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CPC
H01L2223/54426

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00

Current Industry

H01L2223/54426for alignment

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with decoupling unit
- Patent number 12,266,600
- Issue date Apr 1, 2025
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 12,261,131
- Issue date Mar 25, 2025
- Fuji Electric Co., Ltd.
- Tsuneyuki Matsushima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 12,261,971
- Issue date Mar 25, 2025
- WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Peng Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded high-z marker material and process for alignment of multil...
- Patent number 12,255,047
- Issue date Mar 18, 2025
- HRL Laboratories, LLC
- Christopher Bohn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMP safe alignment mark
- Patent number 12,255,150
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Huang-Jen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,249,287
- Issue date Mar 11, 2025
- Innolux Corporation
- Kuan-Feng Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated assemblies comprising vertically-stacked decks with inte...
- Patent number 12,249,598
- Issue date Mar 11, 2025
- Micron Technology, Inc.
- Werner Juengling
- G11 - INFORMATION STORAGE
Information Patent Grant
Method for manufacturing semiconductor device structure with overla...
- Patent number 12,243,832
- Issue date Mar 4, 2025
- NANYA TECHNOLOGY CORPORATION
- Chun-Yen Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radiation detector, radiation CT apparatus, and method of manufactu...
- Patent number 12,243,903
- Issue date Mar 4, 2025
- Canon Kabushiki Kaisha
- Takashi Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers and memory...
- Patent number 12,243,765
- Issue date Mar 4, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Alignment process for the transfer setup
- Patent number 12,237,234
- Issue date Feb 25, 2025
- VueReal
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor mark, and semiconductor mark
- Patent number 12,230,584
- Issue date Feb 18, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Chuang Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer registration and overlay measurement systems and related methods
- Patent number 12,230,546
- Issue date Feb 18, 2025
- Micron Technology, Inc.
- Nikolay A. Mirin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming micro interconnect struc...
- Patent number 12,230,559
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photolithography alignment process for bonded wafers
- Patent number 12,230,585
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yeong-Jyh Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer structure and semiconductor device
- Patent number 12,224,256
- Issue date Feb 11, 2025
- Samsung Electronics Co., Ltd.
- Hyunsu Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming fin structure in fin field effect transistor pro...
- Patent number 12,224,176
- Issue date Feb 11, 2025
- Shanghai Huali Integrated Circuit Corporation
- Xiaobo Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device including a pluralit...
- Patent number 12,218,051
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Yuan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding to alignment marks with dummy alignment marks
- Patent number 12,218,097
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 12,218,096
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Yeongkwon Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor marks and forming methods thereof
- Patent number 12,218,073
- Issue date Feb 4, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Shengan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier structure
- Patent number 12,219,693
- Issue date Feb 4, 2025
- Siliconware Precision Industries Co., Ltd.
- Chin-Wei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,218,072
- Issue date Feb 4, 2025
- Kioxia Corporation
- Yoichi Mizuta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 12,211,802
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jhih-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical measurement tool containing chromatic aberration enhancemen...
- Patent number 12,211,724
- Issue date Jan 28, 2025
- SanDisk Technologies LLC
- Michio Ohi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Memory devices
- Patent number 12,207,473
- Issue date Jan 21, 2025
- Lodestar Licensing Group LLC
- Umberto Maria Meotto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor devices and structures with metal layers
- Patent number 12,199,093
- Issue date Jan 14, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having integral alignment marks with decouplin...
- Patent number 12,191,258
- Issue date Jan 7, 2025
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated aligned stealth laser for wafer edge trimming process
- Patent number 12,183,571
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Tung Wu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and electronic device including the same
- Patent number 12,176,296
- Issue date Dec 24, 2024
- Samsung Electronics Co., Ltd.
- Jung Eun Koo
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT STRUCTURES HAVING REGISTRATION MARKS FOR DUAL-SI...
- Publication number 20250112150
- Publication date Apr 3, 2025
- Intel Corporation
- Hwichan JUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DESIGN LITHOGRAPHIC SEAM IMPLEMENTATION METHODOLOGY F...
- Publication number 20250112167
- Publication date Apr 3, 2025
- Intel Corporation
- Kimberly Pierce
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING SYSTEMS, AND METHODS OF BONDING A SEMICONDUCTOR ELEMENT TO...
- Publication number 20250112201
- Publication date Apr 3, 2025
- KULICKE AND SOFFA INDUSTRIES, INC.
- Andreas Marte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING WITH EMBEDDED ALIGNMENT MARKERS
- Publication number 20250112168
- Publication date Apr 3, 2025
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor structure and alignment method thereof
- Publication number 20250105166
- Publication date Mar 27, 2025
- UNITED MICROELECTRONICS CORP.
- Chiao-Yi Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250105213
- Publication date Mar 27, 2025
- Macronix International Co., Ltd.
- Shao-En Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250105127
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Dohyun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE
- Publication number 20250105179
- Publication date Mar 27, 2025
- Mitsubishi Electric Corporation
- Chikara INADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR DIE
- Publication number 20250095987
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Chi FU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERS
- Publication number 20250098325
- Publication date Mar 20, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OVERLAY MARK
- Publication number 20250096147
- Publication date Mar 20, 2025
- Macronix International Co., Ltd.
- Chiung Jung Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOLITHOGRAPHY METHOD AND STRUCTURES THEREOF
- Publication number 20250096146
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao Chu Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUSES FOR MICROFABRICATION AND LASER WRITING ALIG...
- Publication number 20250085644
- Publication date Mar 13, 2025
- IonQ, Inc.
- Jason Madjdi AMINI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250087592
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Geng-Ming CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250087593
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- Juil CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250079355
- Publication date Mar 6, 2025
- SK HYNIX INC.
- Woo Sung MOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Display Substrate and Preparation Method Therefor, and Display Appa...
- Publication number 20250081610
- Publication date Mar 6, 2025
- BOE TECHNOLOGY GROUP CO., LTD.
- Li XIAO
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
DISPLAY DEVICE
- Publication number 20250081700
- Publication date Mar 6, 2025
- Seoul Viosys Co., Ltd.
- Nam Goo CHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALIGNMENT STRUCTURES FOR DIE PICK-AND-PLACEMENT AND METHODS OF USIN...
- Publication number 20250079329
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jhih-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED STEALTH LASER FOR WAFER EDGE TRIMMING PROCESS
- Publication number 20250079150
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Tung Wu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT, CIRCUIT BOARD AND METHOD
- Publication number 20250070040
- Publication date Feb 27, 2025
- Murata Manufacturing Co., Ltd.
- Sami NURMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES
- Publication number 20250070056
- Publication date Feb 27, 2025
- Intel Corporation
- Dae-Woo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250070039
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Kwangyong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING SYSTEM AND METHOD
- Publication number 20250054798
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OVERLAY METROLOGY TARGET FOR DIE-TO-WAFER OVERLAY METROLOGY
- Publication number 20250054872
- Publication date Feb 13, 2025
- KLA Corporation
- Shlomo Eisenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING AN ALIGNMENT MARK AND METHODS OF FOR...
- Publication number 20250054873
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Hsin YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS FOR VISIBLE WAVELENGTH MEASUREMENT OF OVERLAY OF WAFER-ON-W...
- Publication number 20250054871
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Han-Jong Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS WITH IMPLANTED ALIGNMENT MARK AND METHODS OF MANUFACTURIN...
- Publication number 20250046730
- Publication date Feb 6, 2025
- Micron Technology, Inc.
- Andrew M. Bayless
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A SEMICONDUCTOR DEVICE, AND A STRUCTURE FORMED B...
- Publication number 20250046685
- Publication date Feb 6, 2025
- Siliconix Incorporated
- Barry LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DETERMINING PROBING PARAMETERS FOR PROBE SYSTEM TO TEST D...
- Publication number 20250044350
- Publication date Feb 6, 2025
- MPI Corporation
- Andrej Rumiantsev
- G01 - MEASURING TESTING

for alignment

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device with decoupling unit

Semiconductor device and method of manufacturing semiconductor device

Display device

Embedded high-z marker material and process for alignment of multil...

CMP safe alignment mark

Electronic device

Integrated assemblies comprising vertically-stacked decks with inte...

Method for manufacturing semiconductor device structure with overla...

Radiation detector, radiation CT apparatus, and method of manufactu...

3D semiconductor device and structure with metal layers and memory...

Alignment process for the transfer setup

Method for manufacturing semiconductor mark, and semiconductor mark

Wafer registration and overlay measurement systems and related methods

Semiconductor device and method of forming micro interconnect struc...

Photolithography alignment process for bonded wafers

Wafer structure and semiconductor device

Method for forming fin structure in fin field effect transistor pro...

Method of manufacturing a semiconductor device including a pluralit...

Bonding to alignment marks with dummy alignment marks

Semiconductor package and method of forming the same

Semiconductor marks and forming methods thereof

Carrier structure

Semiconductor device and method for manufacturing the same

Package structure and method of fabricating the same

Optical measurement tool containing chromatic aberration enhancemen...

Memory devices

3D semiconductor devices and structures with metal layers

Semiconductor device having integral alignment marks with decouplin...

Integrated aligned stealth laser for wafer edge trimming process

Semiconductor package and electronic device including the same

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT STRUCTURES HAVING REGISTRATION MARKS FOR DUAL-SI...

SEMICONDUCTOR DESIGN LITHOGRAPHIC SEAM IMPLEMENTATION METHODOLOGY F...

BONDING SYSTEMS, AND METHODS OF BONDING A SEMICONDUCTOR ELEMENT TO...

HYBRID BONDING WITH EMBEDDED ALIGNMENT MARKERS

Semiconductor structure and alignment method thereof

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE

METHOD FOR FORMING SEMICONDUCTOR DIE

3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERS

OVERLAY MARK

PHOTOLITHOGRAPHY METHOD AND STRUCTURES THEREOF

METHODS AND APPARATUSES FOR MICROFABRICATION AND LASER WRITING ALIG...

PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Display Substrate and Preparation Method Therefor, and Display Appa...

DISPLAY DEVICE

ALIGNMENT STRUCTURES FOR DIE PICK-AND-PLACEMENT AND METHODS OF USIN...

INTEGRATED STEALTH LASER FOR WAFER EDGE TRIMMING PROCESS

ELECTRONIC COMPONENT, CIRCUIT BOARD AND METHOD

METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

BONDING SYSTEM AND METHOD

OVERLAY METROLOGY TARGET FOR DIE-TO-WAFER OVERLAY METROLOGY

SEMICONDUCTOR DEVICE INCLUDING AN ALIGNMENT MARK AND METHODS OF FOR...

SYSTEMS FOR VISIBLE WAVELENGTH MEASUREMENT OF OVERLAY OF WAFER-ON-W...

APPARATUS WITH IMPLANTED ALIGNMENT MARK AND METHODS OF MANUFACTURIN...

METHOD FOR FORMING A SEMICONDUCTOR DEVICE, AND A STRUCTURE FORMED B...

METHOD OF DETERMINING PROBING PARAMETERS FOR PROBE SYSTEM TO TEST D...