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H01L2223/54426

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00

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H01L2223/54426for alignment

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Wafer assembly having alignment marks, method for forming same, and...
- Patent number 12,368,110
- Issue date Jul 22, 2025
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Guoliang Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer structure for semiconductor package including peripheral...
- Patent number 12,368,109
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and semiconductor package including the same
- Patent number 12,362,286
- Issue date Jul 15, 2025
- Samsung Electronics Co., Ltd.
- Byeonguk Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment structure for semiconductor device and method of forming...
- Patent number 12,362,285
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Sheng Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing semiconductor pac...
- Patent number 12,362,326
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a chip package
- Patent number 12,362,178
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor memory device and structure
- Patent number 12,362,219
- Issue date Jul 15, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensing device including light reception alignment marks
- Patent number 12,364,029
- Issue date Jul 15, 2025
- SK hynix Inc.
- Seok Jae Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-receiving device
- Patent number 12,356,752
- Issue date Jul 8, 2025
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Kentaro Akiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with overlay mark
- Patent number 12,354,970
- Issue date Jul 8, 2025
- NANYA TECHNOLOGY CORPORATION
- Chun-Yen Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure, method for manufacturing same and memory
- Patent number 12,354,971
- Issue date Jul 8, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Shaowen Qiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional (3D) memory device and fabrication method
- Patent number 12,347,787
- Issue date Jul 1, 2025
- Yangtze Memory Technologies Co., Ltd.
- Chuanhai Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device including a panel alignment mark
- Patent number 12,347,786
- Issue date Jul 1, 2025
- Samsung Display Co., Ltd.
- Chung Seok Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Resin shaping device
- Patent number 12,341,036
- Issue date Jun 24, 2025
- BONDTECH CO., LTD.
- Akira Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Probe pad with built-in interconnect structure
- Patent number 12,327,770
- Issue date Jun 10, 2025
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Robust mold integrated substrate
- Patent number 12,327,801
- Issue date Jun 10, 2025
- Intel Corporation
- Jimin Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Large die wafer, large die and method of forming the same
- Patent number 12,322,707
- Issue date Jun 3, 2025
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Sheng Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate alignment systems and related methods
- Patent number 12,322,632
- Issue date Jun 3, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shifted via-chain electrical-test measurements for hybrid bonding a...
- Patent number 12,322,661
- Issue date Jun 3, 2025
- Tokyo Electron Limited
- Kevin Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image pickup unit, endoscope, and method of manufacturing image pic...
- Patent number 12,317,629
- Issue date May 27, 2025
- Olympus Medical Systems Corp.
- Junya Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,315,823
- Issue date May 27, 2025
- Kabushiki Kaisha Toshiba
- Yoshiharu Takada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies
- Patent number 12,315,840
- Issue date May 27, 2025
- Intel Corporation
- Shawna M. Liff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting display device
- Patent number 12,317,595
- Issue date May 27, 2025
- LG Display Co., Ltd.
- Hyungju Park
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Method for manufacturing display device and apparatus for manufactu...
- Patent number 12,308,259
- Issue date May 20, 2025
- Samsung Display Co., Ltd.
- Dong Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous integration of components onto compact devices using...
- Patent number 12,308,275
- Issue date May 20, 2025
- Board of Regents, The University of Texas System
- Sidlgata V. Sreenivasan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Overlay mark
- Patent number 12,308,324
- Issue date May 20, 2025
- Winbond Electronics Corp.
- Kuang-Chung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Element chip manufacturing method and substrate processing method
- Patent number 12,300,482
- Issue date May 13, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hidehiko Karasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a bonded semiconductor structure
- Patent number 12,300,660
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit stack verification method and system for perform...
- Patent number 12,293,141
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng Wei Kuo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Tiled display device
- Patent number 12,288,772
- Issue date Apr 29, 2025
- Samsung Display Co., Ltd.
- Sang Seop Kum
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250239569
- Publication date Jul 24, 2025
- Advanced Semiconductor Engineering, Inc.
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MULTI-LAYER ALIGNMENT MARK STRUCTURE
- Publication number 20250233078
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Wei YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE INCLUDING MARK STRUCTU...
- Publication number 20250233079
- Publication date Jul 17, 2025
- NANYA TECHNOLOGY CORPORATION
- CHIH-HSUAN YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING DISPLAY DEVICE AND APPARATUS FOR MANUFACTU...
- Publication number 20250226243
- Publication date Jul 10, 2025
- SAMSUNG DISPLAY CO., LTD.
- Dong Woo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFRACTION-BASED OVERLAY MARK DESIGN
- Publication number 20250226333
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ting-Wei TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT APPLIED INTERPOSER FOR CO-PACKAGED OPTICS
- Publication number 20250210613
- Publication date Jun 26, 2025
- Applied Materials, Inc.
- Guan-Shian CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES HAVING METAL GATE AND TRENCH CONTACT...
- Publication number 20250212450
- Publication date Jun 26, 2025
- Intel Corporation
- Leonard P. GULER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING RECOGNITION MARKS
- Publication number 20250210539
- Publication date Jun 26, 2025
- SK HYNIX INC.
- Hyun Chul SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS FOR IMPROVED PLACEMENT OF REDISTRIBUTION LAYERS IN MULTI-DI...
- Publication number 20250210486
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jhih-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250210537
- Publication date Jun 26, 2025
- NOVATEK MICROELECTRONICS CORP.
- Chiang-Chi Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR PACKAGE STRUCTURES WITH INTERPOSERS HAVING ALIGNMENT FEATURES
- Publication number 20250192064
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Jae-Woong Nah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250192065
- Publication date Jun 12, 2025
- Mitsubishi Electric Corporation
- Haruki MURAKAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250192029
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Wonkeun CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING ALIGNMENT PATTERN AND MANUFACTURING...
- Publication number 20250192104
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Hung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20250183168
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR FABRICATION OF INFRARED TRANSPARENT WINDOW...
- Publication number 20250185393
- Publication date Jun 5, 2025
- DRS Network & Imaging Systems, LLC
- Thomas Schimert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM OF OPTICAL NANOSCALE ALIGNMENT
- Publication number 20250183080
- Publication date Jun 5, 2025
- Institut National de la Recherche Scientifique
- Jinyang LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DICING DEVICE, SEMICONDUCTOR CHIP MANUFACTURING METHOD, AND SEMICON...
- Publication number 20250174473
- Publication date May 29, 2025
- YAMAHA HATSUDOKI KABUSHIKI KAISHA
- Yoshikuni SUZUKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING STRETCHABLE DISPLAY DEVICE USING SELF-ASSE...
- Publication number 20250176309
- Publication date May 29, 2025
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Doo-Hee CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER, METHOD OF FABRICATING THE SAME, AND SEMICONDUCTOR PACKA...
- Publication number 20250174571
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Sungwoo PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies Comprising Vertically-Stacked Decks
- Publication number 20250174619
- Publication date May 29, 2025
- Micron Technology, Inc.
- Werner Juengling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250174572
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Hyun Ung Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFFSET ALIGNMENT AND REPAIR IN MICRO DEVICE TRANSFER
- Publication number 20250167033
- Publication date May 22, 2025
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES COMPRISING OVERLAY MARKS
- Publication number 20250167130
- Publication date May 22, 2025
- Micron Technology, Inc.
- Rohit Kothari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFFSET ALIGNMENT AND REPAIR IN MICRO DEVICE TRANSFER
- Publication number 20250167032
- Publication date May 22, 2025
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALIGNMENT PROCESS FOR THE TRANSFER SETUP
- Publication number 20250167053
- Publication date May 22, 2025
- VueReal Inc.
- Gholamreza CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A SOLDER BALL
- Publication number 20250167128
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Junghoon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING A PLURALIT...
- Publication number 20250157922
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Yuan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOLITHOGRAPHY ALIGNMENT PROCESS FOR BONDED WAFERS
- Publication number 20250157943
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yeong-Jyh Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250157942
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- Jisoo Park
- H01 - BASIC ELECTRIC ELEMENTS

for alignment

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wafer assembly having alignment marks, method for forming same, and...

Interposer structure for semiconductor package including peripheral...

Printed circuit board and semiconductor package including the same

Alignment structure for semiconductor device and method of forming...

Semiconductor package and method of manufacturing semiconductor pac...

Method for fabricating a chip package

3D semiconductor memory device and structure

Image sensing device including light reception alignment marks

Light-receiving device

Semiconductor device structure with overlay mark

Semiconductor structure, method for manufacturing same and memory

Three dimensional (3D) memory device and fabrication method

Display device including a panel alignment mark

Resin shaping device

Probe pad with built-in interconnect structure

Robust mold integrated substrate

Large die wafer, large die and method of forming the same

Substrate alignment systems and related methods

Shifted via-chain electrical-test measurements for hybrid bonding a...

Image pickup unit, endoscope, and method of manufacturing image pic...

Semiconductor device

Microelectronic assemblies

Light emitting display device

Method for manufacturing display device and apparatus for manufactu...

Heterogeneous integration of components onto compact devices using...

Overlay mark

Element chip manufacturing method and substrate processing method

Method of forming a bonded semiconductor structure

Integrated circuit stack verification method and system for perform...

Tiled display device

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

MULTI-LAYER ALIGNMENT MARK STRUCTURE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE INCLUDING MARK STRUCTU...

METHOD FOR MANUFACTURING DISPLAY DEVICE AND APPARATUS FOR MANUFACTU...

DIFFRACTION-BASED OVERLAY MARK DESIGN

DIRECT APPLIED INTERPOSER FOR CO-PACKAGED OPTICS

INTEGRATED CIRCUIT STRUCTURES HAVING METAL GATE AND TRENCH CONTACT...

SEMICONDUCTOR DEVICES INCLUDING RECOGNITION MARKS

SYSTEMS FOR IMPROVED PLACEMENT OF REDISTRIBUTION LAYERS IN MULTI-DI...

SEMICONDUCTOR DEVICE

MODULAR PACKAGE STRUCTURES WITH INTERPOSERS HAVING ALIGNMENT FEATURES

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURE HAVING ALIGNMENT PATTERN AND MANUFACTURING...

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

METHODS AND SYSTEMS FOR FABRICATION OF INFRARED TRANSPARENT WINDOW...

METHOD AND SYSTEM OF OPTICAL NANOSCALE ALIGNMENT

DICING DEVICE, SEMICONDUCTOR CHIP MANUFACTURING METHOD, AND SEMICON...

METHOD FOR MANUFACTURING STRETCHABLE DISPLAY DEVICE USING SELF-ASSE...

INTERPOSER, METHOD OF FABRICATING THE SAME, AND SEMICONDUCTOR PACKA...

Integrated Assemblies Comprising Vertically-Stacked Decks

SEMICONDUCTOR PACKAGE

OFFSET ALIGNMENT AND REPAIR IN MICRO DEVICE TRANSFER

ELECTRONIC DEVICES COMPRISING OVERLAY MARKS

OFFSET ALIGNMENT AND REPAIR IN MICRO DEVICE TRANSFER

ALIGNMENT PROCESS FOR THE TRANSFER SETUP

SEMICONDUCTOR PACKAGE INCLUDING A SOLDER BALL

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING A PLURALIT...

PHOTOLITHOGRAPHY ALIGNMENT PROCESS FOR BONDED WAFERS

SEMICONDUCTOR DEVICE