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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements

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H01L22/14for electrical parameters

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for forming semiconductor structure
- Patent number 12,300,551
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hsin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Autonomous operation of plasma processing tool
- Patent number 12,300,477
- Issue date May 13, 2025
- Tokyo Electron Limited
- Jun Shinagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of repairing through-electrodes, repair device performing th...
- Patent number 12,283,529
- Issue date Apr 22, 2025
- Samsung Electronics Co., Ltd.
- Sungho Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,283,570
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test circuit of semiconductor apparatus and test system including t...
- Patent number 12,283,533
- Issue date Apr 22, 2025
- SK Hynix Inc.
- Jong Seok Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, and method for manufacturing semiconductor de...
- Patent number 12,278,262
- Issue date Apr 15, 2025
- Rohm Co., Ltd.
- Katsuhisa Nagao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Benchmark device on a semiconductor wafer with fuse element
- Patent number 12,272,642
- Issue date Apr 8, 2025
- NANYA TECHNOLOGY CORPORATION
- Yi-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mosaic focal plane array
- Patent number 12,261,186
- Issue date Mar 25, 2025
- Raytheon Company
- David J. Gulbransen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of detecting bonding between a bonding wire and a bonding l...
- Patent number 12,255,109
- Issue date Mar 18, 2025
- Kulicke and Soffa Industries, Inc.
- Gary S. Gillotti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment method and alignment device
- Patent number 12,255,113
- Issue date Mar 18, 2025
- STAR TECHNOLOGIES (WUHAN) CO., LTD.
- Choon Leong Lou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of detecting bonding between a bonding wire and a bonding l...
- Patent number 12,255,172
- Issue date Mar 18, 2025
- Kulicke and Soffa Industries, Inc.
- Gary S. Gillotti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ion implantation method and ion implanter
- Patent number 12,255,046
- Issue date Mar 18, 2025
- Sumitomo Heavy Industries Ion Technology Co., Ltd.
- Yoji Kawasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming testing module and method for using the same
- Patent number 12,243,787
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of detecting connection issues between a wire bonding tool...
- Patent number 12,235,302
- Issue date Feb 25, 2025
- Kulicke and Soffa Industries, Inc.
- Dominick Albert DeAngelis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of fabricating the same
- Patent number 12,232,407
- Issue date Feb 18, 2025
- Samsung Display Co., Ltd.
- Won-Kyu Kwak
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Interferometer systems and methods for real time etch process compe...
- Patent number 12,218,015
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chansyun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and method of forming the same
- Patent number 12,218,105
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Impedance measurement jig and method of controlling a substrate-pro...
- Patent number 12,210,045
- Issue date Jan 28, 2025
- Samsung Electronics Co., Ltd.
- Byeongsang Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wafer level testing of optical components
- Patent number 12,211,755
- Issue date Jan 28, 2025
- II-VI DELAWARE, INC.
- Shiyun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit test method and structure thereof
- Patent number 12,205,853
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,205,854
- Issue date Jan 21, 2025
- Innolux Corporation
- Yeong-E Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test method of storage device implemented in multi-chip package (MC...
- Patent number 12,205,852
- Issue date Jan 21, 2025
- Samsung Electronics Co., Ltd.
- Sangmin An
- G11 - INFORMATION STORAGE
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 12,199,058
- Issue date Jan 14, 2025
- VueReal Inc.
- Gholamreza Chaji
- G01 - MEASURING TESTING
Information Patent Grant
Execution device and execution method
- Patent number 12,198,954
- Issue date Jan 14, 2025
- Tokyo Electron Limited
- Kippei Sugita
- G01 - MEASURING TESTING
Information Patent Grant
Package structure
- Patent number 12,191,287
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for evaluating semiconductor substrate
- Patent number 12,183,641
- Issue date Dec 31, 2024
- Shin-Etsu Handotai Co., Ltd.
- Tsuyoshi Ohtsuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit filler and method thereof
- Patent number 12,183,729
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tseng Chin Lo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor chip integrated device manufacturing method, semicond...
- Patent number 12,176,463
- Issue date Dec 24, 2024
- ULDTEC CO., LTD.
- Motonobu Takeya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and methods for bonding tested wafers and t...
- Patent number 12,176,320
- Issue date Dec 24, 2024
- AP Memory Technology Corporation
- Wenliang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for measuring semiconductor multilayer structure...
- Patent number 12,165,931
- Issue date Dec 10, 2024
- SHANGHAI ASPIRING SEMICONDUCTOR EQUIPMENT CO., LTD.
- Chongji Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WAFER ACCEPTANCE TEST TOOL AND TEST METHOD USING THEREOF
- Publication number 20250155491
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jin YAO
- G01 - MEASURING TESTING
Information Patent Application
INTEGRATED CIRCUIT PAD WITH MULTIPLE PROBING AREAS AND METHOD OF PR...
- Publication number 20250157860
- Publication date May 15, 2025
- STMicroelectronics International N.V.
- Alberto PAGANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOSAIC FOCAL PLANE ARRAY
- Publication number 20250151444
- Publication date May 8, 2025
- Raytheon Company
- David J. Gulbransen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SYSTEM AND METHOD FOR MANUFACTURING AND OPERATING THE...
- Publication number 20250140617
- Publication date May 1, 2025
- INNOSCIENCE (SUZHOU) SEMICONDUCTOR CO., LTD.
- Shan YIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIXEL ARRAY SUBSTRATE AND FABRICATION METHOD OF DISPLAY DEVICE
- Publication number 20250140618
- Publication date May 1, 2025
- AUO Corporation
- Shu-Yen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SYSTEM AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250140616
- Publication date May 1, 2025
- INNOSCIENCE (SUZHOU) SEMICONDUCTOR CO., LTD.
- Shan YIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSPECTION METHOD AND METHOD OF MANUFACTURING IMAGING ELEMENT
- Publication number 20250130277
- Publication date Apr 24, 2025
- Panasonic Intellectual Property Management Co., Ltd.
- SHINICHI MACHIDA
- G01 - MEASURING TESTING
Information Patent Application
SACRIFICIAL TEST PAD
- Publication number 20250132208
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Ting Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL TESTING OF OPTICAL COMPONENTS
- Publication number 20250125199
- Publication date Apr 17, 2025
- II-VI Delaware, Inc.
- Shiyun Lin
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250118605
- Publication date Apr 10, 2025
- InnoLux Corporation
- Yeong-E CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MISALIGNMENT MEASUREMENT METHOD FOR SEMICO...
- Publication number 20250105062
- Publication date Mar 27, 2025
- LAPIS Semiconductor Co., Ltd.
- Takumi TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD AND TEST METHOD OF POWER MODULE
- Publication number 20250105063
- Publication date Mar 27, 2025
- Hyundai Motor Company
- Tae Woo KWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical Performance Prediction Based On Structural Measurements...
- Publication number 20250105064
- Publication date Mar 27, 2025
- KLA Corporation
- Zhengquan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF TESTING THE SAME
- Publication number 20250096047
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- YEONGSEON KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, RESISTIVE DEVICE, AND METHOD OF OBTAINING ELE...
- Publication number 20250096119
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- WEI-LIN LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR SILICON PHOTONICS TESTING
- Publication number 20250085193
- Publication date Mar 13, 2025
- Marvell Asia Pte Ltd.
- Andrew YICK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING PACKAGE STRUCTURE
- Publication number 20250087648
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jing-Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE INSPECTION APPARATUS
- Publication number 20250076360
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Daesung JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250081668
- Publication date Mar 6, 2025
- XINTEC INC.
- Wei-Luen SUEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER AND OPERATING METHOD OF TEST CIRCUIT OF SEMICON...
- Publication number 20250069961
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Jinyong Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED ELECTRICAL AND OPTICAL APPARATUS FOR ELECTRICAL CHARACTE...
- Publication number 20250072297
- Publication date Feb 27, 2025
- International Business Machines Corporation
- Russell A. Budd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR CARVING PROBED METROLOGY
- Publication number 20250067791
- Publication date Feb 27, 2025
- ARIZONA BOARD OF REGENTS ON BEHALF OF ARIZONA STATE UNIVERSITY
- Umberto Celano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER AND METHOD OF WAFER THINNING
- Publication number 20250062114
- Publication date Feb 20, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Test Apparatus For Flip-Chip Micro-Light Emitting Diode (LED) Devices
- Publication number 20250038154
- Publication date Jan 30, 2025
- Lumileds LLC
- Wee-Hong Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSERS, SEMICONDUCTOR PACKAGES AND METHODS OF PRODUCING THE SAME
- Publication number 20250029930
- Publication date Jan 23, 2025
- TOPPAN Holdings Inc.
- Fusao TAKAGI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250031455
- Publication date Jan 23, 2025
- Advantest Corporation
- Shinji SUGATANI
- G11 - INFORMATION STORAGE
Information Patent Application
POWER AMPLIFIER SYSTEMS INCLUDING CONTROL INTERFACE AND WIRE BOND PAD
- Publication number 20250030386
- Publication date Jan 23, 2025
- Skyworks Solutions, Inc.
- Weimin Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR DETECTING DEFECTS IN SEMICONDUCTOR STRUCTURE AND METHOD...
- Publication number 20250028253
- Publication date Jan 23, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- YEN-FONG CHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20250015030
- Publication date Jan 9, 2025
- VueReal Inc.
- Gholamreza CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPERCONDUCTING MATERIALS, DEVICES, AND PROCESSES
- Publication number 20250006819
- Publication date Jan 2, 2025
- Board of Trustees of Western Michigan University
- Robert A. Makin
- H01 - BASIC ELECTRIC ELEMENTS

for electrical parameters

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for forming semiconductor structure

Autonomous operation of plasma processing tool

Method of repairing through-electrodes, repair device performing th...

Package structure

Test circuit of semiconductor apparatus and test system including t...

Semiconductor device, and method for manufacturing semiconductor de...

Benchmark device on a semiconductor wafer with fuse element

Mosaic focal plane array

Methods of detecting bonding between a bonding wire and a bonding l...

Alignment method and alignment device

Methods of detecting bonding between a bonding wire and a bonding l...

Ion implantation method and ion implanter

Method of forming testing module and method for using the same

Methods of detecting connection issues between a wire bonding tool...

Display device and method of fabricating the same

Interferometer systems and methods for real time etch process compe...

Package and method of forming the same

Impedance measurement jig and method of controlling a substrate-pro...

Wafer level testing of optical components

Integrated circuit test method and structure thereof

Electronic device

Test method of storage device implemented in multi-chip package (MC...

Selective micro device transfer to receiver substrate

Execution device and execution method

Package structure

Method for evaluating semiconductor substrate

Integrated circuit filler and method thereof

Semiconductor chip integrated device manufacturing method, semicond...

Semiconductor structure and methods for bonding tested wafers and t...

Method and device for measuring semiconductor multilayer structure...

Patents Applicationslast 30 patents

WAFER ACCEPTANCE TEST TOOL AND TEST METHOD USING THEREOF

INTEGRATED CIRCUIT PAD WITH MULTIPLE PROBING AREAS AND METHOD OF PR...

MOSAIC FOCAL PLANE ARRAY

SEMICONDUCTOR SYSTEM AND METHOD FOR MANUFACTURING AND OPERATING THE...

PIXEL ARRAY SUBSTRATE AND FABRICATION METHOD OF DISPLAY DEVICE

SEMICONDUCTOR SYSTEM AND METHOD FOR MANUFACTURING THE SAME

INSPECTION METHOD AND METHOD OF MANUFACTURING IMAGING ELEMENT

SACRIFICIAL TEST PAD

WAFER LEVEL TESTING OF OPTICAL COMPONENTS

ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE AND MISALIGNMENT MEASUREMENT METHOD FOR SEMICO...

MANUFACTURING METHOD AND TEST METHOD OF POWER MODULE

Electrical Performance Prediction Based On Structural Measurements...

SEMICONDUCTOR PACKAGE AND METHOD OF TESTING THE SAME

SEMICONDUCTOR DEVICE, RESISTIVE DEVICE, AND METHOD OF OBTAINING ELE...

METHOD AND APPARATUS FOR SILICON PHOTONICS TESTING

METHOD FOR FORMING PACKAGE STRUCTURE

SUBSTRATE INSPECTION APPARATUS

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR WAFER AND OPERATING METHOD OF TEST CIRCUIT OF SEMICON...

INTEGRATED ELECTRICAL AND OPTICAL APPARATUS FOR ELECTRICAL CHARACTE...

SYSTEMS AND METHODS FOR CARVING PROBED METROLOGY

SEMICONDUCTOR WAFER AND METHOD OF WAFER THINNING

Test Apparatus For Flip-Chip Micro-Light Emitting Diode (LED) Devices

INTERPOSERS, SEMICONDUCTOR PACKAGES AND METHODS OF PRODUCING THE SAME

THREE-DIMENSIONAL DEVICE AND MANUFACTURING METHOD THEREOF

POWER AMPLIFIER SYSTEMS INCLUDING CONTROL INTERFACE AND WIRE BOND PAD

METHOD FOR DETECTING DEFECTS IN SEMICONDUCTOR STRUCTURE AND METHOD...

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

SUPERCONDUCTING MATERIALS, DEVICES, AND PROCESSES