for aligning the bump connector

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H01L2224/11015

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/11015for aligning the bump connector

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Patents Grantslast 30 patents

Information Patent Grant
Interconnect structure for semiconductor with ultra-fine pitch and...
- Patent number 11,742,316
- Issue date Aug 29, 2023
- GUANGDONG UNIVERSITY OF TECHNOLOGY
- Yu Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including metal holder and method of manufactu...
- Patent number 11,322,468
- Issue date May 3, 2022
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged microelectronic devices having stacked interconnect elemen...
- Patent number 11,217,556
- Issue date Jan 4, 2022
- Micron Technology, Inc.
- Young Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for bump planarity control
- Patent number 11,145,612
- Issue date Oct 12, 2021
- Texas Instruments Incorporated
- Rafael Jose Lizares Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanisms for forming hybrid bonding structures with elongated bumps
- Patent number 10,867,957
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor device with bump stop structure
- Patent number 10,269,749
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanisms for forming hybrid bonding structures with elongated bumps
- Patent number 10,163,846
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged microelectronic devices having stacked interconnect elemen...
- Patent number 10,083,931
- Issue date Sep 25, 2018
- Micron Technology, Inc.
- Young Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating redistribution circuit structure
- Patent number 10,074,623
- Issue date Sep 11, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tzung-Hui Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 10,037,959
- Issue date Jul 31, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chia-Chun Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 9,953,966
- Issue date Apr 24, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chia-Chun Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package, redistribution circuit structure, and m...
- Patent number 9,899,342
- Issue date Feb 20, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tzung-Hui Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment structures and methods of forming same
- Patent number 9,646,944
- Issue date May 9, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin wafer handling and known good die test method
- Patent number 9,601,398
- Issue date Mar 21, 2017
- Invensas Corporation
- Charles G. Woychik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanisms for forming hybrid bonding structures with elongated bumps
- Patent number 9,559,071
- Issue date Jan 31, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact test structure and method
- Patent number 9,368,417
- Issue date Jun 14, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-alignment structure for wafer level chip scale package
- Patent number 9,318,456
- Issue date Apr 19, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 9,202,804
- Issue date Dec 1, 2015
- Sony Corporation
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment structures for integrated-circuit packaging
- Patent number 9,111,943
- Issue date Aug 18, 2015
- Oracle International Corporation
- Eugene M. Chow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 8,962,440
- Issue date Feb 24, 2015
- Sony Corporation
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-speed memory package
- Patent number 8,063,481
- Issue date Nov 22, 2011
- Rambus Inc.
- Ming Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for mutually connecting substrates, flip chip mounting body,...
- Patent number 7,919,357
- Issue date Apr 5, 2011
- Panasonic Corporation
- Susumu Sawada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaged microelectronic devices and methods for manufacturing pack...
- Patent number 7,749,882
- Issue date Jul 6, 2010
- Micron Technology, Inc.
- Young Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an integrated circuit
- Patent number 7,579,268
- Issue date Aug 25, 2009
- Infineon Technologies AG
- Horst Theuss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating self-assembled electrical interconnections
- Patent number 7,504,331
- Issue date Mar 17, 2009
- Palo Alto Research Center Incorporated
- David K. Fork
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for producing electrical-connections on a semiconductor pac...
- Patent number 6,528,407
- Issue date Mar 4, 2003
- STMicroelectronics S.A.
- Luc Petit
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing connection electrodes
- Patent number 5,034,245
- Issue date Jul 23, 1991
- Sharp Kabushiki Kaisha
- Hiroshi Matsubara
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
SOLDER CREEP LIMITING RIGID SPACER FOR STACKED DIE C4 PACKAGING
- Publication number 20230058638
- Publication date Feb 23, 2023
- International Business Machines Corporation
- David Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE FOR SEMICONDUCTOR WITH ULTRA-FINE PITCH AND...
- Publication number 20220415846
- Publication date Dec 29, 2022
- Guangdong University of Technology
- Yu ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MICROELECTRONIC DEVICES HAVING STACKED INTERCONNECT ELEMEN...
- Publication number 20220122938
- Publication date Apr 21, 2022
- Micron Technology, Inc.
- Young Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210335742
- Publication date Oct 28, 2021
- Advanced Semiconductor Engineering, Inc.
- You-Lung YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MICROELECTRONIC DEVICES HAVING STACKED INTERCONNECT ELEMEN...
- Publication number 20180358324
- Publication date Dec 13, 2018
- Micron Technology, Inc.
- Young Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING REDISTRIBUTION CIRCUIT STRUCTURE
- Publication number 20180151521
- Publication date May 31, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tzung-Hui Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED FAN-OUT PACKAGE, REDISTRIBUTION CIRCUIT STRUCTURE, AND M...
- Publication number 20170271283
- Publication date Sep 21, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tzung-Hui Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Alignment Structures and Methods of Forming Same
- Publication number 20160268224
- Publication date Sep 15, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACK...
- Publication number 20160086910
- Publication date Mar 24, 2016
- Micron Technology, Inc.
- Young Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Test Structure and Method
- Publication number 20150380329
- Publication date Dec 31, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD
- Publication number 20150262846
- Publication date Sep 17, 2015
- Taiwan Semiconductor Manufacturing Co., LTD
- Li-Guo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNMENT STRUCTURE FOR WAFER LEVEL CHIP SCALE PACKAGE
- Publication number 20150228599
- Publication date Aug 13, 2015
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thin Wafer Handling and Known Good Die Test Method
- Publication number 20150014688
- Publication date Jan 15, 2015
- Invensas Corporation
- Charles G. Woychik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140357025
- Publication date Dec 4, 2014
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP MODULE WITH SELF-POPULATING POSITIVE FEATURES
- Publication number 20140264854
- Publication date Sep 18, 2014
- Oracle International Corporation
- Hiren D. Thacker
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THIN WAFER HANDLING AND KNOWN GOOD DIE TEST METHOD
- Publication number 20140054763
- Publication date Feb 27, 2014
- Invensas Corporation
- Charles G. Woychik
- G01 - MEASURING TESTING
Information Patent Application
Contact Test Structure and Method
- Publication number 20130240883
- Publication date Sep 19, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SEMICONDUCTOR DE...
- Publication number 20120199981
- Publication date Aug 9, 2012
- Se-young Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20120153462
- Publication date Jun 21, 2012
- SONY CORPORATION
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALIGNMENT STRUCTURES FOR INTEGRATED-CIRCUIT PACKAGING
- Publication number 20110227200
- Publication date Sep 22, 2011
- ORACLE INTERNATIONAL CORPORATION
- Eugene M. Chow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High-Speed Memory Package
- Publication number 20100320602
- Publication date Dec 23, 2010
- Ming LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACK...
- Publication number 20100237494
- Publication date Sep 23, 2010
- Micron Technology, Inc.
- Young Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MUTUALLY CONNECTING SUBSTRATES, FLIP CHIP MOUNTING BODY,...
- Publication number 20100001411
- Publication date Jan 7, 2010
- Susumu SAWADA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Packaged microelectronic devices and methods for manufacturing pack...
- Publication number 20080050901
- Publication date Feb 28, 2008
- Micron Technology, Inc.
- Young Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing an Integrated Circuit
- Publication number 20070287225
- Publication date Dec 13, 2007
- INFINEON TECHNOLOGIES AG
- Horst Theuss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of fabricating self-assembled electrical interconnections
- Publication number 20070023908
- Publication date Feb 1, 2007
- Palo Alto Research Center Incorporated
- David K. Fork
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Microparticle arrangement film, electrical connection film, electri...
- Publication number 20040106334
- Publication date Jun 3, 2004
- Tatsuo Suzuki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

for aligning the bump connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Interconnect structure for semiconductor with ultra-fine pitch and...

Semiconductor device including metal holder and method of manufactu...

Packaged microelectronic devices having stacked interconnect elemen...

Methods for bump planarity control

Mechanisms for forming hybrid bonding structures with elongated bumps

Method of forming a semiconductor device with bump stop structure

Mechanisms for forming hybrid bonding structures with elongated bumps

Packaged microelectronic devices having stacked interconnect elemen...

Method of fabricating redistribution circuit structure

Semiconductor structure and manufacturing method thereof

Semiconductor device and method of forming the same

Integrated fan-out package, redistribution circuit structure, and m...

Alignment structures and methods of forming same

Thin wafer handling and known good die test method

Mechanisms for forming hybrid bonding structures with elongated bumps

Contact test structure and method

Self-alignment structure for wafer level chip scale package

Semiconductor device and method of manufacturing semiconductor device

Alignment structures for integrated-circuit packaging

Semiconductor device and method of manufacturing semiconductor device

High-speed memory package

Method for mutually connecting substrates, flip chip mounting body,...

Packaged microelectronic devices and methods for manufacturing pack...

Method of manufacturing an integrated circuit

Method of fabricating self-assembled electrical interconnections

Process for producing electrical-connections on a semiconductor pac...

Method of producing connection electrodes

Patents Applicationslast 30 patents

SOLDER CREEP LIMITING RIGID SPACER FOR STACKED DIE C4 PACKAGING

INTERCONNECT STRUCTURE FOR SEMICONDUCTOR WITH ULTRA-FINE PITCH AND...

PACKAGED MICROELECTRONIC DEVICES HAVING STACKED INTERCONNECT ELEMEN...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

PACKAGED MICROELECTRONIC DEVICES HAVING STACKED INTERCONNECT ELEMEN...

METHOD OF FABRICATING REDISTRIBUTION CIRCUIT STRUCTURE

INTEGRATED FAN-OUT PACKAGE, REDISTRIBUTION CIRCUIT STRUCTURE, AND M...

Alignment Structures and Methods of Forming Same

PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACK...

Contact Test Structure and Method

PACKAGE STRUCTURE AND MANUFACTURING METHOD

SELF-ALIGNMENT STRUCTURE FOR WAFER LEVEL CHIP SCALE PACKAGE

Thin Wafer Handling and Known Good Die Test Method

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

MULTI-CHIP MODULE WITH SELF-POPULATING POSITIVE FEATURES

THIN WAFER HANDLING AND KNOWN GOOD DIE TEST METHOD

Contact Test Structure and Method

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SEMICONDUCTOR DE...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

ALIGNMENT STRUCTURES FOR INTEGRATED-CIRCUIT PACKAGING

High-Speed Memory Package

PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACK...

METHOD FOR MUTUALLY CONNECTING SUBSTRATES, FLIP CHIP MOUNTING BODY,...

Packaged microelectronic devices and methods for manufacturing pack...

Method of Manufacturing an Integrated Circuit

Method of fabricating self-assembled electrical interconnections

Microparticle arrangement film, electrical connection film, electri...