Flush conductors

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CPC
H05K2201/0376

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/0376Flush conductors

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Module
- Patent number 12,193,144
- Issue date Jan 7, 2025
- Murata Manufacturing Co., Ltd.
- Yukio Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring structure and method of manufacturing the same, semiconducto...
- Patent number 12,144,120
- Issue date Nov 12, 2024
- Dai Nippon Printing Co., Ltd.
- Ryohei Kasai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and semiconductor device
- Patent number 12,133,330
- Issue date Oct 29, 2024
- Shinko Electric Industries Co., Ltd.
- Akihiro Takeuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electroless and electrolytic deposition process for forming traces...
- Patent number 11,653,453
- Issue date May 16, 2023
- CATLAM, LLC
- Kenneth S Bahl
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor package and method for fabricating base for semicondu...
- Patent number 11,469,201
- Issue date Oct 11, 2022
- Mediatek Inc.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer circuit board with traces thicker than a circuit board
- Patent number 11,406,024
- Issue date Aug 2, 2022
- CATLAM, LLC
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring structure and method of manufacturing the same, semiconducto...
- Patent number 11,191,164
- Issue date Nov 30, 2021
- Dai Nippon Printing Co., Ltd.
- Ryohei Kasai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package substrate
- Patent number 11,166,379
- Issue date Nov 2, 2021
- Intel Corporation
- Qinglei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer circuit board with traces thicker than a circuit board...
- Patent number 11,039,540
- Issue date Jun 15, 2021
- CATLAM, LLC
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Producing method of wired circuit board
- Patent number 11,006,530
- Issue date May 11, 2021
- Nitto Denko Corporation
- Keisuke Okumura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package using flip-chip technology
- Patent number 10,991,669
- Issue date Apr 27, 2021
- Mediatek Inc.
- Che-Ya Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board using non-catalytic laminate with catalytic adhesive...
- Patent number 10,959,329
- Issue date Mar 23, 2021
- CATLAM, LLC
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 10,856,421
- Issue date Dec 1, 2020
- Unimicron Technology Corp.
- Ching-Hao Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for forming traces on a catalytic laminate
- Patent number 10,849,233
- Issue date Nov 24, 2020
- CATLAM, LLC
- Kenneth S Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing circuit board
- Patent number 10,813,231
- Issue date Oct 20, 2020
- Unimicron Technology Corp.
- Po-Hsuan Liao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Catalytic circuit board with traces and vias
- Patent number 10,806,029
- Issue date Oct 13, 2020
- CATLAM, LLC
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of double layer circuit board
- Patent number 10,779,418
- Issue date Sep 15, 2020
- Kinsus Interconnect Technology Corp.
- Ting-Hao Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing circuit board
- Patent number 10,729,014
- Issue date Jul 28, 2020
- Unimicron Technology Corp.
- Po-Hsuan Liao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting component and electronic device
- Patent number 10,672,722
- Issue date Jun 2, 2020
- Dai Nippon Printing Co., Ltd.
- Ryohei Kasai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier and method for manufacturing the same
- Patent number 10,643,949
- Issue date May 5, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Hannes Stahr
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing circuit board
- Patent number 10,606,175
- Issue date Mar 31, 2020
- LG Chem, Ltd.
- Yong Goo Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure comprising an inductor and resistor
- Patent number 10,586,774
- Issue date Mar 10, 2020
- Rohm Co., Ltd.
- Takuma Shimoichi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for fabricating base for semicondu...
- Patent number 10,580,747
- Issue date Mar 3, 2020
- Mediatek Inc.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for fabricating base for semicondu...
- Patent number 10,573,615
- Issue date Feb 25, 2020
- Mediatek Inc.
- Tzu-Hung Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and method for fabricating base for semicondu...
- Patent number 10,573,616
- Issue date Feb 25, 2020
- Mediatek Inc.
- Tzu-Hung Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Double layer circuit board
- Patent number 10,440,836
- Issue date Oct 8, 2019
- Kinsus Interconnect Technology Corp.
- Ting-Hao Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of double layer circuit board
- Patent number 10,440,837
- Issue date Oct 8, 2019
- Kinsus Interconnect Technology Corp.
- Ting-Hao Lin
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Component carrier and method for manufacturing the same
- Patent number 10,424,541
- Issue date Sep 24, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Hannes Stahr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light source module, fabrication method therefor, and lighting devi...
- Patent number 10,401,015
- Issue date Sep 3, 2019
- LG Electronics Inc.
- Jaepyo Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package substrate
- Patent number 10,390,438
- Issue date Aug 20, 2019
- Intel Corporation
- Qinglei Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Flexible printed circuit
- Publication number 20240292526
- Publication date Aug 29, 2024
- AAC MICROTECH (CHANGZHOU) CO., LTD.
- Zhigao Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE SUBSTRATE AND CARRIER PLATE WIRING STRUCTURE WITH FILTER...
- Publication number 20230309240
- Publication date Sep 28, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, LIGHT EMITTING DEVICE, AND MANUFACTURING METHOD THER...
- Publication number 20230199964
- Publication date Jun 22, 2023
- Nichia Corporation.
- Yosuke NODA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE
- Publication number 20230130183
- Publication date Apr 27, 2023
- Shinko Electric Industries Co., Ltd.
- Akihiro TAKEUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier With a Magnetic Element and a Manufacturing Method
- Publication number 20220377896
- Publication date Nov 24, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Ivan SALKOVIC
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE
- Publication number 20220007494
- Publication date Jan 6, 2022
- Murata Manufacturing Co., Ltd.
- Yukio YAMAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE USING FLIP-CHIP TECHNOLOGY
- Publication number 20210202425
- Publication date Jul 1, 2021
- MEDIATEK INC.
- Che-Ya CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit Board using non-catalytic laminate with catalytic adhesive...
- Publication number 20200404785
- Publication date Dec 24, 2020
- CATLAM, LLC
- Kenneth S. BAHL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING BASE FOR SEMICONDU...
- Publication number 20200176408
- Publication date Jun 4, 2020
- MEDIATEK INC.
- Tzu-Hung Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING CIRCUIT BOARD
- Publication number 20200037455
- Publication date Jan 30, 2020
- Unimicron Technology Corp.
- Po-Hsuan LIAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Contacting Embedded Electronic Component Via Wiring Structure in a...
- Publication number 20190393155
- Publication date Dec 26, 2019
- Hannes Stahr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF DOUBLE LAYER CIRCUIT BOARD
- Publication number 20190387631
- Publication date Dec 19, 2019
- KINSUS INTERCONNECT TECHNOLOGY CORP.
- Ting-Hao LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Catalytic Laminate Apparatus and Method
- Publication number 20190239349
- Publication date Aug 1, 2019
- SIERRA CIRCUITS, INC.
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FABRICATING PACKAGE STRUCTURE WITH AN EMBEDDED ELECTRONIC...
- Publication number 20170352615
- Publication date Dec 7, 2017
- Siliconware Precision Industries Co., Ltd.
- Shih-Chao Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contacting Embedded Electronic Component Via Wiring Structure in a...
- Publication number 20170330837
- Publication date Nov 16, 2017
- Hannes Stahr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER MICRO-WIRE STRUCTURE
- Publication number 20150268770
- Publication date Sep 24, 2015
- Ronald Steven Cok
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WIRING SUBSTRATE AND METHOD OF MANUFACTURING WIRING SUBSTRATE
- Publication number 20150245478
- Publication date Aug 27, 2015
- Shinko Electric Industries Co., Ltd.
- Satoshi MIYAZAWA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SEMICONDUCTOR SUBSTRATE AND METHOD FOR MAKING THE SAME
- Publication number 20140367837
- Publication date Dec 18, 2014
- Chun-Che LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACHIEVING GREATER PLANARITY BETWEEN UPPER SURFACES OF A LAYER AND A...
- Publication number 20140370705
- Publication date Dec 18, 2014
- GLOBALFOUNDRIES, Inc.
- Xunyuan ZHANG
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140360761
- Publication date Dec 11, 2014
- Hyun Seok Seo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE WITH EMBEDDED FINE-PITCH WIRES AND FABRICAT...
- Publication number 20140352135
- Publication date Dec 4, 2014
- Dyi-Chung HU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE CIRCUIT CONNECTING DEVICE
- Publication number 20140353011
- Publication date Dec 4, 2014
- NANCHANG O-FILM TECH CO., LTD.
- SHENG ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and Device of Manufacturing Printed Circuit Board
- Publication number 20140345913
- Publication date Nov 27, 2014
- Yeong Uk Seo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING A METAL PRINTED CIRCUIT BOARD
- Publication number 20140338192
- Publication date Nov 20, 2014
- Kwang-Choon Chung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140332255
- Publication date Nov 13, 2014
- Chang Woo Yoo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE LAMINAE HAVING THERMAL MANAGEMENT FEATURES AND THERMAL MA...
- Publication number 20140318758
- Publication date Oct 30, 2014
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Ercan Mehmet Dede
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARDS HAVING THERMAL MANAGEMENT FEATURES AND THERMA...
- Publication number 20140318829
- Publication date Oct 30, 2014
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Ercan Mehmet Dede
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SUBSTRATE
- Publication number 20140321087
- Publication date Oct 30, 2014
- Qinglei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140290982
- Publication date Oct 2, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Dong Uk Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE EMBEDDING ELECTRONIC COMPONENT AND METHOD OF MANUFACTURIN...
- Publication number 20140293560
- Publication date Oct 2, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Sang Chul LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Flush conductors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Module

Wiring structure and method of manufacturing the same, semiconducto...

Wiring substrate and semiconductor device

Electroless and electrolytic deposition process for forming traces...

Semiconductor package and method for fabricating base for semicondu...

Multi-layer circuit board with traces thicker than a circuit board

Wiring structure and method of manufacturing the same, semiconducto...

Integrated circuit package substrate

Multi-layer circuit board with traces thicker than a circuit board...

Producing method of wired circuit board

Semiconductor package using flip-chip technology

Circuit board using non-catalytic laminate with catalytic adhesive...

Circuit board

Process for forming traces on a catalytic laminate

Method for manufacturing circuit board

Catalytic circuit board with traces and vias

Manufacturing method of double layer circuit board

Method for manufacturing circuit board

Mounting component and electronic device

Component carrier and method for manufacturing the same

Method of manufacturing circuit board

Structure comprising an inductor and resistor

Semiconductor package and method for fabricating base for semicondu...

Semiconductor package and method for fabricating base for semicondu...

Semiconductor package and method for fabricating base for semicondu...

Double layer circuit board

Manufacturing method of double layer circuit board

Component carrier and method for manufacturing the same

Light source module, fabrication method therefor, and lighting devi...

Integrated circuit package substrate

Patents Applicationslast 30 patents

Flexible printed circuit

CONDUCTIVE SUBSTRATE AND CARRIER PLATE WIRING STRUCTURE WITH FILTER...

CIRCUIT BOARD, LIGHT EMITTING DEVICE, AND MANUFACTURING METHOD THER...

WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE

Component Carrier With a Magnetic Element and a Manufacturing Method

MODULE

SEMICONDUCTOR PACKAGE USING FLIP-CHIP TECHNOLOGY

Circuit Board using non-catalytic laminate with catalytic adhesive...

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING BASE FOR SEMICONDU...

METHOD FOR MANUFACTURING CIRCUIT BOARD

Contacting Embedded Electronic Component Via Wiring Structure in a...

MANUFACTURING METHOD OF DOUBLE LAYER CIRCUIT BOARD

Catalytic Laminate Apparatus and Method

METHOD OF FABRICATING PACKAGE STRUCTURE WITH AN EMBEDDED ELECTRONIC...

Contacting Embedded Electronic Component Via Wiring Structure in a...

MULTI-LAYER MICRO-WIRE STRUCTURE

WIRING SUBSTRATE AND METHOD OF MANUFACTURING WIRING SUBSTRATE

SEMICONDUCTOR SUBSTRATE AND METHOD FOR MAKING THE SAME

ACHIEVING GREATER PLANARITY BETWEEN UPPER SURFACES OF A LAYER AND A...

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

CIRCUIT BOARD STRUCTURE WITH EMBEDDED FINE-PITCH WIRES AND FABRICAT...

FLEXIBLE CIRCUIT CONNECTING DEVICE

Method and Device of Manufacturing Printed Circuit Board

METHOD FOR MANUFACTURING A METAL PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

COMPOSITE LAMINAE HAVING THERMAL MANAGEMENT FEATURES AND THERMAL MA...

PRINTED WIRING BOARDS HAVING THERMAL MANAGEMENT FEATURES AND THERMA...

INTEGRATED CIRCUIT PACKAGE SUBSTRATE

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

SUBSTRATE EMBEDDING ELECTRONIC COMPONENT AND METHOD OF MANUFACTURIN...