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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00

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Industries

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Patents Grantslast 30 patents

Information Patent Grant
Package structure and method of fabricating the same
- Patent number 12,211,802
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jhih-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical measurement tool containing chromatic aberration enhancemen...
- Patent number 12,211,724
- Issue date Jan 28, 2025
- SanDisk Technologies LLC
- Michio Ohi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Memory devices
- Patent number 12,207,473
- Issue date Jan 21, 2025
- Lodestar Licensing Group LLC
- Umberto Maria Meotto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor devices and structures with metal layers
- Patent number 12,199,093
- Issue date Jan 14, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having integral alignment marks with decouplin...
- Patent number 12,191,258
- Issue date Jan 7, 2025
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated aligned stealth laser for wafer edge trimming process
- Patent number 12,183,571
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Tung Wu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and electronic device including the same
- Patent number 12,176,296
- Issue date Dec 24, 2024
- Samsung Electronics Co., Ltd.
- Jung Eun Koo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Metal-free frame design for silicon bridges for semiconductor packages
- Patent number 12,170,253
- Issue date Dec 17, 2024
- Intel Corporation
- Dae-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Voltage contrast metrology mark
- Patent number 12,169,366
- Issue date Dec 17, 2024
- ASML Netherlands B.V.
- Cyrus Emil Tabery
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Frame reveals with maskless lithography in the manufacture of integ...
- Patent number 12,165,987
- Issue date Dec 10, 2024
- Intel Corporation
- Grant Kloster
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device including alignment pattern
- Patent number 12,159,842
- Issue date Dec 3, 2024
- Samsung Display Co., Ltd.
- Seungchan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for aligned stitching
- Patent number 12,154,862
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting device and mounting method
- Patent number 12,154,811
- Issue date Nov 26, 2024
- Toray Engineering Co., Ltd.
- Yasushi Tamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for producing a 3D semiconductor memory device and structure
- Patent number 12,154,817
- Issue date Nov 26, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shift control method in manufacture of semiconductor device
- Patent number 12,148,733
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device and method of manufacturing the same
- Patent number 12,148,709
- Issue date Nov 19, 2024
- SK hynix Inc.
- Yoo Hyun Noh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing electronic device
- Patent number 12,148,630
- Issue date Nov 19, 2024
- Innolux Corporation
- Yeong-E Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Staircase etch control in forming three-dimensional memory device
- Patent number 12,142,575
- Issue date Nov 12, 2024
- Yangtza Memory Technologies Co., Ltd.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 12,142,576
- Issue date Nov 12, 2024
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacture
- Patent number 12,142,574
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yao-Te Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Guard ring design enabling in-line testing of silicon bridges for s...
- Patent number 12,142,553
- Issue date Nov 12, 2024
- Intel Corporation
- Arnab Sarkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring structure and method of manufacturing the same, semiconducto...
- Patent number 12,144,120
- Issue date Nov 12, 2024
- Dai Nippon Printing Co., Ltd.
- Ryohei Kasai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with single-crystal layers
- Patent number 12,136,562
- Issue date Nov 5, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sonar sensor in processing chamber
- Patent number 12,136,556
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Lee-Chuan Tseng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device structure including overlay mark structure
- Patent number 12,125,800
- Issue date Oct 22, 2024
- NANYA TECHNOLOGY CORPORATION
- Chun-Yen Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers and memory...
- Patent number 12,125,737
- Issue date Oct 22, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Apparatus and methods for determining wafer characters
- Patent number 12,125,730
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Da Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-substrate via structure and method of manufacture
- Patent number 12,119,294
- Issue date Oct 15, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of determining overlay error during semiconductor fabrication
- Patent number 12,117,735
- Issue date Oct 15, 2024
- NANYA TECHNOLOGY CORPORATION
- Kai Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated self-aligned assembly
- Patent number 12,119,307
- Issue date Oct 15, 2024
- Rockley Photonics Limited
- Chia-Te Chou
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250038122
- Publication date Jan 30, 2025
- Samsung Electronics Co., Ltd.
- Junghoon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250038123
- Publication date Jan 30, 2025
- SK HYNIX INC.
- Yoo Hyun NOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, SEMICONDUCTO...
- Publication number 20250031315
- Publication date Jan 23, 2025
- DAI NIPPON PRINTING CO., LTD.
- Ryohei KASAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Seal Ring Structure with Alignment Mark
- Publication number 20250029880
- Publication date Jan 23, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ling Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GUARD RING DESIGN ENABLING IN-LINE TESTING OF SILICON BRIDGES FOR S...
- Publication number 20250029908
- Publication date Jan 23, 2025
- Intel Corporation
- Arnab SARKAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR...
- Publication number 20250022807
- Publication date Jan 16, 2025
- SK HYNIX INC.
- Joon Seuk LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT, SEMICONDUCTOR DEVICE AND METHOD F...
- Publication number 20250015012
- Publication date Jan 9, 2025
- Macronix International Co., Ltd.
- Chin-Cheng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250014981
- Publication date Jan 9, 2025
- Fuji Electric Co., Ltd.
- Kensuke MATSUZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FABRICATING METHOD THEREOF
- Publication number 20250015010
- Publication date Jan 9, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Wang Kuo LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE EMBEDDED PACKAGE AND METHOD OF FORMING A DIE EMBEDDED PACKAGE
- Publication number 20250015008
- Publication date Jan 9, 2025
- INFINEON TECHNOLOGIES AG
- Mahadi-Ul HASSAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SLIT FIDUCIALS FOR INTEGRATED CIRCUIT DEVICE ALIGNMENT
- Publication number 20250006651
- Publication date Jan 2, 2025
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOALIGNMENT OF SEMICONDUCTOR STRUCTURES USING AN OPAQUE HARDMASK
- Publication number 20250006655
- Publication date Jan 2, 2025
- Micron Technology, Inc.
- Shruthi Kumara Vadivel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING INTEGRAL ALIGNMENT MARKS WITH DECOUPLIN...
- Publication number 20250006657
- Publication date Jan 2, 2025
- NANYA TECHNOLOGY CORPORATION
- SHING-YIH SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL FUNCTIONING ALIGNMENT AND ETCH BIAS STRUCTURES
- Publication number 20250006649
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Frank Robert Libsch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...
- Publication number 20250006544
- Publication date Jan 2, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
FIDUCIALS WITH UNDERLYING DUMMY METALLIZATION FOR INTEGRATED CIRCUI...
- Publication number 20250006652
- Publication date Jan 2, 2025
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING ARCHITECTURE FOR WAFER-SCALE KNOWN-GOOD-DIE HYBRID BONDING
- Publication number 20250006678
- Publication date Jan 2, 2025
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIDUCIALS WITH ASSOCIATED LOW-DENSITY METAL ZONES
- Publication number 20250006653
- Publication date Jan 2, 2025
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE INCLUDING OVERLAY MARK STRUCTURE
- Publication number 20250006656
- Publication date Jan 2, 2025
- NANYA TECHNOLOGY CORPORATION
- CHUN-YEN WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH DECOUPLING UNIT
- Publication number 20250006627
- Publication date Jan 2, 2025
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20240429218
- Publication date Dec 26, 2024
- SAMSUNG DISPLAY CO., LTD.
- OUKJAE LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240429176
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- JU-IL CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240429198
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Jing Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH SINGLE-CRYSTAL LAYERS
- Publication number 20240429086
- Publication date Dec 26, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED PACKAGING FOR WIDE BAND GAP SEMICONDUCTOR DEVICES
- Publication number 20240429136
- Publication date Dec 26, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Maria Clemens Ypil QUINONES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLUGGABLE INTERCONNECTS USING GLASS CORES OF INTEGRATED CIRCUIT PAC...
- Publication number 20240421062
- Publication date Dec 19, 2024
- Intel Corporation
- Tolga Acikalin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240413144
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- Sangcheon PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR STACKING SUBSTRATES AND METHOD FOR THE SAME
- Publication number 20240413093
- Publication date Dec 12, 2024
- Nikon Corporation
- Isao Sugaya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR III-V/SILICON HYBRID INTEGRATION
- Publication number 20240402427
- Publication date Dec 5, 2024
- ROCKLEY PHOTONICS LIMITED
- Guomin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE AND METHOD OF INCREASING PIN ALIGNMENT A...
- Publication number 20240404961
- Publication date Dec 5, 2024
- INFINEON TECHNOLOGIES AG
- Alexander Herbrandt
- H01 - BASIC ELECTRIC ELEMENTS

for alignment

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package structure and method of fabricating the same

Optical measurement tool containing chromatic aberration enhancemen...

Memory devices

3D semiconductor devices and structures with metal layers

Semiconductor device having integral alignment marks with decouplin...

Integrated aligned stealth laser for wafer edge trimming process

Semiconductor package and electronic device including the same

Metal-free frame design for silicon bridges for semiconductor packages

Voltage contrast metrology mark

Frame reveals with maskless lithography in the manufacture of integ...

Display device including alignment pattern

System and method for aligned stitching

Mounting device and mounting method

Methods for producing a 3D semiconductor memory device and structure

Shift control method in manufacture of semiconductor device

Memory device and method of manufacturing the same

Method for manufacturing electronic device

Staircase etch control in forming three-dimensional memory device

Semiconductor package structure and method for manufacturing the same

Semiconductor devices and methods of manufacture

Guard ring design enabling in-line testing of silicon bridges for s...

Wiring structure and method of manufacturing the same, semiconducto...

3D semiconductor device and structure with single-crystal layers

Sonar sensor in processing chamber

Semiconductor device structure including overlay mark structure

3D semiconductor device and structure with metal layers and memory...

Apparatus and methods for determining wafer characters

Through-substrate via structure and method of manufacture

Method of determining overlay error during semiconductor fabrication

Integrated self-aligned assembly

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME

WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, SEMICONDUCTO...

Seal Ring Structure with Alignment Mark

GUARD RING DESIGN ENABLING IN-LINE TESTING OF SILICON BRIDGES FOR S...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR...

SEMICONDUCTOR INTEGRATED CIRCUIT, SEMICONDUCTOR DEVICE AND METHOD F...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURE AND FABRICATING METHOD THEREOF

DIE EMBEDDED PACKAGE AND METHOD OF FORMING A DIE EMBEDDED PACKAGE

SLIT FIDUCIALS FOR INTEGRATED CIRCUIT DEVICE ALIGNMENT

PHOTOALIGNMENT OF SEMICONDUCTOR STRUCTURES USING AN OPAQUE HARDMASK

SEMICONDUCTOR DEVICE HAVING INTEGRAL ALIGNMENT MARKS WITH DECOUPLIN...

DUAL FUNCTIONING ALIGNMENT AND ETCH BIAS STRUCTURES

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...

FIDUCIALS WITH UNDERLYING DUMMY METALLIZATION FOR INTEGRATED CIRCUI...

PACKAGING ARCHITECTURE FOR WAFER-SCALE KNOWN-GOOD-DIE HYBRID BONDING

FIDUCIALS WITH ASSOCIATED LOW-DENSITY METAL ZONES

SEMICONDUCTOR DEVICE STRUCTURE INCLUDING OVERLAY MARK STRUCTURE

SEMICONDUCTOR DEVICE WITH DECOUPLING UNIT

DISPLAY DEVICE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH SINGLE-CRYSTAL LAYERS

MOLDED PACKAGING FOR WIDE BAND GAP SEMICONDUCTOR DEVICES

PLUGGABLE INTERCONNECTS USING GLASS CORES OF INTEGRATED CIRCUIT PAC...

SEMICONDUCTOR PACKAGE

APPARATUS FOR STACKING SUBSTRATES AND METHOD FOR THE SAME

METHOD FOR III-V/SILICON HYBRID INTEGRATION

POWER SEMICONDUCTOR MODULE AND METHOD OF INCREASING PIN ALIGNMENT A...