for aligning the bonding area

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CPC
H01L2224/03005

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/03005for aligning the bonding area

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device including bond pad with fixing parts fixed ont...
- Patent number 11,876,061
- Issue date Jan 16, 2024
- Mitsubishi Electric Corporation
- Yasuki Aihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with sacrificial anode and method for forming
- Patent number 10,199,339
- Issue date Feb 5, 2019
- NXP USA, INC.
- Sheila F. Chopin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for producing semiconductor device
- Patent number 9,881,851
- Issue date Jan 30, 2018
- TOSHIBA MEMORY CORPORATION
- Kengo Uchida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a semiconductor substrate and a method for pr...
- Patent number 9,673,096
- Issue date Jun 6, 2017
- Infineon Technologies AG
- Joachim Hirschler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with sacrificial anode and passivation laye...
- Patent number 9,412,709
- Issue date Aug 9, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Sheila F. Chopin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 9,076,752
- Issue date Jul 7, 2015
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Toshiyuki Kojima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods to improve lead-free C4 interconnect reliabi...
- Patent number 8,198,133
- Issue date Jun 12, 2012
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS OF FORMING METAL ION BARRIER LAYERS AND RESULTING STRUCTURES
- Publication number 20240355766
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Pin Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING AND TRANSFERRING METHOD FOR DIE PACKAGE STRUCTURES
- Publication number 20240072033
- Publication date Feb 29, 2024
- INGENTEC CORPORATION
- Hsiao Lu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREPARING DISPLAY SUBSTRATE AND DISPLAY SUBSTRATE
- Publication number 20240006421
- Publication date Jan 4, 2024
- HKC Corporation Limited
- ZHONGXIE XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF
- Publication number 20230223369
- Publication date Jul 13, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Zengyan Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220093544
- Publication date Mar 24, 2022
- Mitsubishi Electric Corporation
- Yasuki Aihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH SACRIFICIAL ANODE AND METHOD FOR FORMING
- Publication number 20140346663
- Publication date Nov 27, 2014
- Sheila F. Chopin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140231981
- Publication date Aug 21, 2014
- PANASONIC CORPORATION
- Toshiyuki Kojima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structures and methods to improve lead-free C4 interconnect reliabi...
- Publication number 20110006422
- Publication date Jan 13, 2011
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS

for aligning the bonding area

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device including bond pad with fixing parts fixed ont...

Semiconductor structure with sacrificial anode and method for forming

Semiconductor device and method for producing semiconductor device

Method for processing a semiconductor substrate and a method for pr...

Semiconductor structure with sacrificial anode and passivation laye...

Semiconductor device and method for manufacturing the same

Structures and methods to improve lead-free C4 interconnect reliabi...

Patents Applicationslast 30 patents

METHODS OF FORMING METAL ION BARRIER LAYERS AND RESULTING STRUCTURES

BONDING AND TRANSFERRING METHOD FOR DIE PACKAGE STRUCTURES

METHOD FOR PREPARING DISPLAY SUBSTRATE AND DISPLAY SUBSTRATE

SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF

SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURE WITH SACRIFICIAL ANODE AND METHOD FOR FORMING

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Structures and methods to improve lead-free C4 interconnect reliabi...