for aligning the layer connector

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H01L2224/27005

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/27005for aligning the layer connector

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Patents Grantslast 30 patents

Information Patent Grant
Anisotropic conductive film and method of producing the same
- Patent number 11,784,154
- Issue date Oct 10, 2023
- Dexerials Corporation
- Seiichiro Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film and method of producing the same
- Patent number 11,710,716
- Issue date Jul 25, 2023
- Dexerials Corporation
- Seiichiro Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film and method of producing the same
- Patent number 11,404,391
- Issue date Aug 2, 2022
- Dexerials Corporation
- Seiichiro Shinohara
- B32 - LAYERED PRODUCTS
Information Patent Grant
Anisotropic conductive film and method of producing the same
- Patent number 11,348,891
- Issue date May 31, 2022
- Dexerials Corporation
- Seiichiro Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor laser device
- Patent number 9,780,523
- Issue date Oct 3, 2017
- Nichia Corporation
- Hideyuki Fujimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a material-bonding connection between a semico...
- Patent number 9,659,793
- Issue date May 23, 2017
- Infineon Technologies AG
- Nicolas Heuck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a wafer and wafer structure
- Patent number 9,589,880
- Issue date Mar 7, 2017
- Infineon Technologies AG
- Srinivasa Reddy Yeduru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of stacking a plurality of dies to form a stacked semiconduc...
- Patent number 9,290,377
- Issue date Mar 22, 2016
- STMicroelectronics (Malta) Ltd.
- Conrad Cachia
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and method of forming guard ring around conduc...
- Patent number 9,257,382
- Issue date Feb 9, 2016
- STATS ChipPAC, Ltd.
- Duk Ju Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabricating method of MPS-C2 package utilized form a flip-chip carrier
- Patent number 8,980,694
- Issue date Mar 17, 2015
- Powertech Technology, Inc.
- Shou-Chian Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of forming guard ring around conduc...
- Patent number 8,558,389
- Issue date Oct 15, 2013
- STATS ChipPAC, Ltd.
- Duk Ju Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and fabrication method for the same
- Patent number 7,235,425
- Issue date Jun 26, 2007
- Kabushiki Kaisha Toshiba
- Hideo Numata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for aligning and soldering multiple electrode pedestals t...
- Patent number 4,194,668
- Issue date Mar 25, 1980
- BBC Brown Boveri & Company Limited
- Altan Akyurek
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
REDISTRIBUTION LAYER METALLIC LAYOUT STRUCTURE AND METHOD WITH WARP...
- Publication number 20240404853
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Dian-Hau CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY MODULE INCLUDING BONDING MEMBER CONNECTING BETWEEN LIGHT EM...
- Publication number 20240079365
- Publication date Mar 7, 2024
- Samsung Electronics Co., Ltd.
- Seungryong HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATES WITH SPACERS, INCLUDING SUBSTRATES WITH SOLDER RESIST SP...
- Publication number 20240071975
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Bong Woo Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND MANUFACTURING METHOD THEREOF
- Publication number 20210280548
- Publication date Sep 9, 2021
- DEXERIALS CORPORATION
- Kenichi SARUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND MANUFACTURING METHOD THEREOF
- Publication number 20190096844
- Publication date Mar 28, 2019
- DEXERIALS CORPORATION
- Kenichi SARUYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND MANUFACTURING METHOD THEREOF
- Publication number 20190067234
- Publication date Feb 28, 2019
- DEXERIALS CORPORATION
- Kenichi SARUYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device and Method of Forming Guard Ring Around Conduc...
- Publication number 20130299998
- Publication date Nov 14, 2013
- Duk Ju Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Guard Ring Around Conduc...
- Publication number 20130147055
- Publication date Jun 13, 2013
- STATS ChipPAC, Ltd.
- Duk Ju Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP CARRIER AND FABRICATING METHOD OF MPS-C2 PACKAGE UTILIZED...
- Publication number 20130068514
- Publication date Mar 21, 2013
- Shou-Chian HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and fabrication method for the same
- Publication number 20050184373
- Publication date Aug 25, 2005
- Hideo Numata
- H01 - BASIC ELECTRIC ELEMENTS

for aligning the layer connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Anisotropic conductive film and method of producing the same

Anisotropic conductive film and method of producing the same

Anisotropic conductive film and method of producing the same

Anisotropic conductive film and method of producing the same

Semiconductor laser device

Method for producing a material-bonding connection between a semico...

Method for processing a wafer and wafer structure

Method of stacking a plurality of dies to form a stacked semiconduc...

Semiconductor device and method of forming guard ring around conduc...

Fabricating method of MPS-C2 package utilized form a flip-chip carrier

Semiconductor device and method of forming guard ring around conduc...

Semiconductor device and fabrication method for the same

Apparatus for aligning and soldering multiple electrode pedestals t...

Patents Applicationslast 30 patents

REDISTRIBUTION LAYER METALLIC LAYOUT STRUCTURE AND METHOD WITH WARP...

DISPLAY MODULE INCLUDING BONDING MEMBER CONNECTING BETWEEN LIGHT EM...

SUBSTRATES WITH SPACERS, INCLUDING SUBSTRATES WITH SOLDER RESIST SP...

ANISOTROPIC CONDUCTIVE FILM AND MANUFACTURING METHOD THEREOF

ANISOTROPIC CONDUCTIVE FILM AND MANUFACTURING METHOD THEREOF

ANISOTROPIC CONDUCTIVE FILM AND MANUFACTURING METHOD THEREOF

Semiconductor Device and Method of Forming Guard Ring Around Conduc...

Semiconductor Device and Method of Forming Guard Ring Around Conduc...

FLIP-CHIP CARRIER AND FABRICATING METHOD OF MPS-C2 PACKAGE UTILIZED...

Semiconductor device and fabrication method for the same