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H01L22/14

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements

Current Industry

H01L22/14for electrical parameters

Industries

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Patents Grantslast 30 patents

Information Patent Grant
In-line device electrical property estimating method and test struc...
- Patent number 12,360,153
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Chen-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a chip package
- Patent number 12,362,178
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package geometries to enable visual inspection of solder fillets
- Patent number 12,354,918
- Issue date Jul 8, 2025
- Texas Instruments Incorporated
- LongTing Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of package circuit
- Patent number 12,354,919
- Issue date Jul 8, 2025
- INNOLUX CORPORATION
- Yeong-E Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Training method for semiconductor process prediction model, semicon...
- Patent number 12,339,632
- Issue date Jun 24, 2025
- United Microelectronics Corp.
- Chia-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming same
- Patent number 12,334,465
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Li-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Measuring method of resistivity of a wafer
- Patent number 12,334,403
- Issue date Jun 17, 2025
- ZING SEMICONDUCTOR CORPORATION
- Xing Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through substrate via (TSV) validation structure for an integrated...
- Patent number 12,334,416
- Issue date Jun 17, 2025
- NXP USA, INC.
- Darrell Glenn Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for automatic diagnostics and monitoring of semiconductor de...
- Patent number 12,332,182
- Issue date Jun 17, 2025
- KLA Corporation
- David W. Price
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Preheating control system, preheating control method and non-transi...
- Patent number 12,332,279
- Issue date Jun 17, 2025
- NANYA TECHNOLOGY CORPORATION
- Tien Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through vias with test structure
- Patent number 12,334,415
- Issue date Jun 17, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Tzung-Han Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,322,708
- Issue date Jun 3, 2025
- Renesas Electronics Corporation
- Takehirou Mariko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adaptive control of variability in device performance in advanced s...
- Patent number 12,322,618
- Issue date Jun 3, 2025
- Applied Materials, Inc.
- Samer Banna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shifted via-chain electrical-test measurements for hybrid bonding a...
- Patent number 12,322,661
- Issue date Jun 3, 2025
- Tokyo Electron Limited
- Kevin Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,322,742
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsiang-Tai Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor structure
- Patent number 12,300,551
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hsin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Autonomous operation of plasma processing tool
- Patent number 12,300,477
- Issue date May 13, 2025
- Tokyo Electron Limited
- Jun Shinagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of repairing through-electrodes, repair device performing th...
- Patent number 12,283,529
- Issue date Apr 22, 2025
- Samsung Electronics Co., Ltd.
- Sungho Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,283,570
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test circuit of semiconductor apparatus and test system including t...
- Patent number 12,283,533
- Issue date Apr 22, 2025
- SK Hynix Inc.
- Jong Seok Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, and method for manufacturing semiconductor de...
- Patent number 12,278,262
- Issue date Apr 15, 2025
- Rohm Co., Ltd.
- Katsuhisa Nagao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Benchmark device on a semiconductor wafer with fuse element
- Patent number 12,272,642
- Issue date Apr 8, 2025
- NANYA TECHNOLOGY CORPORATION
- Yi-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mosaic focal plane array
- Patent number 12,261,186
- Issue date Mar 25, 2025
- Raytheon Company
- David J. Gulbransen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of detecting bonding between a bonding wire and a bonding l...
- Patent number 12,255,109
- Issue date Mar 18, 2025
- Kulicke and Soffa Industries, Inc.
- Gary S. Gillotti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment method and alignment device
- Patent number 12,255,113
- Issue date Mar 18, 2025
- STAR TECHNOLOGIES (WUHAN) CO., LTD.
- Choon Leong Lou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of detecting bonding between a bonding wire and a bonding l...
- Patent number 12,255,172
- Issue date Mar 18, 2025
- Kulicke and Soffa Industries, Inc.
- Gary S. Gillotti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ion implantation method and ion implanter
- Patent number 12,255,046
- Issue date Mar 18, 2025
- Sumitomo Heavy Industries Ion Technology Co., Ltd.
- Yoji Kawasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming testing module and method for using the same
- Patent number 12,243,787
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of detecting connection issues between a wire bonding tool...
- Patent number 12,235,302
- Issue date Feb 25, 2025
- Kulicke and Soffa Industries, Inc.
- Dominick Albert DeAngelis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of fabricating the same
- Patent number 12,232,407
- Issue date Feb 18, 2025
- Samsung Display Co., Ltd.
- Won-Kyu Kwak
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS

Patents Applicationslast 30 patents

Information Patent Application
DISPLAY APPARATUS, METHOD OF MANUFACTURING DISPLAY APPARATUS, AND M...
- Publication number 20250241149
- Publication date Jul 24, 2025
- SAMSUNG DISPLAY CO., LTD.
- Yujin Sin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR EVALUATING INFLUENCE OF PROCESS ON SEMICON...
- Publication number 20250233027
- Publication date Jul 17, 2025
- SK HYNIX INC.
- Seong Joo Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250233026
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Hui LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF REPAIRING THROUGH-ELECTRODES, REPAIR DEVICE PERFORMING TH...
- Publication number 20250226268
- Publication date Jul 10, 2025
- Samsung Electronics Co., Ltd.
- Sungho Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST PAD STRUCTURE AND METHOD OF MANUFACTURING AND OPERATING THE SAME
- Publication number 20250226269
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- MING-CHUNG WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250219023
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANALYSIS METHOD FOR SEMICONDUCTOR DEVICE, AND ANALYSIS DEVICE THEREFOR
- Publication number 20250218874
- Publication date Jul 3, 2025
- Dongguk University Industry-Academic Cooperation Foundation
- Kwunbum CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSPECTION METHOD FOR LIGHT EMITTING ELEMENT, MANUFACTURING METHOD...
- Publication number 20250208189
- Publication date Jun 26, 2025
- SAMSUNG DISPLAY CO., LTD.
- Chan Woo JOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SKELETON ETCH FOR SEMICONDUCTOR CHIPS
- Publication number 20250201707
- Publication date Jun 19, 2025
- Intel Corporation
- Shida TAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20250203962
- Publication date Jun 19, 2025
- ROHM CO., LTD.
- Katsuhisa NAGAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250201772
- Publication date Jun 19, 2025
- SK HYNIX INC.
- Heon Yong CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND METHODS FOR TESTING DIES WITH OFF-DIE CLOCKS
- Publication number 20250201637
- Publication date Jun 19, 2025
- ADVANCED MICRO DEVICES, INC.
- Russell Schreiber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE TRANSFER OF MICRO DEVICES
- Publication number 20250176105
- Publication date May 29, 2025
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die-Level Parametric Prediction Boosting Method and System for Impr...
- Publication number 20250174497
- Publication date May 29, 2025
- MEDIATEK INC.
- Chin-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE, ELECTRONIC COMPONENT, METHOD FOR MANUFACTURING E...
- Publication number 20250176299
- Publication date May 29, 2025
- Canon Kabushiki Kaisha
- Hidemasa Oshige
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die-Level Parametric Prediction Boosting Method and Die-Level Param...
- Publication number 20250174498
- Publication date May 29, 2025
- MEDIATEK INC.
- Chin-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROBING BUMP PLACEMENT OVER MULTIPLE VIA OPENINGS
- Publication number 20250174501
- Publication date May 29, 2025
- Xilinx, Inc.
- Andy WIDJAJA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRODEVICE TRANSFER SETUP AND INTEGRATION OF MICRO-DEVICES INTO SY...
- Publication number 20250167171
- Publication date May 22, 2025
- VueReal Inc.
- Gholamreza CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROUP III NITRIDE TRANSISTOR DEVICE AND METHOD FOR FABRICATING A GR...
- Publication number 20250167116
- Publication date May 22, 2025
- Infineon Technologies Austria AG
- Herbert Gietler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRODEVICE TRANSFER SETUP AND INTEGRATION OF MICRO-DEVICES INTO SY...
- Publication number 20250167172
- Publication date May 22, 2025
- VueReal Inc.
- Gholamreza CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER ACCEPTANCE TEST TOOL AND TEST METHOD USING THEREOF
- Publication number 20250155491
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jin YAO
- G01 - MEASURING TESTING
Information Patent Application
INTEGRATED CIRCUIT PAD WITH MULTIPLE PROBING AREAS AND METHOD OF PR...
- Publication number 20250157860
- Publication date May 15, 2025
- STMicroelectronics International N.V.
- Alberto PAGANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOSAIC FOCAL PLANE ARRAY
- Publication number 20250151444
- Publication date May 8, 2025
- Raytheon Company
- David J. Gulbransen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SYSTEM AND METHOD FOR MANUFACTURING AND OPERATING THE...
- Publication number 20250140617
- Publication date May 1, 2025
- INNOSCIENCE (SUZHOU) SEMICONDUCTOR CO., LTD.
- Shan YIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIXEL ARRAY SUBSTRATE AND FABRICATION METHOD OF DISPLAY DEVICE
- Publication number 20250140618
- Publication date May 1, 2025
- AUO Corporation
- Shu-Yen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SYSTEM AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250140616
- Publication date May 1, 2025
- INNOSCIENCE (SUZHOU) SEMICONDUCTOR CO., LTD.
- Shan YIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSPECTION METHOD AND METHOD OF MANUFACTURING IMAGING ELEMENT
- Publication number 20250130277
- Publication date Apr 24, 2025
- Panasonic Intellectual Property Management Co., Ltd.
- SHINICHI MACHIDA
- G01 - MEASURING TESTING
Information Patent Application
SACRIFICIAL TEST PAD
- Publication number 20250132208
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Ting Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL TESTING OF OPTICAL COMPONENTS
- Publication number 20250125199
- Publication date Apr 17, 2025
- II-VI Delaware, Inc.
- Shiyun Lin
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250118605
- Publication date Apr 10, 2025
- InnoLux Corporation
- Yeong-E CHEN
- H01 - BASIC ELECTRIC ELEMENTS

for electrical parameters

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

In-line device electrical property estimating method and test struc...

Method for fabricating a chip package

Package geometries to enable visual inspection of solder fillets

Manufacturing method of package circuit

Training method for semiconductor process prediction model, semicon...

Semiconductor package and method of forming same

Measuring method of resistivity of a wafer

Through substrate via (TSV) validation structure for an integrated...

System for automatic diagnostics and monitoring of semiconductor de...

Preheating control system, preheating control method and non-transi...

Through vias with test structure

Semiconductor device

Adaptive control of variability in device performance in advanced s...

Shifted via-chain electrical-test measurements for hybrid bonding a...

Semiconductor structure and manufacturing method thereof

Method for forming semiconductor structure

Autonomous operation of plasma processing tool

Method of repairing through-electrodes, repair device performing th...

Package structure

Test circuit of semiconductor apparatus and test system including t...

Semiconductor device, and method for manufacturing semiconductor de...

Benchmark device on a semiconductor wafer with fuse element

Mosaic focal plane array

Methods of detecting bonding between a bonding wire and a bonding l...

Alignment method and alignment device

Methods of detecting bonding between a bonding wire and a bonding l...

Ion implantation method and ion implanter

Method of forming testing module and method for using the same

Methods of detecting connection issues between a wire bonding tool...

Display device and method of fabricating the same

Patents Applicationslast 30 patents

DISPLAY APPARATUS, METHOD OF MANUFACTURING DISPLAY APPARATUS, AND M...

METHOD AND APPARATUS FOR EVALUATING INFLUENCE OF PROCESS ON SEMICON...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

METHOD OF REPAIRING THROUGH-ELECTRODES, REPAIR DEVICE PERFORMING TH...

TEST PAD STRUCTURE AND METHOD OF MANUFACTURING AND OPERATING THE SAME

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

ANALYSIS METHOD FOR SEMICONDUCTOR DEVICE, AND ANALYSIS DEVICE THEREFOR

INSPECTION METHOD FOR LIGHT EMITTING ELEMENT, MANUFACTURING METHOD...

SKELETON ETCH FOR SEMICONDUCTOR CHIPS

SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DE...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

DEVICES AND METHODS FOR TESTING DIES WITH OFF-DIE CLOCKS

SELECTIVE TRANSFER OF MICRO DEVICES

Die-Level Parametric Prediction Boosting Method and System for Impr...

ELECTRONIC DEVICE, ELECTRONIC COMPONENT, METHOD FOR MANUFACTURING E...

Die-Level Parametric Prediction Boosting Method and Die-Level Param...

PROBING BUMP PLACEMENT OVER MULTIPLE VIA OPENINGS

MICRODEVICE TRANSFER SETUP AND INTEGRATION OF MICRO-DEVICES INTO SY...

GROUP III NITRIDE TRANSISTOR DEVICE AND METHOD FOR FABRICATING A GR...

MICRODEVICE TRANSFER SETUP AND INTEGRATION OF MICRO-DEVICES INTO SY...

WAFER ACCEPTANCE TEST TOOL AND TEST METHOD USING THEREOF

INTEGRATED CIRCUIT PAD WITH MULTIPLE PROBING AREAS AND METHOD OF PR...

MOSAIC FOCAL PLANE ARRAY

SEMICONDUCTOR SYSTEM AND METHOD FOR MANUFACTURING AND OPERATING THE...

PIXEL ARRAY SUBSTRATE AND FABRICATION METHOD OF DISPLAY DEVICE

SEMICONDUCTOR SYSTEM AND METHOD FOR MANUFACTURING THE SAME

INSPECTION METHOD AND METHOD OF MANUFACTURING IMAGING ELEMENT

SACRIFICIAL TEST PAD

WAFER LEVEL TESTING OF OPTICAL COMPONENTS

ELECTRONIC DEVICE