY
- Publication number 20220059492
- Publication date Feb 24, 2022
- Samsung Electronics Co., Ltd.
- Yeohoon Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and Associated Methods
- Publication number 20140345924
- Publication date Nov 27, 2014
- Nokia Corporation
- Mark Lee ALLEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140284795
- Publication date Sep 25, 2014
- SK HYNIX INC.
- Sang Eun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor die having fine pitch electrical interconnects
- Publication number 20120248607
- Publication date Oct 4, 2012
- Vertical Circuits, Inc.
- Keith Lake Barrie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE COMPRISING BLIND VIAS INTENDED TO BE METALIZED
- Publication number 20110221068
- Publication date Sep 15, 2011
- COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENE. ALT.
- Damien SAINT-PATRICE
- H01 - BASIC ELECTRIC ELEMENTS