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H01L2223/54426

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00

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H01L2223/54426for alignment

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and electronic device including the same
- Patent number 12,176,296
- Issue date Dec 24, 2024
- Samsung Electronics Co., Ltd.
- Jung Eun Koo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Metal-free frame design for silicon bridges for semiconductor packages
- Patent number 12,170,253
- Issue date Dec 17, 2024
- Intel Corporation
- Dae-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Voltage contrast metrology mark
- Patent number 12,169,366
- Issue date Dec 17, 2024
- ASML Netherlands B.V.
- Cyrus Emil Tabery
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Frame reveals with maskless lithography in the manufacture of integ...
- Patent number 12,165,987
- Issue date Dec 10, 2024
- Intel Corporation
- Grant Kloster
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device including alignment pattern
- Patent number 12,159,842
- Issue date Dec 3, 2024
- Samsung Display Co., Ltd.
- Seungchan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for aligned stitching
- Patent number 12,154,862
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting device and mounting method
- Patent number 12,154,811
- Issue date Nov 26, 2024
- Toray Engineering Co., Ltd.
- Yasushi Tamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for producing a 3D semiconductor memory device and structure
- Patent number 12,154,817
- Issue date Nov 26, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shift control method in manufacture of semiconductor device
- Patent number 12,148,733
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device and method of manufacturing the same
- Patent number 12,148,709
- Issue date Nov 19, 2024
- SK hynix Inc.
- Yoo Hyun Noh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing electronic device
- Patent number 12,148,630
- Issue date Nov 19, 2024
- Innolux Corporation
- Yeong-E Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Staircase etch control in forming three-dimensional memory device
- Patent number 12,142,575
- Issue date Nov 12, 2024
- Yangtza Memory Technologies Co., Ltd.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 12,142,576
- Issue date Nov 12, 2024
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacture
- Patent number 12,142,574
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yao-Te Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Guard ring design enabling in-line testing of silicon bridges for s...
- Patent number 12,142,553
- Issue date Nov 12, 2024
- Intel Corporation
- Arnab Sarkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring structure and method of manufacturing the same, semiconducto...
- Patent number 12,144,120
- Issue date Nov 12, 2024
- Dai Nippon Printing Co., Ltd.
- Ryohei Kasai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with single-crystal layers
- Patent number 12,136,562
- Issue date Nov 5, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sonar sensor in processing chamber
- Patent number 12,136,556
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Lee-Chuan Tseng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device structure including overlay mark structure
- Patent number 12,125,800
- Issue date Oct 22, 2024
- NANYA TECHNOLOGY CORPORATION
- Chun-Yen Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers and memory...
- Patent number 12,125,737
- Issue date Oct 22, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Apparatus and methods for determining wafer characters
- Patent number 12,125,730
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Da Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-substrate via structure and method of manufacture
- Patent number 12,119,294
- Issue date Oct 15, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of determining overlay error during semiconductor fabrication
- Patent number 12,117,735
- Issue date Oct 15, 2024
- NANYA TECHNOLOGY CORPORATION
- Kai Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated self-aligned assembly
- Patent number 12,119,307
- Issue date Oct 15, 2024
- Rockley Photonics Limited
- Chia-Te Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages, packaging methods, and packaged semi...
- Patent number 12,119,338
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with integrated decoupling and alignment features
- Patent number 12,113,028
- Issue date Oct 8, 2024
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for aligning substrates
- Patent number 12,106,993
- Issue date Oct 1, 2024
- EV Group E. Thallner GmbH
- Jozsef Krol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Maskless alignment scheme for BEOL memory array manufacturing
- Patent number 12,107,008
- Issue date Oct 1, 2024
- International Business Machines Corporation
- Soon-Cheon Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Overlay mark forming Moire pattern, overlay measurement method usin...
- Patent number 12,107,052
- Issue date Oct 1, 2024
- AUROS TECHNOLOGY, INC.
- Hyun Chul Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Apparatus for stacking substrates and method for the same
- Patent number 12,100,667
- Issue date Sep 24, 2024
- Nikon Corporation
- Isao Sugaya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
DISPLAY DEVICE
- Publication number 20240429218
- Publication date Dec 26, 2024
- SAMSUNG DISPLAY CO., LTD.
- OUKJAE LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240429176
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- JU-IL CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240429198
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Jing Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED PACKAGING FOR WIDE BAND GAP SEMICONDUCTOR DEVICES
- Publication number 20240429136
- Publication date Dec 26, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Maria Clemens Ypil QUINONES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH SINGLE-CRYSTAL LAYERS
- Publication number 20240429086
- Publication date Dec 26, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLUGGABLE INTERCONNECTS USING GLASS CORES OF INTEGRATED CIRCUIT PAC...
- Publication number 20240421062
- Publication date Dec 19, 2024
- Intel Corporation
- Tolga Acikalin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240413144
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- Sangcheon PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR STACKING SUBSTRATES AND METHOD FOR THE SAME
- Publication number 20240413093
- Publication date Dec 12, 2024
- Nikon Corporation
- Isao Sugaya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER SEMICONDUCTOR MODULE AND METHOD OF INCREASING PIN ALIGNMENT A...
- Publication number 20240404961
- Publication date Dec 5, 2024
- INFINEON TECHNOLOGIES AG
- Alexander Herbrandt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR III-V/SILICON HYBRID INTEGRATION
- Publication number 20240402427
- Publication date Dec 5, 2024
- ROCKLEY PHOTONICS LIMITED
- Guomin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240404962
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Pei-Hsuan LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240404877
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsai-Ming HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY CELLS AND MULTIPL...
- Publication number 20240404866
- Publication date Dec 5, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE
- Publication number 20240395728
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yao-Te Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and Method for Bonding Semiconductor Devices
- Publication number 20240395766
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kai-Tai Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING DEVICE AND MOUNTING METHOD
- Publication number 20240395634
- Publication date Nov 28, 2024
- Samsung Electronics Co., Ltd.
- Takamasa Sugiura
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES, PACKAGING METHODS, AND PACKAGED SEMI...
- Publication number 20240395792
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jie CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PRODUCING A 3D SEMICONDUCTOR MEMORY DEVICE AND STRUCTURE
- Publication number 20240395592
- Publication date Nov 28, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20240387447
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Geng-Ming CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...
- Publication number 20240387467
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF FORMING THE SAME AND METHOD OF MEAS...
- Publication number 20240387395
- Publication date Nov 21, 2024
- Fujian Jinhua Integrated Circuit Co., Ltd.
- JIANPENG LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE FINISHES FOR CONTACTS AND FIDUCIAL MARKERS ON INTEGRATED CI...
- Publication number 20240387396
- Publication date Nov 21, 2024
- Intel Corporation
- Jung Kyu Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package with Organic Integrated Circuit Substrate Embedded in Inorg...
- Publication number 20240387456
- Publication date Nov 21, 2024
- AT&S Austria Technologie & Systemtechnik AG
- Minwoo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR DETERMINING WAFER CHARACTERS
- Publication number 20240387223
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Wei-Da KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIGITALIZED INTERCONNECT REDISTRIBUTION ENABLED CHIPLET PACKAGING
- Publication number 20240387336
- Publication date Nov 21, 2024
- Applied Materials, Inc.
- Guan-Shian CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Alignment Structure for Semiconductor Device and Method of Forming...
- Publication number 20240387397
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chi-Sheng Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMP SAFE ALIGNMENT MARK
- Publication number 20240387398
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Huang-Jen HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING AND METHODS OF FORMING SAME
- Publication number 20240379618
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIFT CONTROL METHOD IN MANUFACTURE OF SEMICONDUCTOR DEVICE
- Publication number 20240379617
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE FABRICATING METHOD
- Publication number 20240371784
- Publication date Nov 7, 2024
- Samsung Electronics Co., Ltd.
- Ji Soo Park
- H01 - BASIC ELECTRIC ELEMENTS

for alignment

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package and electronic device including the same

Metal-free frame design for silicon bridges for semiconductor packages

Voltage contrast metrology mark

Frame reveals with maskless lithography in the manufacture of integ...

Display device including alignment pattern

System and method for aligned stitching

Mounting device and mounting method

Methods for producing a 3D semiconductor memory device and structure

Shift control method in manufacture of semiconductor device

Memory device and method of manufacturing the same

Method for manufacturing electronic device

Staircase etch control in forming three-dimensional memory device

Semiconductor package structure and method for manufacturing the same

Semiconductor devices and methods of manufacture

Guard ring design enabling in-line testing of silicon bridges for s...

Wiring structure and method of manufacturing the same, semiconducto...

3D semiconductor device and structure with single-crystal layers

Sonar sensor in processing chamber

Semiconductor device structure including overlay mark structure

3D semiconductor device and structure with metal layers and memory...

Apparatus and methods for determining wafer characters

Through-substrate via structure and method of manufacture

Method of determining overlay error during semiconductor fabrication

Integrated self-aligned assembly

Semiconductor device packages, packaging methods, and packaged semi...

Semiconductor device with integrated decoupling and alignment features

Method and device for aligning substrates

Maskless alignment scheme for BEOL memory array manufacturing

Overlay mark forming Moire pattern, overlay measurement method usin...

Apparatus for stacking substrates and method for the same

Patents Applicationslast 30 patents

DISPLAY DEVICE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

MOLDED PACKAGING FOR WIDE BAND GAP SEMICONDUCTOR DEVICES

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH SINGLE-CRYSTAL LAYERS

PLUGGABLE INTERCONNECTS USING GLASS CORES OF INTEGRATED CIRCUIT PAC...

SEMICONDUCTOR PACKAGE

APPARATUS FOR STACKING SUBSTRATES AND METHOD FOR THE SAME

POWER SEMICONDUCTOR MODULE AND METHOD OF INCREASING PIN ALIGNMENT A...

METHOD FOR III-V/SILICON HYBRID INTEGRATION

PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY CELLS AND MULTIPL...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE

System and Method for Bonding Semiconductor Devices

MOUNTING DEVICE AND MOUNTING METHOD

SEMICONDUCTOR DEVICE PACKAGES, PACKAGING METHODS, AND PACKAGED SEMI...

METHODS FOR PRODUCING A 3D SEMICONDUCTOR MEMORY DEVICE AND STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...

SEMICONDUCTOR DEVICE, METHOD OF FORMING THE SAME AND METHOD OF MEAS...

SURFACE FINISHES FOR CONTACTS AND FIDUCIAL MARKERS ON INTEGRATED CI...

Package with Organic Integrated Circuit Substrate Embedded in Inorg...

APPARATUS AND METHODS FOR DETERMINING WAFER CHARACTERS

DIGITALIZED INTERCONNECT REDISTRIBUTION ENABLED CHIPLET PACKAGING

Alignment Structure for Semiconductor Device and Method of Forming...

CMP SAFE ALIGNMENT MARK

SEMICONDUCTOR PACKAGING AND METHODS OF FORMING SAME

SHIFT CONTROL METHOD IN MANUFACTURE OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE FABRICATING METHOD