for aligning the layer connector

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H01L2224/27005

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/27005for aligning the layer connector

Industries

Patents Grantslast 30 patents

Information Patent Grant
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Information Patent Grant
Anisotropic conductive film and method of producing the same
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- Issue date Jul 25, 2023
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Information Patent Grant
Anisotropic conductive film and method of producing the same
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- Issue date Aug 2, 2022
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- B32 - LAYERED PRODUCTS
Information Patent Grant
Anisotropic conductive film and method of producing the same
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- Issue date May 31, 2022
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Information Patent Grant
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Information Patent Grant
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- Issue date May 23, 2017
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Information Patent Grant
Method for processing a wafer and wafer structure
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- Issue date Mar 7, 2017
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of stacking a plurality of dies to form a stacked semiconduc...
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- Issue date Mar 22, 2016
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Information Patent Grant
Semiconductor device and method of forming guard ring around conduc...
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- Issue date Feb 9, 2016
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Information Patent Grant
Fabricating method of MPS-C2 package utilized form a flip-chip carrier
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- Issue date Mar 17, 2015
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Information Patent Grant
Semiconductor device and method of forming guard ring around conduc...
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- Issue date Oct 15, 2013
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Information Patent Grant
Semiconductor device and fabrication method for the same
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- Issue date Jun 26, 2007
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Information Patent Grant
Apparatus for aligning and soldering multiple electrode pedestals t...
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- Issue date Mar 25, 1980
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Patents Applicationslast 30 patents

Information Patent Application
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- Dian-Hau CHEN
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Information Patent Application
DISPLAY MODULE INCLUDING BONDING MEMBER CONNECTING BETWEEN LIGHT EM...
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- Seungryong HAN
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SUBSTRATES WITH SPACERS, INCLUDING SUBSTRATES WITH SOLDER RESIST SP...
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- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Bong Woo Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND MANUFACTURING METHOD THEREOF
- Publication number 20210280548
- Publication date Sep 9, 2021
- DEXERIALS CORPORATION
- Kenichi SARUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND MANUFACTURING METHOD THEREOF
- Publication number 20190096844
- Publication date Mar 28, 2019
- DEXERIALS CORPORATION
- Kenichi SARUYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND MANUFACTURING METHOD THEREOF
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- Publication date Feb 28, 2019
- DEXERIALS CORPORATION
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FLIP-CHIP CARRIER AND FABRICATING METHOD OF MPS-C2 PACKAGE UTILIZED...
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for aligning the layer connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Anisotropic conductive film and method of producing the same

Anisotropic conductive film and method of producing the same

Anisotropic conductive film and method of producing the same

Anisotropic conductive film and method of producing the same

Semiconductor laser device

Method for producing a material-bonding connection between a semico...

Method for processing a wafer and wafer structure

Method of stacking a plurality of dies to form a stacked semiconduc...

Semiconductor device and method of forming guard ring around conduc...

Fabricating method of MPS-C2 package utilized form a flip-chip carrier

Semiconductor device and method of forming guard ring around conduc...

Semiconductor device and fabrication method for the same

Apparatus for aligning and soldering multiple electrode pedestals t...

Patents Applicationslast 30 patents

REDISTRIBUTION LAYER METALLIC LAYOUT STRUCTURE AND METHOD WITH WARP...

DISPLAY MODULE INCLUDING BONDING MEMBER CONNECTING BETWEEN LIGHT EM...

SUBSTRATES WITH SPACERS, INCLUDING SUBSTRATES WITH SOLDER RESIST SP...

ANISOTROPIC CONDUCTIVE FILM AND MANUFACTURING METHOD THEREOF

ANISOTROPIC CONDUCTIVE FILM AND MANUFACTURING METHOD THEREOF

ANISOTROPIC CONDUCTIVE FILM AND MANUFACTURING METHOD THEREOF

Semiconductor Device and Method of Forming Guard Ring Around Conduc...

Semiconductor Device and Method of Forming Guard Ring Around Conduc...

FLIP-CHIP CARRIER AND FABRICATING METHOD OF MPS-C2 PACKAGE UTILIZED...

Semiconductor device and fabrication method for the same