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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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H01L21/76876
for deposition from the gas phase
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last 30 patents
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Atomic layer deposition on 3D NAND structures
Patent number
11,972,952
Issue date
Apr 30, 2024
Lam Research Corporation
Ruopeng Deng
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Deposition of metal films with tungsten liner
Patent number
11,948,836
Issue date
Apr 2, 2024
Applied Materials, Inc.
Yu Lei
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method of forming graphene barrier layer in interconnect structure
Patent number
11,929,326
Issue date
Mar 12, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Shin-Yi Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Annealed seed layer to improve ferroelectric properties of memory l...
Patent number
11,917,831
Issue date
Feb 27, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Song-Fu Liao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods and devices for subtractive self-alignment
Patent number
11,908,696
Issue date
Feb 20, 2024
Applied Materials, Inc.
He Ren
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Patent Grant
Methods for depositing a molybdenum metal film over a dielectric su...
Patent number
11,908,736
Issue date
Feb 20, 2024
ASM IP Holding B.V.
Bhushan Zope
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Patent Grant
Silicide film nucleation
Patent number
11,901,182
Issue date
Feb 13, 2024
Applied Materials, Inc.
Xuebin Li
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Feature fill with nucleation inhibition
Patent number
11,901,227
Issue date
Feb 13, 2024
Lam Research Corporation
Anand Chandrashekar
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Patent Grant
Storage node contact structure of a memory device
Patent number
11,877,433
Issue date
Jan 16, 2024
United Microelectronics Corp.
Pin-Hong Chen
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Integrated circuits with buried interconnect conductors
Patent number
11,854,902
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Kuo-Cheng Chiang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Systems and methods for cobalt metalization
Patent number
11,854,876
Issue date
Dec 26, 2023
ASM IP Holding B.V.
Chiyu Zhu
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Patent Grant
Method for fabricating conductive feature and semiconductor device
Patent number
11,842,925
Issue date
Dec 12, 2023
NANYA TECHNOLOGY CORPORATION
Che-Hsien Liao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
CVD based oxide-metal multi structure for 3D NAND memory devices
Patent number
11,817,320
Issue date
Nov 14, 2023
Applied Materials, Inc.
Susmit Singha Roy
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Patent Grant
Tungsten film-forming method, film-forming system and storage medium
Patent number
11,802,334
Issue date
Oct 31, 2023
Tokyo Electron Limited
Takashi Sameshima
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Patent Grant
Tungsten structures and methods of forming the structures
Patent number
11,791,268
Issue date
Oct 17, 2023
Micron Technology, Inc.
Jordan D. Greenlee
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Fin field effect transistor device structure
Patent number
11,791,215
Issue date
Oct 17, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Shang-Wen Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metal structures, devices, and methods
Patent number
11,769,729
Issue date
Sep 26, 2023
Intel Corporation
Daniel J. Zierath
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Patent Grant
Semiconductor devices and methods of manufacturing the same
Patent number
11,756,879
Issue date
Sep 12, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Hung-Jui Kuo
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Techniques for selective tungsten contact formation on semiconducto...
Patent number
11,728,214
Issue date
Aug 15, 2023
Applied Materials, Inc.
Sipeng Gu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method of forming metal contact for semiconductor device
Patent number
11,715,763
Issue date
Aug 1, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Sung-Li Wang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Annealed seed layer to improve ferroelectric properties of memory l...
Patent number
11,690,228
Issue date
Jun 27, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Song-Fu Liao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Catalyst enhanced seamless ruthenium gap fill
Patent number
11,680,312
Issue date
Jun 20, 2023
Applied Materials, Inc.
Byunghoon Yoon
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor arrangement and method of making
Patent number
11,670,547
Issue date
Jun 6, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Yu-Ting Tsai
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
PECVD tungsten containing hardmask films and methods of making
Patent number
11,594,415
Issue date
Feb 28, 2023
Applied Materials, Inc.
Susmit Singha Roy
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods for depositing a molybdenum metal film over a dielectric su...
Patent number
11,581,220
Issue date
Feb 14, 2023
ASM IP Holding B.V.
Bhushan Zope
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Semiconductor device structure and method for forming the same
Patent number
11,502,187
Issue date
Nov 15, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Kuo-Cheng Ching
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and semiconductor pacakge
Patent number
11,502,040
Issue date
Nov 15, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Jung-Hua Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming a contact plug in a semiconductor integrated circ...
Patent number
11,482,452
Issue date
Oct 25, 2022
Wonik IPS Co., Ltd.
Won Jun Yoon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bottom-up formation of contact plugs
Patent number
11,469,139
Issue date
Oct 11, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Yen-Yu Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor memory device and manufacturing method thereof
Patent number
11,456,309
Issue date
Sep 27, 2022
Kioxia Corporation
Yusuke Shima
G11 - INFORMATION STORAGE
Patents Applications
last 30 patents
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Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING INTERCONNECTING M...
Publication number
20240145302
Publication date
May 2, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Yu-Shien SHIAH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED PVD TUNGSTEN LINER AND SEAMLESS CVD TUNGSTEN FILL
Publication number
20240087955
Publication date
Mar 14, 2024
Applied Materials, Inc.
Yi XU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT DEVICE INCLUDING INTERCONNECTION STRUCTURE
Publication number
20240071924
Publication date
Feb 29, 2024
Samsung Electronics Co., Ltd.
Jungil PARK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS FOR FORMING MULTI-TIER TUNGSTEN FEATURES
Publication number
20240047268
Publication date
Feb 8, 2024
Applied Materials, Inc.
Peiqi WANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PLASMA ENHANCED TUNGSTEN NUCLEATION FOR LOW RESISTIVITY
Publication number
20240006236
Publication date
Jan 4, 2024
Applied Materials, Inc.
Tsung-Han YANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Tungsten Film-Forming Method, Film-Forming System and Storage Medium
Publication number
20240003002
Publication date
Jan 4, 2024
TOKYO ELECTRON LIMITED
Takashi SAMESHIMA
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
TREATMENT OF TUNGSTEN SURFACE FOR TUNGSTEN GAP-FILL
Publication number
20230420295
Publication date
Dec 28, 2023
Applied Materials, Inc.
Tsung-Han YANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONDUCTIVE STRUCTURES AND METHODS OF FORMING THE SAME
Publication number
20230395429
Publication date
Dec 7, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Kan-Ju LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR FORMING A CONTACT PLUG BY BOTTOM-UP METAL GROWTH
Publication number
20230386915
Publication date
Nov 30, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Chung-Liang CHENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Contact Structure For Semiconductor Device
Publication number
20230386912
Publication date
Nov 30, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Hsu-Kai CHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Bottom-up Formation of Contact Plugs
Publication number
20230386917
Publication date
Nov 30, 2023
Taiwan Semiconductor Manufacturing Co, LTD.
Yen-Yu Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS FOR FORMING MULTI-TIER TUNGSTEN FEATURES
Publication number
20230369113
Publication date
Nov 16, 2023
Applied Materials, Inc.
Peiqi WANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR FORMING FIN FIELD EFFECT TRANSISTOR DEVICE STRUCTURE
Publication number
20230369121
Publication date
Nov 16, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Shang-Wen CHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
GRADIENT OXIDATION AND ETCH FOR PVD METAL AS BOTTOM LINER IN BOTTOM...
Publication number
20230343643
Publication date
Oct 26, 2023
Applied Materials, Inc.
Chih-Hsun HSU
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
METHOD OF MAKING A THREE-DIMENSIONAL MEMORY DEVICE USING COMPOSITE...
Publication number
20230343641
Publication date
Oct 26, 2023
Western Digital Technologies, Inc.
Roshan Jayakhar TIRUKKONDA
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE WITH SOURCE/DRAIN CONTACT FORMED USING BOTTOM-...
Publication number
20230335592
Publication date
Oct 19, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Sung-Li WANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LOW RESISTIVITY CONTACTS AND INTERCONNECTS
Publication number
20230326790
Publication date
Oct 12, 2023
LAM RESEARCH CORPORATION
Raihan M. TARAFDAR
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR S...
Publication number
20230307294
Publication date
Sep 28, 2023
CHANGXIN MEMORY TECHNOLOGIES, INC
Ke MA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SELF-LIMITING GROWTH
Publication number
20230290680
Publication date
Sep 14, 2023
LAM RESEARCH CORPORATION
Joshua Collins
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
TUNGSTEN MOLYBDENUM STRUCTURES
Publication number
20230290679
Publication date
Sep 14, 2023
Applied Materials, Inc.
Xi CEN
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Patent Application
SEMICONDUCTOR ARRANGEMENT AND METHOD OF MAKING
Publication number
20230268227
Publication date
Aug 24, 2023
Taiwan Semiconductor Manufacturing Company Limited
Yu-Ting TSAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONTACT FEATURES OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME
Publication number
20230260836
Publication date
Aug 17, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Pei Shan Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PROCESS FOR SELECTIVELY DEPOSITING HIGHLY-CONDUCTIVE METAL FILMS
Publication number
20230245894
Publication date
Aug 3, 2023
Entegris, Inc.
Philip S.H. Chen
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Patent Application
STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH CARBON-...
Publication number
20230230881
Publication date
Jul 20, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Wei-Hao LIAO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR FABRICATING CONDUCTIVE FEATURE AND SEMICONDUCTOR DEVICE
Publication number
20230230879
Publication date
Jul 20, 2023
NANYA TECHNOLOGY CORPORATION
CHE-HSIEN LIAO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND APPARATUSES FOR FORMING SEMICONDUCTOR DEVICES CONTAININ...
Publication number
20230223266
Publication date
Jul 13, 2023
SANDISK TECHNOLOGIES LLC
Fei ZHOU
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
METHODS AND APPARATUSES FOR FORMING SEMICONDUCTOR DEVICES CONTAININ...
Publication number
20230223267
Publication date
Jul 13, 2023
SANDISK TECHNOLOGIES LLC
Rahul SHARANGPANI
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Patent Application
METHOD AND DEVICE FOR FORMING TUNGSTEN FILM, AND DEVICE FOR FORMING...
Publication number
20230212738
Publication date
Jul 6, 2023
Tokyo Electron Limited
Kensaku NARUSHIMA
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
TUNGSTEN GAPFILL USING MOLYBDENUM CO-FLOW
Publication number
20230109501
Publication date
Apr 6, 2023
Applied Materials, Inc.
Xi Cen
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
METHODS FOR MINIMIZING FEATURE-TO-FEATURE GAP FILL HEIGHT VARIATIONS
Publication number
20230098561
Publication date
Mar 30, 2023
Jiajie CEN
H01 - BASIC ELECTRIC ELEMENTS