Membership
Tour
Register
Log in
for electrical parameters
Follow
Industry
CPC
H01L22/14
This industry / category may be too specific. Please go to a parent level for more data
Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L22/00
Testing or measuring during manufacture or treatment; Reliability measurements
Current Industry
H01L22/14
for electrical parameters
Industries
Overview
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Display device and method of inspecting the same
Patent number
11,980,085
Issue date
May 7, 2024
Samsung Display Co., Ltd.
Ho Seok Han
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Display device
Patent number
11,978,678
Issue date
May 7, 2024
Innolux Corporation
Tung-Kai Liu
G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information
Patent Grant
Electrical connection structure and electronic device comprising th...
Patent number
11,974,479
Issue date
Apr 30, 2024
Innolux Corporation
Shun-Yuan Hu
G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information
Patent Grant
Die level product modeling without die level input data
Patent number
11,972,987
Issue date
Apr 30, 2024
PDF Solutions, Inc.
Richard Burch
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Laminate sheet and method of use thereof
Patent number
11,961,771
Issue date
Apr 16, 2024
Mitsui Mining & Smelting Co., Ltd.
Yoshinori Matsuura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
HVMOS reliability evaluation using bulk resistances as indices
Patent number
11,955,389
Issue date
Apr 9, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chia-Chung Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
System and method for measuring device inside through-silicon via s...
Patent number
11,955,392
Issue date
Apr 9, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Shuo-Wen Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of manufacturing the same
Patent number
11,948,930
Issue date
Apr 2, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Chin-Chuan Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure and testing method thereof
Patent number
11,942,380
Issue date
Mar 26, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Ming-Shiang Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method for manufacturing semiconductor ele...
Patent number
11,942,382
Issue date
Mar 26, 2024
Mitsubishi Electric Corporation
Noritsugu Nomura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for preparing semiconductor device including an electronic f...
Patent number
11,935,605
Issue date
Mar 19, 2024
NANYA TECHNOLOGY CORPORATION
Wu-Der Yang
G11 - INFORMATION STORAGE
Information
Patent Grant
Smart packaging for improved medication regimen compliance
Patent number
11,913,893
Issue date
Feb 27, 2024
QuantaEd, LLC
Mehran Mehregany
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for fabricating a chip package
Patent number
11,908,692
Issue date
Feb 20, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Jie Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Pad structure and testkey structure and testing method for semicond...
Patent number
11,906,577
Issue date
Feb 20, 2024
Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
Linzhi Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for identifying latch-up structure
Patent number
11,899,057
Issue date
Feb 13, 2024
CHANGXIN MEMORY TECHNOLOGIES, INC.
Qian Xu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing a light-emitting device
Patent number
11,901,480
Issue date
Feb 13, 2024
Epistar Corporation
Chien-Fu Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package for power electronics
Patent number
11,887,953
Issue date
Jan 30, 2024
Wolfspeed, Inc.
Brice McPherson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Light emitting diodes manufacture and assembly
Patent number
11,888,087
Issue date
Jan 30, 2024
Meta Platforms Technologies, LLC
Céline Claire Oyer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming semiconductor die with die region and seal-ring...
Patent number
11,887,892
Issue date
Jan 30, 2024
MagnaChip Semiconductor, Ltd.
Jin Won Jeong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for operating a benchmark device on a semiconductor wafer wi...
Patent number
11,876,024
Issue date
Jan 16, 2024
NANYA TECHNOLOGY CORPORATION
Yi-Ju Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip-stacked semiconductor package and method of manufacturing same
Patent number
11,869,818
Issue date
Jan 9, 2024
Samsung Electronics Co., Ltd.
Hyoeun Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package substrate film and semiconductor package including the same
Patent number
11,862,548
Issue date
Jan 2, 2024
Samsung Electronics Co., Ltd.
Kyoungsuk Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display device and method of fabricating the same
Patent number
11,864,454
Issue date
Jan 2, 2024
Samsung Display Co., Ltd.
Won-Kyu Kwak
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device, and method for manufacturing semiconductor de...
Patent number
11,862,672
Issue date
Jan 2, 2024
Rohm Co., Ltd.
Katsuhisa Nagao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and device for depositing a nano-object
Patent number
11,854,801
Issue date
Dec 26, 2023
Centre National de la Recherche Scientifique
Matthieu Delbecq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method
Patent number
11,855,014
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods for measuring temperature of wafer chuck and calibrating te...
Patent number
11,852,542
Issue date
Dec 26, 2023
CHANGXIN MEMORY TECHNOLOGIES, INC.
Shibing Qian
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Reclaimable semiconductor device package and associated systems and...
Patent number
11,854,635
Issue date
Dec 26, 2023
Micron Technology, Inc.
Yueping Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure and manufacturing method thereof
Patent number
11,855,066
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Company Ltd.
Hsiang-Tai Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit device structures and double-sided electrical te...
Patent number
11,854,894
Issue date
Dec 26, 2023
Intel Corporation
Valluri R. Rao
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
METHOD FOR FABRICATING A CHIP PACKAGE
Publication number
20240153769
Publication date
May 9, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Jie Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONDUCTIVE PERFORATED PLATE FOR ELECTRICAL TEST
Publication number
20240142496
Publication date
May 2, 2024
TEXAS INSTRUMENTS INCORPORATED
Wolfgang Weiss
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20240128135
Publication date
Apr 18, 2024
Samsung Electronics Co., Ltd.
GYOSOO CHOO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Passive Device Dies With Measurement Structures
Publication number
20240128261
Publication date
Apr 18, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Fu-Chiang KUO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR FORMING SEMICONDUCTOR DIE AND SEMICONDUCTOR DEVICE THEREOF
Publication number
20240128123
Publication date
Apr 18, 2024
Magnachip Semiconductor, Ltd.
Jin Won JEONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SHIFTED MULTI-VIA CONNECTION FOR HYBRID BONDING
Publication number
20240120312
Publication date
Apr 11, 2024
TOKYO ELECTRON LIMITED
Kevin Ryan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Process Control Monitor Device Structure for Buried TSV Formation i...
Publication number
20240120242
Publication date
Apr 11, 2024
Raytheon Company
Sean P. Kilcoyne
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEMS AND METHODS FOR MONITORING A CONDITION OF LAMPS USED IN SEM...
Publication number
20240110283
Publication date
Apr 4, 2024
ASM IP HOLDING, B.V.
Peter Bryan Ruckle
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME
Publication number
20240107869
Publication date
Mar 28, 2024
SAMSUNG DISPLAY CO., LTD.
Won-Kyu KWAK
G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20240096777
Publication date
Mar 21, 2024
Samsung Electronics Co., Ltd.
Jaesun KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ALIGNMENT METHOD AND ALIGNMENT DEVICE
Publication number
20240096716
Publication date
Mar 21, 2024
STAR TECHNOLOGIES (WUHAN) CO., LTD.
CHOON LEONG LOU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DISPLAY DEFECT MONITORING STRUCTURE
Publication number
20240087966
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chu Fu Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20240088124
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing company Ltd.
HSIANG-TAI LU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER REWIRING DOUBLE VERIFICATION STRUCTURE, AND MANUFACTURING MET...
Publication number
20240079271
Publication date
Mar 7, 2024
CHIPMORE TECHNOLOGY CORPORATION LIMITED
Wenjie HUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DISPLAY PANEL AND METHOD OF MANUFACTURING SAME, AND SPLICED DISPLAY...
Publication number
20240063351
Publication date
Feb 22, 2024
Yongchao ZHAO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR TRANSFERRING LIGHT-EMITTING DIODE AND LIGHT-EMITTING BAS...
Publication number
20240055548
Publication date
Feb 15, 2024
HUIZHOU CHINA STAR OPTOELECTRONICS DISPLAY CO., LTD.
Bo Sun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FABRICATING METHOD FOR TEST ELEMENT GROUP
Publication number
20240055303
Publication date
Feb 15, 2024
Samsung Electronics Co., Ltd.
Sun Woo KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRUCTURE AND METHOD FOR TEST-POINT ACCESS IN A SEMICONDUCTOR
Publication number
20240047281
Publication date
Feb 8, 2024
NXP USA, Inc.
Kristofor Jason Dickson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20240047318
Publication date
Feb 8, 2024
Mitsubishi Electric Corporation
Yosuke NAKATA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THROUGH SUBSTRATE VIA (TSV) VALIDATION STRUCTURE FOR AN INTEGRATED...
Publication number
20240047309
Publication date
Feb 8, 2024
NXP USA, Inc.
Darrell Glenn Hill
G01 - MEASURING TESTING
Information
Patent Application
ION IMPLANTATION METHOD AND ION IMPLANTER
Publication number
20240047176
Publication date
Feb 8, 2024
Sumitomo Heavy Industries Ion Technology Co., Ltd.
Yoji Kawasaki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240047345
Publication date
Feb 8, 2024
Taiwan Semiconductor Manufacturing company Ltd.
CHUN-WEI CHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND MECHANISMS FOR ADJUSTING CHUCKING VOLTAGE DURING SUBSTR...
Publication number
20240038601
Publication date
Feb 1, 2024
Applied Materials, Inc.
Mitesh Sanghvi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20240038876
Publication date
Feb 1, 2024
Semiconductor Energy Laboratory Co., Ltd.
Shunpei YAMAZAKI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SHIFTED VIA-CHAIN ELECTRICAL-TEST MEASUREMENTS FOR HYBRID BONDING A...
Publication number
20240038599
Publication date
Feb 1, 2024
TOKYO ELECTRON LIMITED
Kevin Ryan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
GENERATING INDICATIONS OF LEARNING OF MODELS FOR SEMICONDUCTOR PROC...
Publication number
20240037442
Publication date
Feb 1, 2024
Applied Materials, Inc.
Dermot Patrick Cantwell
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
METHOD AND DEVICE FOR MEASURING SEMICONDUCTOR MULTILAYER STRUCTURE...
Publication number
20240038600
Publication date
Feb 1, 2024
SHANGHAI ASPIRING SEMICONDUCTOR EQUIPMENT CO., LTD.
Chongji HUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE WITH TESTLINE AND METHOD OF FABRICATING SAME
Publication number
20240038605
Publication date
Feb 1, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Yu-Ching Chiu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER DELIVERY STRUCTURES AND METHODS OF MANUFACTURING THEREOF
Publication number
20240021560
Publication date
Jan 18, 2024
TAIWAN SEMICONDUTOR MANUFACTURING COMPANY, LTD.
Ting-Yu Yeh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Alignment Mark Design for Wafer-Level Testing and Method Forming th...
Publication number
20240019486
Publication date
Jan 18, 2024
Taiwan Semiconductor Mamufacturing Co., Ltd.
Cheng-Chieh Wu
H01 - BASIC ELECTRIC ELEMENTS