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H01L2224/7999

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/7999for disconnecting

Industries

Patents Grantslast 30 patents

Information Patent Grant
Substrate debonding from bonded part
- Patent number 12,040,311
- Issue date Jul 16, 2024
- The Boeing Company
- Peter D. Brewer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing apparatus, operation method thereof, and method for m...
- Patent number 11,791,305
- Issue date Oct 17, 2023
- Kioxia Corporation
- Sho Kawadahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder removal from semiconductor devices
- Patent number 11,745,281
- Issue date Sep 5, 2023
- Micron Technology, Inc.
- Mark E. Tuttle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-beam laser de-bonding apparatus and method thereof
- Patent number 11,699,676
- Issue date Jul 11, 2023
- LASERSSEL CO., LTD.
- Jae-Joon Choi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High speed handling of ultra-small chips by selective laser bonding...
- Patent number 11,222,862
- Issue date Jan 11, 2022
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder removal from semiconductor devices
- Patent number 11,020,811
- Issue date Jun 1, 2021
- Micron Technology, Inc.
- Mark E. Tuttle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device for severing a microchip from a wafer and arrangi...
- Patent number 10,497,589
- Issue date Dec 3, 2019
- Jenoptik Optical Systems GmbH
- Meik Panitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High speed handling of ultra-small chips by selective laser bonding...
- Patent number 10,490,525
- Issue date Nov 26, 2019
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer printed device repair
- Patent number 10,438,859
- Issue date Oct 8, 2019
- X-CELEPRINT LIMITED
- Ronald S. Cok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiresaw removal of microelectronics from printed circuit board
- Patent number 10,403,595
- Issue date Sep 3, 2019
- United States of America, as represented by the Secretary of the Navy
- Joel T. Harrison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder removal from semiconductor devices
- Patent number 10,307,850
- Issue date Jun 4, 2019
- Micron Technology, Inc.
- Mark E. Tuttle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for removing chip
- Patent number 9,881,893
- Issue date Jan 30, 2018
- BOE Technology Group Co., Ltd.
- Guangyuan Cai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling method for electronic components
- Patent number 6,453,537
- Issue date Sep 24, 2002
- International Business Machines Corporation
- Craig G. Heim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling structure for electronic components
- Patent number 6,034,875
- Issue date Mar 7, 2000
- International Business Machines Corporation
- Craig G. Heim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for removing known good die using hot shear pr...
- Patent number 5,961,026
- Issue date Oct 5, 1999
- International Business Machines Corporation
- David Charles Olson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Step and repeat exposure method for loosening integrated circuit di...
- Patent number 5,827,394
- Issue date Oct 27, 1998
- Vanguard International Semiconductor Corporation
- Chih-Yuan Lu
- B32 - LAYERED PRODUCTS
Information Patent Grant
Apparatus and method for removing known good die using hot shear pr...
- Patent number 5,738,267
- Issue date Apr 14, 1998
- International Business Machines Corporation
- David Charles Olson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for removing known good die using hot shear pr...
- Patent number 5,707,000
- Issue date Jan 13, 1998
- International Business Machines Corporation
- David Charles Olson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for removing known good die using hot shear pr...
- Patent number 5,636,781
- Issue date Jun 10, 1997
- International Business Machines Corporation
- David C. Olson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for removing known good die using hot shear pr...
- Patent number 5,556,024
- Issue date Sep 17, 1996
- International Business Machines Corporation
- David C. Olson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for removing components bonded to a substrate
- Patent number 5,154,793
- Issue date Oct 13, 1992
- General Electric Company
- Robert J. Wojnarowski
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Cryogenic chip removal technique
- Patent number 4,274,576
- Issue date Jun 23, 1981
- International Business Machines Corporation
- Rafique S. Shariff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for the salvage and restoration of integrated circuits from...
- Patent number 4,270,260
- Issue date Jun 2, 1981
- Ellison F. Krueger
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS FOR DETACHING SUBSTRATE COMPONENTS AND SYSTEM FOR DETACHI...
- Publication number 20240284602
- Publication date Aug 22, 2024
- ASTEC IRIE CO., LTD.
- Taichi YOSHIMURA
- B09 - DISPOSAL OF SOLID WASTE RECLAMATION OF CONTAMINED SOIL SOIL
Information Patent Application
METHOD AND APPARATUS FOR TRIMMING MICRO ELECTRONIC ELEMENT
- Publication number 20240071992
- Publication date Feb 29, 2024
- PlayNitride Display Co., Ltd.
- Yen-Mu Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING APPARATUS, OPERATION METHOD THEREOF, AND METHOD FOR M...
- Publication number 20220262764
- Publication date Aug 18, 2022
- KIOXIA Corporation
- Sho KAWADAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER REMOVAL FROM SEMICONDUCTOR DEVICES
- Publication number 20210252621
- Publication date Aug 19, 2021
- Micron Technology, Inc.
- Mark E. Tuttle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-BEAM LASER DE-BONDING APPARATUS AND METHOD THEREOF
- Publication number 20200251442
- Publication date Aug 6, 2020
- LASERSSEL CO., LTD.
- Jae-Joon CHOI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
High Speed Handling of Ultra-Small Chips by Selective Laser Bonding...
- Publication number 20200051948
- Publication date Feb 13, 2020
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Speed Handling of Ultra-Small Chips by Selective Laser Bonding...
- Publication number 20190348392
- Publication date Nov 14, 2019
- International Business Machines Corporation
- Qianwen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER REMOVAL FROM SEMICONDUCTOR DEVICES
- Publication number 20190061034
- Publication date Feb 28, 2019
- Micron Technology, Inc.
- Mark E. Tuttle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DECOUPLING SYSTEMS AND METHODS FOR SAME
- Publication number 20180286832
- Publication date Oct 4, 2018
- Intel Corporation
- Bassam M. Ziadeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER PRINTED DEVICE REPAIR
- Publication number 20180174932
- Publication date Jun 21, 2018
- X-Celeprint Limited
- Ronald S. Cok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BULK SOLDER REMOVAL ON PROCESSOR PACKAGING
- Publication number 20170179066
- Publication date Jun 22, 2017
- Russell S. Aoki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS FOR REMOVING CHIP
- Publication number 20170110433
- Publication date Apr 20, 2017
- BOE TECHNOLOGY GROUP CO., LTD.
- Guangyuan Cai
- B32 - LAYERED PRODUCTS
Information Patent Application
DEBONDER TO MANUFACTURE SEMICONDUCTOR AND DEBONDING METHOD THEREOF
- Publication number 20120234497
- Publication date Sep 20, 2012
- Samsung Electronics Co., Ltd.
- Il Young Han
- H01 - BASIC ELECTRIC ELEMENTS

for disconnecting

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Substrate debonding from bonded part

Manufacturing apparatus, operation method thereof, and method for m...

Solder removal from semiconductor devices

Multi-beam laser de-bonding apparatus and method thereof

High speed handling of ultra-small chips by selective laser bonding...

Solder removal from semiconductor devices

Method and device for severing a microchip from a wafer and arrangi...

High speed handling of ultra-small chips by selective laser bonding...

Transfer printed device repair

Wiresaw removal of microelectronics from printed circuit board

Solder removal from semiconductor devices

Apparatus for removing chip

Cooling method for electronic components

Cooling structure for electronic components

Apparatus and method for removing known good die using hot shear pr...

Step and repeat exposure method for loosening integrated circuit di...

Apparatus and method for removing known good die using hot shear pr...

Apparatus and method for removing known good die using hot shear pr...

Apparatus and method for removing known good die using hot shear pr...

Apparatus and method for removing known good die using hot shear pr...

Method and apparatus for removing components bonded to a substrate

Cryogenic chip removal technique

Method for the salvage and restoration of integrated circuits from...

Patents Applicationslast 30 patents

APPARATUS FOR DETACHING SUBSTRATE COMPONENTS AND SYSTEM FOR DETACHI...

METHOD AND APPARATUS FOR TRIMMING MICRO ELECTRONIC ELEMENT

MANUFACTURING APPARATUS, OPERATION METHOD THEREOF, AND METHOD FOR M...

SOLDER REMOVAL FROM SEMICONDUCTOR DEVICES

MULTI-BEAM LASER DE-BONDING APPARATUS AND METHOD THEREOF

High Speed Handling of Ultra-Small Chips by Selective Laser Bonding...

High Speed Handling of Ultra-Small Chips by Selective Laser Bonding...

SOLDER REMOVAL FROM SEMICONDUCTOR DEVICES

DECOUPLING SYSTEMS AND METHODS FOR SAME

TRANSFER PRINTED DEVICE REPAIR

BULK SOLDER REMOVAL ON PROCESSOR PACKAGING

APPARATUS FOR REMOVING CHIP

DEBONDER TO MANUFACTURE SEMICONDUCTOR AND DEBONDING METHOD THEREOF