Flow barriers

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H01L2224/26175

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/26175Flow barriers

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing a structure
- Patent number 12,107,069
- Issue date Oct 1, 2024
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Nohora-Lizeth Caicedo Panqueva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded packaging for wide band gap semiconductor devices
- Patent number 12,087,677
- Issue date Sep 10, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Maria Clemens Ypil Quinones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing light emitting devices
- Patent number 12,080,695
- Issue date Sep 3, 2024
- Nichia Corporation
- Kenji Ozeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package with redistribution structure having multiple chips
- Patent number 12,046,548
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface material having different thicknesses in packages
- Patent number 11,916,023
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sung-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging substrate fine pitch metal bump and reinfor...
- Patent number 11,908,819
- Issue date Feb 20, 2024
- Apple Inc.
- Jun Chung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill material flow control for reduced die-to-die spacing in s...
- Patent number 11,854,945
- Issue date Dec 26, 2023
- Tahoe Research, LTD.
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a semiconductor chip connected in a flip...
- Patent number 11,842,972
- Issue date Dec 12, 2023
- Rohm Co., Ltd.
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device
- Patent number 11,791,324
- Issue date Oct 17, 2023
- Nichia Corporation
- Kenji Ozeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package
- Patent number 11,776,867
- Issue date Oct 3, 2023
- Industrial Technology Research Institute
- Kuo-Shu Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,769,763
- Issue date Sep 26, 2023
- Powertech Technology Inc.
- Shang-Yu Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost package warpage solution
- Patent number 11,764,080
- Issue date Sep 19, 2023
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic substrate and electronic apparatus
- Patent number 11,676,929
- Issue date Jun 13, 2023
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Masataka Maehara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package with redistribution structure having multiple chips
- Patent number 11,670,577
- Issue date Jun 6, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Negative fillet for mounting an integrated device die to a carrier
- Patent number 11,664,340
- Issue date May 30, 2023
- Analog Devices, Inc.
- Vikram Venkatadri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of making the same
- Patent number 11,557,530
- Issue date Jan 17, 2023
- Semiconductor Components Industries, LLC
- Swee Har Khor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,552,065
- Issue date Jan 10, 2023
- Fuji Electric Co., Ltd.
- Bin Wan Mat Wan Azha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package comprising a heat dissipation structure and a...
- Patent number 11,538,728
- Issue date Dec 27, 2022
- Mitsubishi Electric Corporation
- Junji Fujino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package structure
- Patent number 11,532,498
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembly
- Patent number 11,508,694
- Issue date Nov 22, 2022
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and structures for increasing the allowable die size in TMV...
- Patent number 11,488,892
- Issue date Nov 1, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Louis W. Nicholls
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module, method of manufacturing connector, and method of...
- Patent number 11,437,340
- Issue date Sep 6, 2022
- Shindengen Electric Manufacturing Co., Ltd.
- Kosuke Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device
- Patent number 11,393,803
- Issue date Jul 19, 2022
- Nichia Corporation
- Kenji Ozeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package
- Patent number 11,387,159
- Issue date Jul 12, 2022
- Industrial Technology Research Institute
- Kuo-Shu Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-sided cooling semiconductor package and method of manufacturi...
- Patent number 11,380,646
- Issue date Jul 5, 2022
- Life-On Semiconductor Corporation
- Chung Hsing Tzu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a semiconductor chip connected in a flip...
- Patent number 11,355,462
- Issue date Jun 7, 2022
- Rohm Co., Ltd.
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost package warpage solution
- Patent number 11,328,937
- Issue date May 10, 2022
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Control of under-fill using a film during fabrication for a dual-si...
- Patent number 11,244,835
- Issue date Feb 8, 2022
- Skyworks Solutions, Inc.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package structure
- Patent number 11,239,103
- Issue date Feb 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device and method of manufacturing the same
- Patent number 11,222,792
- Issue date Jan 11, 2022
- Advanced Semiconductor Engineering, Inc.
- Chang-Lin Yeh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT ASSEMBLIES HAVING LOW SURFACE ENERGY EPOXY BARRI...
- Publication number 20240421116
- Publication date Dec 19, 2024
- Donald Cunningham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240421026
- Publication date Dec 19, 2024
- Siliconware Precision Industries Co., Ltd.
- Chiu-Ling CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING DAM STRUCTURE AND METHOD OF FABRICA...
- Publication number 20240395760
- Publication date Nov 28, 2024
- Samsung Electronics Co., LTD
- Daeyoung Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE
- Publication number 20240395786
- Publication date Nov 28, 2024
- Nichia Corporation.
- Kenji OZEKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240379609
- Publication date Nov 14, 2024
- Siliconware Precision Industries Co., Ltd.
- Wei-Shen HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF CHIPS SEQUENTIALLY S...
- Publication number 20240379481
- Publication date Nov 14, 2024
- Samsung Electronics Co., Ltd.
- Eunsu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240363576
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- WEI-YU CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED INTEGRATED CIRCUIT DEVICES WITH ENHANCED DAM STRUCTURES TH...
- Publication number 20240355777
- Publication date Oct 24, 2024
- Samsung Electronics Co., Ltd.
- SEUNGHYUN BAIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE HAVING MULTIPLE CHIPS
- Publication number 20240347439
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu JENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE HAVING UNDERFILL DAM AND SEMICONDUCTOR PACKAGE INCLUDING...
- Publication number 20240339336
- Publication date Oct 10, 2024
- Samsung Electronics Co., Ltd.
- Eunsu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SYSTEMS AND METHODS FOR SEMICONDUCTOR DEVICES
- Publication number 20240339429
- Publication date Oct 10, 2024
- Avago Technologies International Sales Pte. Limited
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lid Structure With Openings To Alleviate Leakage Of Thermal Interfa...
- Publication number 20240332113
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240321847
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Eunsu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240321708
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Daehun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND VEHICLE-MOUNTED POWER CIRCUIT
- Publication number 20240312895
- Publication date Sep 19, 2024
- Huawei Digital Power Technologies Co., Ltd.
- Huibin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE SUBSTRATE WITH A SMOOTH GROOVE STRADDLING TOP...
- Publication number 20240258210
- Publication date Aug 1, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Bob Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-BARRIER SYSTEM FOR LOW-VOID THERMAL TRANSFER
- Publication number 20240258262
- Publication date Aug 1, 2024
- The Indium Corporation of America
- Milos Lazic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER FOR LIQUID METAL THERMAL INTERFACE MATERIAL IN AN ELECTRONI...
- Publication number 20240250054
- Publication date Jul 25, 2024
- NVIDIA Corporation
- Malcolm GUTENBURG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD
- Publication number 20240234366
- Publication date Jul 11, 2024
- NHK Spring Co., Ltd.
- Ryo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240222309
- Publication date Jul 4, 2024
- Samsung Electronics Co., Ltd.
- Okgyeong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20240213205
- Publication date Jun 27, 2024
- Advanced Semiconductor Engineering, Inc.
- Jung Jui KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH SOLDER MASK
- Publication number 20240170438
- Publication date May 23, 2024
- NXP USA, Inc.
- Aznita Abdul Aziz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240170437
- Publication date May 23, 2024
- Advanced Semiconductor Engineering, Inc.
- Chun Fu KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE MATERIAL HAVING DIFFERENT THICKNESSES IN PACKAGES
- Publication number 20240162166
- Publication date May 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sung-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID-REPELLING COATING FOR UNDERFILL BLEED OUT CONTROL
- Publication number 20240145422
- Publication date May 2, 2024
- Micron Technology, Inc.
- Jungbae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL SHIELD FOR FINE PITCH INTERCONNECTS
- Publication number 20240145420
- Publication date May 2, 2024
- Intel Corporation
- Bok Eng CHEAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD
- Publication number 20240136325
- Publication date Apr 25, 2024
- NHK Spring Co., Ltd.
- Ryo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240088086
- Publication date Mar 14, 2024
- Kabushiki Kaisha Toshiba
- Masatoshi ARAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20240063096
- Publication date Feb 22, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Shigeki TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240055385
- Publication date Feb 15, 2024
- WISTRON NEWEB CORPORATION
- KUO-HUA HSIEH
- H01 - BASIC ELECTRIC ELEMENTS

Flow barriers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for manufacturing a structure

Molded packaging for wide band gap semiconductor devices

Method for manufacturing light emitting devices

Chip package with redistribution structure having multiple chips

Thermal interface material having different thicknesses in packages

Semiconductor packaging substrate fine pitch metal bump and reinfor...

Underfill material flow control for reduced die-to-die spacing in s...

Semiconductor device with a semiconductor chip connected in a flip...

Light emitting device

Chip package

Package structure and manufacturing method thereof

Low cost package warpage solution

Electronic substrate and electronic apparatus

Chip package with redistribution structure having multiple chips

Negative fillet for mounting an integrated device die to a carrier

Semiconductor devices and methods of making the same

Semiconductor device

Semiconductor package comprising a heat dissipation structure and a...

Package-on-package structure

Chip assembly

Methods and structures for increasing the allowable die size in TMV...

Electronic module, method of manufacturing connector, and method of...

Light emitting device

Chip package

Multi-sided cooling semiconductor package and method of manufacturi...

Semiconductor device with a semiconductor chip connected in a flip...

Low cost package warpage solution

Control of under-fill using a film during fabrication for a dual-si...

Package-on-package structure

Semiconductor package device and method of manufacturing the same

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT ASSEMBLIES HAVING LOW SURFACE ENERGY EPOXY BARRI...

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE INCLUDING DAM STRUCTURE AND METHOD OF FABRICA...

LIGHT EMITTING DEVICE

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF CHIPS SEQUENTIALLY S...

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

PACKAGED INTEGRATED CIRCUIT DEVICES WITH ENHANCED DAM STRUCTURES TH...

CHIP PACKAGE HAVING MULTIPLE CHIPS

SUBSTRATE HAVING UNDERFILL DAM AND SEMICONDUCTOR PACKAGE INCLUDING...

PACKAGING SYSTEMS AND METHODS FOR SEMICONDUCTOR DEVICES

Lid Structure With Openings To Alleviate Leakage Of Thermal Interfa...

SEMICONDUCTOR PACKAGE

PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

POWER MODULE AND VEHICLE-MOUNTED POWER CIRCUIT

SEMICONDUCTOR PACKAGE SUBSTRATE WITH A SMOOTH GROOVE STRADDLING TOP...

MULTI-BARRIER SYSTEM FOR LOW-VOID THERMAL TRANSFER

BARRIER FOR LIQUID METAL THERMAL INTERFACE MATERIAL IN AN ELECTRONI...

CIRCUIT BOARD AND MANUFACTURING METHOD

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE PACKAGE

PACKAGE WITH SOLDER MASK

PACKAGE STRUCTURE

THERMAL INTERFACE MATERIAL HAVING DIFFERENT THICKNESSES IN PACKAGES

LIQUID-REPELLING COATING FOR UNDERFILL BLEED OUT CONTROL

LIQUID METAL SHIELD FOR FINE PITCH INTERCONNECTS

CIRCUIT BOARD AND MANUFACTURING METHOD

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME