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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements

Current Industry

H01L22/14for electrical parameters

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Methods of detecting bonding between a bonding wire and a bonding l...
- Patent number 12,255,109
- Issue date Mar 18, 2025
- Kulicke and Soffa Industries, Inc.
- Gary S. Gillotti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment method and alignment device
- Patent number 12,255,113
- Issue date Mar 18, 2025
- STAR TECHNOLOGIES (WUHAN) CO., LTD.
- Choon Leong Lou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of detecting bonding between a bonding wire and a bonding l...
- Patent number 12,255,172
- Issue date Mar 18, 2025
- Kulicke and Soffa Industries, Inc.
- Gary S. Gillotti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ion implantation method and ion implanter
- Patent number 12,255,046
- Issue date Mar 18, 2025
- Sumitomo Heavy Industries Ion Technology Co., Ltd.
- Yoji Kawasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming testing module and method for using the same
- Patent number 12,243,787
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of detecting connection issues between a wire bonding tool...
- Patent number 12,235,302
- Issue date Feb 25, 2025
- Kulicke and Soffa Industries, Inc.
- Dominick Albert DeAngelis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of fabricating the same
- Patent number 12,232,407
- Issue date Feb 18, 2025
- Samsung Display Co., Ltd.
- Won-Kyu Kwak
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Interferometer systems and methods for real time etch process compe...
- Patent number 12,218,015
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chansyun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and method of forming the same
- Patent number 12,218,105
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Impedance measurement jig and method of controlling a substrate-pro...
- Patent number 12,210,045
- Issue date Jan 28, 2025
- Samsung Electronics Co., Ltd.
- Byeongsang Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wafer level testing of optical components
- Patent number 12,211,755
- Issue date Jan 28, 2025
- II-VI DELAWARE, INC.
- Shiyun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit test method and structure thereof
- Patent number 12,205,853
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,205,854
- Issue date Jan 21, 2025
- Innolux Corporation
- Yeong-E Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test method of storage device implemented in multi-chip package (MC...
- Patent number 12,205,852
- Issue date Jan 21, 2025
- Samsung Electronics Co., Ltd.
- Sangmin An
- G11 - INFORMATION STORAGE
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 12,199,058
- Issue date Jan 14, 2025
- VueReal Inc.
- Gholamreza Chaji
- G01 - MEASURING TESTING
Information Patent Grant
Execution device and execution method
- Patent number 12,198,954
- Issue date Jan 14, 2025
- Tokyo Electron Limited
- Kippei Sugita
- G01 - MEASURING TESTING
Information Patent Grant
Package structure
- Patent number 12,191,287
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for evaluating semiconductor substrate
- Patent number 12,183,641
- Issue date Dec 31, 2024
- Shin-Etsu Handotai Co., Ltd.
- Tsuyoshi Ohtsuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit filler and method thereof
- Patent number 12,183,729
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tseng Chin Lo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor chip integrated device manufacturing method, semicond...
- Patent number 12,176,463
- Issue date Dec 24, 2024
- ULDTEC CO., LTD.
- Motonobu Takeya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and methods for bonding tested wafers and t...
- Patent number 12,176,320
- Issue date Dec 24, 2024
- AP Memory Technology Corporation
- Wenliang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for measuring semiconductor multilayer structure...
- Patent number 12,165,931
- Issue date Dec 10, 2024
- SHANGHAI ASPIRING SEMICONDUCTOR EQUIPMENT CO., LTD.
- Chongji Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged current sensor integrated circuit
- Patent number 12,163,983
- Issue date Dec 10, 2024
- ALLEGRO MICROSYSTEMS, LLC
- Shixi Louis Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for measuring device inside through-silicon via s...
- Patent number 12,159,809
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shuo-Wen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transferring light-emitting diode and light-emitting bas...
- Patent number 12,155,003
- Issue date Nov 26, 2024
- HUIZHOU CHINA STAR OPTOELECTRONICS DISPLAY CO., LTD.
- Bo Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide semiconductor device, semiconductor package, and me...
- Patent number 12,154,834
- Issue date Nov 26, 2024
- Fuji Electric Co., Ltd.
- Makoto Utsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer and method of wafer thinning
- Patent number 12,154,783
- Issue date Nov 26, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-process wire bond testing using wire bonding apparatus
- Patent number 12,148,730
- Issue date Nov 19, 2024
- Atieva, Inc.
- Ben Carlson-Sypek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Defect measurement method
- Patent number 12,142,537
- Issue date Nov 12, 2024
- National Tsing Hua University
- Burn-Jeng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of semiconductor device and test method of semic...
- Patent number 12,142,538
- Issue date Nov 12, 2024
- Fuji Electric Co., Ltd.
- Atsushi Shoji
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND APPARATUS FOR SILICON PHOTONICS TESTING
- Publication number 20250085193
- Publication date Mar 13, 2025
- Marvell Asia Pte Ltd.
- Andrew YICK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING PACKAGE STRUCTURE
- Publication number 20250087648
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jing-Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE INSPECTION APPARATUS
- Publication number 20250076360
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Daesung JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250081668
- Publication date Mar 6, 2025
- XINTEC INC.
- Wei-Luen SUEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER AND OPERATING METHOD OF TEST CIRCUIT OF SEMICON...
- Publication number 20250069961
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Jinyong Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED ELECTRICAL AND OPTICAL APPARATUS FOR ELECTRICAL CHARACTE...
- Publication number 20250072297
- Publication date Feb 27, 2025
- International Business Machines Corporation
- Russell A. Budd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR CARVING PROBED METROLOGY
- Publication number 20250067791
- Publication date Feb 27, 2025
- ARIZONA BOARD OF REGENTS ON BEHALF OF ARIZONA STATE UNIVERSITY
- Umberto Celano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER AND METHOD OF WAFER THINNING
- Publication number 20250062114
- Publication date Feb 20, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Test Apparatus For Flip-Chip Micro-Light Emitting Diode (LED) Devices
- Publication number 20250038154
- Publication date Jan 30, 2025
- Lumileds LLC
- Wee-Hong Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSERS, SEMICONDUCTOR PACKAGES AND METHODS OF PRODUCING THE SAME
- Publication number 20250029930
- Publication date Jan 23, 2025
- TOPPAN Holdings Inc.
- Fusao TAKAGI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250031455
- Publication date Jan 23, 2025
- Advantest Corporation
- Shinji SUGATANI
- G11 - INFORMATION STORAGE
Information Patent Application
POWER AMPLIFIER SYSTEMS INCLUDING CONTROL INTERFACE AND WIRE BOND PAD
- Publication number 20250030386
- Publication date Jan 23, 2025
- Skyworks Solutions, Inc.
- Weimin Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR DETECTING DEFECTS IN SEMICONDUCTOR STRUCTURE AND METHOD...
- Publication number 20250028253
- Publication date Jan 23, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- YEN-FONG CHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20250015030
- Publication date Jan 9, 2025
- VueReal Inc.
- Gholamreza CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPERCONDUCTING MATERIALS, DEVICES, AND PROCESSES
- Publication number 20250006819
- Publication date Jan 2, 2025
- Board of Trustees of Western Michigan University
- Robert A. Makin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ON DIE FLEXURE CONTROL DEVICE AND METHOD
- Publication number 20240413031
- Publication date Dec 12, 2024
- Intel Corporation
- Chandru Periasamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MEASURING THICKNESS OF SEMICONDUCTOR WAFER AND INSPECTING...
- Publication number 20240413021
- Publication date Dec 12, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20240413012
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tzuan-Horng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MANU...
- Publication number 20240404892
- Publication date Dec 5, 2024
- Mitsubishi Electric Corporation
- Kazutoshi NAKASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ACHIEVING UNIFORM CARRIER CONCENTRATION IN EPITAXIAL LAY...
- Publication number 20240405076
- Publication date Dec 5, 2024
- KWANSEI GAKUIN EDUCATIONAL FOUNDATION
- Tadaaki KANEKO
- C30 - CRYSTAL GROWTH
Information Patent Application
ATOM PROBE TOMOGRAPHY SPECIMEN PREPARATION
- Publication number 20240395636
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Wei HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR MEASURING DEVICE INSIDE THROUGH-SILICON VIA S...
- Publication number 20240395640
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shuo-Wen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE, SYSTEM AND METHOD FOR VOLTAGE GENERATING
- Publication number 20240395641
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ya-Chin King
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STANDBY CURRENT DETECTION CIRCUIT
- Publication number 20240395635
- Publication date Nov 28, 2024
- WINBOND ELECTRONICS CORP.
- Bo-Lun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR REAL TIME ETCH PROCESS COMPENSATION CONTROL
- Publication number 20240395637
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chansyun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND TEST METHOD THEREOF
- Publication number 20240387297
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL TESTING OF SEMICONDUCTOR PACKAGES
- Publication number 20240387296
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ya Huei Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR DETECTING/MONITORING PROCESS CHARGING DAMAGE DUE TO M...
- Publication number 20240387298
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Yu Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE TRANSFER OF MICRO DEVICES
- Publication number 20240381531
- Publication date Nov 14, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES
- Publication number 20240371851
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

for electrical parameters

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods of detecting bonding between a bonding wire and a bonding l...

Alignment method and alignment device

Methods of detecting bonding between a bonding wire and a bonding l...

Ion implantation method and ion implanter

Method of forming testing module and method for using the same

Methods of detecting connection issues between a wire bonding tool...

Display device and method of fabricating the same

Interferometer systems and methods for real time etch process compe...

Package and method of forming the same

Impedance measurement jig and method of controlling a substrate-pro...

Wafer level testing of optical components

Integrated circuit test method and structure thereof

Electronic device

Test method of storage device implemented in multi-chip package (MC...

Selective micro device transfer to receiver substrate

Execution device and execution method

Package structure

Method for evaluating semiconductor substrate

Integrated circuit filler and method thereof

Semiconductor chip integrated device manufacturing method, semicond...

Semiconductor structure and methods for bonding tested wafers and t...

Method and device for measuring semiconductor multilayer structure...

Packaged current sensor integrated circuit

System and method for measuring device inside through-silicon via s...

Method for transferring light-emitting diode and light-emitting bas...

Silicon carbide semiconductor device, semiconductor package, and me...

Semiconductor wafer and method of wafer thinning

In-process wire bond testing using wire bonding apparatus

Defect measurement method

Fabrication method of semiconductor device and test method of semic...

Patents Applicationslast 30 patents

METHOD AND APPARATUS FOR SILICON PHOTONICS TESTING

METHOD FOR FORMING PACKAGE STRUCTURE

SUBSTRATE INSPECTION APPARATUS

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR WAFER AND OPERATING METHOD OF TEST CIRCUIT OF SEMICON...

INTEGRATED ELECTRICAL AND OPTICAL APPARATUS FOR ELECTRICAL CHARACTE...

SYSTEMS AND METHODS FOR CARVING PROBED METROLOGY

SEMICONDUCTOR WAFER AND METHOD OF WAFER THINNING

Test Apparatus For Flip-Chip Micro-Light Emitting Diode (LED) Devices

INTERPOSERS, SEMICONDUCTOR PACKAGES AND METHODS OF PRODUCING THE SAME

THREE-DIMENSIONAL DEVICE AND MANUFACTURING METHOD THEREOF

POWER AMPLIFIER SYSTEMS INCLUDING CONTROL INTERFACE AND WIRE BOND PAD

METHOD FOR DETECTING DEFECTS IN SEMICONDUCTOR STRUCTURE AND METHOD...

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

SUPERCONDUCTING MATERIALS, DEVICES, AND PROCESSES

ON DIE FLEXURE CONTROL DEVICE AND METHOD

METHOD OF MEASURING THICKNESS OF SEMICONDUCTOR WAFER AND INSPECTING...

Semiconductor Device and Method

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MANU...

METHOD FOR ACHIEVING UNIFORM CARRIER CONCENTRATION IN EPITAXIAL LAY...

ATOM PROBE TOMOGRAPHY SPECIMEN PREPARATION

SYSTEM AND METHOD FOR MEASURING DEVICE INSIDE THROUGH-SILICON VIA S...

DEVICE, SYSTEM AND METHOD FOR VOLTAGE GENERATING

STANDBY CURRENT DETECTION CIRCUIT

METHODS FOR REAL TIME ETCH PROCESS COMPENSATION CONTROL

SEMICONDUCTOR STRUCTURE AND TEST METHOD THEREOF

ELECTRICAL TESTING OF SEMICONDUCTOR PACKAGES

STRUCTURE FOR DETECTING/MONITORING PROCESS CHARGING DAMAGE DUE TO M...

SELECTIVE TRANSFER OF MICRO DEVICES

INTEGRATED CIRCUIT PACKAGES