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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements

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H01L22/14for electrical parameters

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Interferometer systems and methods for real time etch process compe...
- Patent number 12,218,015
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chansyun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and method of forming the same
- Patent number 12,218,105
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level testing of optical components
- Patent number 12,211,755
- Issue date Jan 28, 2025
- II-VI DELAWARE, INC.
- Shiyun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Impedance measurement jig and method of controlling a substrate-pro...
- Patent number 12,210,045
- Issue date Jan 28, 2025
- Samsung Electronics Co., Ltd.
- Byeongsang Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integrated circuit test method and structure thereof
- Patent number 12,205,853
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,205,854
- Issue date Jan 21, 2025
- Innolux Corporation
- Yeong-E Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test method of storage device implemented in multi-chip package (MC...
- Patent number 12,205,852
- Issue date Jan 21, 2025
- Samsung Electronics Co., Ltd.
- Sangmin An
- G11 - INFORMATION STORAGE
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 12,199,058
- Issue date Jan 14, 2025
- VueReal Inc.
- Gholamreza Chaji
- G01 - MEASURING TESTING
Information Patent Grant
Execution device and execution method
- Patent number 12,198,954
- Issue date Jan 14, 2025
- Tokyo Electron Limited
- Kippei Sugita
- G01 - MEASURING TESTING
Information Patent Grant
Package structure
- Patent number 12,191,287
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for evaluating semiconductor substrate
- Patent number 12,183,641
- Issue date Dec 31, 2024
- Shin-Etsu Handotai Co., Ltd.
- Tsuyoshi Ohtsuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit filler and method thereof
- Patent number 12,183,729
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tseng Chin Lo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor chip integrated device manufacturing method, semicond...
- Patent number 12,176,463
- Issue date Dec 24, 2024
- ULDTEC CO., LTD.
- Motonobu Takeya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and methods for bonding tested wafers and t...
- Patent number 12,176,320
- Issue date Dec 24, 2024
- AP Memory Technology Corporation
- Wenliang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for measuring semiconductor multilayer structure...
- Patent number 12,165,931
- Issue date Dec 10, 2024
- SHANGHAI ASPIRING SEMICONDUCTOR EQUIPMENT CO., LTD.
- Chongji Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged current sensor integrated circuit
- Patent number 12,163,983
- Issue date Dec 10, 2024
- ALLEGRO MICROSYSTEMS, LLC
- Shixi Louis Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for measuring device inside through-silicon via s...
- Patent number 12,159,809
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shuo-Wen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transferring light-emitting diode and light-emitting bas...
- Patent number 12,155,003
- Issue date Nov 26, 2024
- HUIZHOU CHINA STAR OPTOELECTRONICS DISPLAY CO., LTD.
- Bo Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide semiconductor device, semiconductor package, and me...
- Patent number 12,154,834
- Issue date Nov 26, 2024
- Fuji Electric Co., Ltd.
- Makoto Utsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer and method of wafer thinning
- Patent number 12,154,783
- Issue date Nov 26, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-process wire bond testing using wire bonding apparatus
- Patent number 12,148,730
- Issue date Nov 19, 2024
- Atieva, Inc.
- Ben Carlson-Sypek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Defect measurement method
- Patent number 12,142,537
- Issue date Nov 12, 2024
- National Tsing Hua University
- Burn-Jeng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of semiconductor device and test method of semic...
- Patent number 12,142,538
- Issue date Nov 12, 2024
- Fuji Electric Co., Ltd.
- Atsushi Shoji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier modules including semiconductor resistor and tantal...
- Patent number 12,143,077
- Issue date Nov 12, 2024
- Skyworks Solutions, Inc.
- Peter J. Zampardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique for training neural network for use in in-situ monitoring...
- Patent number 12,136,574
- Issue date Nov 5, 2024
- Applied Materials, Inc.
- Kun Xu
- B24 - GRINDING POLISHING
Information Patent Grant
Manufacturing process with atomic level inspection
- Patent number 12,131,957
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- I-Che Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor structure and method of manufacturing the same
- Patent number 12,131,992
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monitoring copper corrosion in an integrated circuit device
- Patent number 12,130,241
- Issue date Oct 29, 2024
- Microchip Technology Incorporated
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor mounted wafer
- Patent number 12,131,958
- Issue date Oct 29, 2024
- E-TRON CO., LTD.
- Jeong Woon Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method for the same
- Patent number 12,119,299
- Issue date Oct 15, 2024
- Fuji Electric Co., Ltd.
- Sho Nakagawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Test Apparatus For Flip-Chip Micro-Light Emitting Diode (LED) Devices
- Publication number 20250038154
- Publication date Jan 30, 2025
- Lumileds LLC
- Wee-Hong Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSERS, SEMICONDUCTOR PACKAGES AND METHODS OF PRODUCING THE SAME
- Publication number 20250029930
- Publication date Jan 23, 2025
- TOPPAN Holdings Inc.
- Fusao TAKAGI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250031455
- Publication date Jan 23, 2025
- Advantest Corporation
- Shinji SUGATANI
- G11 - INFORMATION STORAGE
Information Patent Application
POWER AMPLIFIER SYSTEMS INCLUDING CONTROL INTERFACE AND WIRE BOND PAD
- Publication number 20250030386
- Publication date Jan 23, 2025
- Skyworks Solutions, Inc.
- Weimin Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR DETECTING DEFECTS IN SEMICONDUCTOR STRUCTURE AND METHOD...
- Publication number 20250028253
- Publication date Jan 23, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- YEN-FONG CHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20250015030
- Publication date Jan 9, 2025
- VueReal Inc.
- Gholamreza CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPERCONDUCTING MATERIALS, DEVICES, AND PROCESSES
- Publication number 20250006819
- Publication date Jan 2, 2025
- Board of Trustees of Western Michigan University
- Robert A. Makin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ON DIE FLEXURE CONTROL DEVICE AND METHOD
- Publication number 20240413031
- Publication date Dec 12, 2024
- Intel Corporation
- Chandru Periasamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MEASURING THICKNESS OF SEMICONDUCTOR WAFER AND INSPECTING...
- Publication number 20240413021
- Publication date Dec 12, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20240413012
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tzuan-Horng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MANU...
- Publication number 20240404892
- Publication date Dec 5, 2024
- Mitsubishi Electric Corporation
- Kazutoshi NAKASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ACHIEVING UNIFORM CARRIER CONCENTRATION IN EPITAXIAL LAY...
- Publication number 20240405076
- Publication date Dec 5, 2024
- KWANSEI GAKUIN EDUCATIONAL FOUNDATION
- Tadaaki KANEKO
- C30 - CRYSTAL GROWTH
Information Patent Application
ATOM PROBE TOMOGRAPHY SPECIMEN PREPARATION
- Publication number 20240395636
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Wei HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR MEASURING DEVICE INSIDE THROUGH-SILICON VIA S...
- Publication number 20240395640
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shuo-Wen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE, SYSTEM AND METHOD FOR VOLTAGE GENERATING
- Publication number 20240395641
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ya-Chin King
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STANDBY CURRENT DETECTION CIRCUIT
- Publication number 20240395635
- Publication date Nov 28, 2024
- WINBOND ELECTRONICS CORP.
- Bo-Lun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR REAL TIME ETCH PROCESS COMPENSATION CONTROL
- Publication number 20240395637
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chansyun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND TEST METHOD THEREOF
- Publication number 20240387297
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL TESTING OF SEMICONDUCTOR PACKAGES
- Publication number 20240387296
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ya Huei Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR DETECTING/MONITORING PROCESS CHARGING DAMAGE DUE TO M...
- Publication number 20240387298
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Yu Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE TRANSFER OF MICRO DEVICES
- Publication number 20240381531
- Publication date Nov 14, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES
- Publication number 20240371851
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING PROCESS WITH ATOMIC LEVEL INSPECTION
- Publication number 20240371707
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- I-Che Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TEST LINE STRUCTURE FOR INTEGRATED CHIP COMPRISING OPTICAL DEVICES
- Publication number 20240371710
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Lan-Chou Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRODEVICE TRANSFER SETUP AND INTEGRATION OF MICRO-DEVICES INTO SY...
- Publication number 20240363585
- Publication date Oct 31, 2024
- VueReal Inc.
- Gholamreza CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240365623
- Publication date Oct 31, 2024
- InnoLux Corporation
- Shun-Yuan HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM PEELING TEST STRUCTURE AND THIN FILM PEELING TEST METHOD...
- Publication number 20240363455
- Publication date Oct 31, 2024
- SK hynix system ic (Wuxi) Co., Ltd.
- Kyung Wook KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE FORMATION METHODS INCLUDING COUPLING A MOLDED ROUTING LAYER...
- Publication number 20240355697
- Publication date Oct 24, 2024
- Intel Corporation
- Lizabeth Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST APPARATUS FOR SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING...
- Publication number 20240345156
- Publication date Oct 17, 2024
- Mitsubishi Electric Corporation
- Takuya YOSHIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ION IMPLANTATION THAT ADJUSTS A TARGET'S TILT ANGLE BASE...
- Publication number 20240347341
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Jung HUANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

for electrical parameters

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Interferometer systems and methods for real time etch process compe...

Package and method of forming the same

Wafer level testing of optical components

Impedance measurement jig and method of controlling a substrate-pro...

Integrated circuit test method and structure thereof

Electronic device

Test method of storage device implemented in multi-chip package (MC...

Selective micro device transfer to receiver substrate

Execution device and execution method

Package structure

Method for evaluating semiconductor substrate

Integrated circuit filler and method thereof

Semiconductor chip integrated device manufacturing method, semicond...

Semiconductor structure and methods for bonding tested wafers and t...

Method and device for measuring semiconductor multilayer structure...

Packaged current sensor integrated circuit

System and method for measuring device inside through-silicon via s...

Method for transferring light-emitting diode and light-emitting bas...

Silicon carbide semiconductor device, semiconductor package, and me...

Semiconductor wafer and method of wafer thinning

In-process wire bond testing using wire bonding apparatus

Defect measurement method

Fabrication method of semiconductor device and test method of semic...

Power amplifier modules including semiconductor resistor and tantal...

Technique for training neural network for use in in-situ monitoring...

Manufacturing process with atomic level inspection

Semiconductor structure and method of manufacturing the same

Monitoring copper corrosion in an integrated circuit device

Sensor mounted wafer

Semiconductor device and manufacturing method for the same

Patents Applicationslast 30 patents

Test Apparatus For Flip-Chip Micro-Light Emitting Diode (LED) Devices

INTERPOSERS, SEMICONDUCTOR PACKAGES AND METHODS OF PRODUCING THE SAME

THREE-DIMENSIONAL DEVICE AND MANUFACTURING METHOD THEREOF

POWER AMPLIFIER SYSTEMS INCLUDING CONTROL INTERFACE AND WIRE BOND PAD

METHOD FOR DETECTING DEFECTS IN SEMICONDUCTOR STRUCTURE AND METHOD...

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

SUPERCONDUCTING MATERIALS, DEVICES, AND PROCESSES

ON DIE FLEXURE CONTROL DEVICE AND METHOD

METHOD OF MEASURING THICKNESS OF SEMICONDUCTOR WAFER AND INSPECTING...

Semiconductor Device and Method

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MANU...

METHOD FOR ACHIEVING UNIFORM CARRIER CONCENTRATION IN EPITAXIAL LAY...

ATOM PROBE TOMOGRAPHY SPECIMEN PREPARATION

SYSTEM AND METHOD FOR MEASURING DEVICE INSIDE THROUGH-SILICON VIA S...

DEVICE, SYSTEM AND METHOD FOR VOLTAGE GENERATING

STANDBY CURRENT DETECTION CIRCUIT

METHODS FOR REAL TIME ETCH PROCESS COMPENSATION CONTROL

SEMICONDUCTOR STRUCTURE AND TEST METHOD THEREOF

ELECTRICAL TESTING OF SEMICONDUCTOR PACKAGES

STRUCTURE FOR DETECTING/MONITORING PROCESS CHARGING DAMAGE DUE TO M...

SELECTIVE TRANSFER OF MICRO DEVICES

INTEGRATED CIRCUIT PACKAGES

MANUFACTURING PROCESS WITH ATOMIC LEVEL INSPECTION

TEST LINE STRUCTURE FOR INTEGRATED CHIP COMPRISING OPTICAL DEVICES

MICRODEVICE TRANSFER SETUP AND INTEGRATION OF MICRO-DEVICES INTO SY...

ELECTRONIC DEVICE

THIN FILM PEELING TEST STRUCTURE AND THIN FILM PEELING TEST METHOD...

PACKAGE FORMATION METHODS INCLUDING COUPLING A MOLDED ROUTING LAYER...

TEST APPARATUS FOR SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING...

METHOD FOR ION IMPLANTATION THAT ADJUSTS A TARGET'S TILT ANGLE BASE...