for holding or confining the bonding area

Industry

CPC
H01L2224/03013

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/03013for holding or confining the bonding area

Industries

Patents Grantslast 30 patents

Information Patent Grant
Bonding structures of integrated circuit devices and method forming...
- Patent number 12,132,016
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for wafer scale chip package
- Patent number 12,125,811
- Issue date Oct 22, 2024
- Texas Instruments Incorporated
- Indumini W. Ranmuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,107,059
- Issue date Oct 1, 2024
- Mediatek Inc.
- Yan-Liang Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structures of integrated circuit devices and method forming...
- Patent number 11,990,430
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 11,990,434
- Issue date May 21, 2024
- Rohm Co., Ltd.
- Kazuki Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display backboard and manufacturing method thereof and display device
- Patent number 11,764,343
- Issue date Sep 19, 2023
- BOE Technology Group Co., Ltd.
- Zhiwei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for semiconductor packaging
- Patent number 11,705,414
- Issue date Jul 18, 2023
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure, semiconductor package structure and method for...
- Patent number 11,545,406
- Issue date Jan 3, 2023
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structures of semiconductor devices
- Patent number 11,444,045
- Issue date Sep 13, 2022
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Ramasamy Chockalingam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures for preventing solder bridging, and associa...
- Patent number 10,950,565
- Issue date Mar 16, 2021
- Micron Technology, Inc.
- Kyle S. Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-voltage MOSFET structures
- Patent number 10,896,885
- Issue date Jan 19, 2021
- Polar Semiconductor, LLC
- Peter West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Collars for under-bump metal structures and associated systems and...
- Patent number 10,886,244
- Issue date Jan 5, 2021
- Micron Technology, Inc.
- Giorgio Mariottini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having metal posts for stress relief at flatn...
- Patent number 10,748,863
- Issue date Aug 18, 2020
- Texas Instruments Incorporated
- Jaimal Mallory Williamson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Final passivation for wafer level warpage and ULK stress reduction
- Patent number 10,622,319
- Issue date Apr 14, 2020
- International Business Machines Corporation
- Ekta Misra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures for preventing solder bridging, and associa...
- Patent number 10,600,750
- Issue date Mar 24, 2020
- Micron Technology, Inc.
- Kyle S. Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array substrate
- Patent number 10,312,206
- Issue date Jun 4, 2019
- Au Optronics Corporation
- Jia-Hong Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures for preventing solder bridging, and associa...
- Patent number 10,297,561
- Issue date May 21, 2019
- Micron Technology, Inc.
- Kyle S. Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for positioning a carrier with electronic components and ele...
- Patent number 10,217,679
- Issue date Feb 26, 2019
- Besi Netherlands B.V.
- Jurgen Hendrikus Gerhardus Huisstede
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming dummy pillars between se...
- Patent number 10,096,540
- Issue date Oct 9, 2018
- STATS ChipPAC Pte. Ltd.
- KyungHoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making a semiconductor device
- Patent number 9,947,632
- Issue date Apr 17, 2018
- Nexperia B.V.
- Chi Ho Leung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for creating a connection between metallic moulded bodies an...
- Patent number 9,786,627
- Issue date Oct 10, 2017
- Danfoss Silicon Power GmbH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures for fine pitch assembly of semiconductor st...
- Patent number 9,786,633
- Issue date Oct 10, 2017
- Massachusetts Institute of Technology
- Rabindra N. Das
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Collars for under-bump metal structures and associated systems and...
- Patent number 9,780,052
- Issue date Oct 3, 2017
- Micron Technology, Inc.
- Giorgio Mariottini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Final passivation for wafer level warpage and ULK stress reduction
- Patent number 9,754,905
- Issue date Sep 5, 2017
- International Business Machines Corporation
- Ekta Misra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Waterfall wire bonding
- Patent number 9,704,797
- Issue date Jul 11, 2017
- SanDisk Information Technology (Shanghai) Co., Ltd.
- Zhong Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor chip with a metallic moulded body for contactin...
- Patent number 9,613,929
- Issue date Apr 4, 2017
- Danfoss Silicon Power GmbH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive pillar shaped for solder confinement
- Patent number 9,583,451
- Issue date Feb 28, 2017
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with post-passivation interconnect structure a...
- Patent number 9,443,812
- Issue date Sep 13, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor chip with a metallic moulded body for contactin...
- Patent number 9,318,421
- Issue date Apr 19, 2016
- Danfoss Silicon Power GmbH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and method of manufacturing the same
- Patent number 9,293,430
- Issue date Mar 22, 2016
- Semiconductor Manufacturing International (Shanghai) Corporation
- Fucheng Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Bond Features For Reducing Non-Bond and Methods of Forming the Same
- Publication number 20250006677
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Tsu Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240387422
- Publication date Nov 21, 2024
- MEDIATEK INC.
- Cheng-Lin HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURES OF INTEGRATED CIRCUIT DEVICES AND METHOD FORMING...
- Publication number 20240371804
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED THIN SEMICONDUCTOR DIE PACKAGES AND RELATED METHODS
- Publication number 20240290736
- Publication date Aug 29, 2024
- Semiconductor Components Industries, LLC
- Shinzo ISHIBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT HAVING EXPOSED LEADS
- Publication number 20240203919
- Publication date Jun 20, 2024
- TEXAS INSTRUMENTS INCORPORATED
- John Carlo Cruz Molina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Dummy vias in WLP
- Publication number 20240055374
- Publication date Feb 15, 2024
- STATS ChipPAC Pte Ltd.
- Peik Eng Ooi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH UNDER-BUMP METALLIZATION AND METHOD THEREFOR
- Publication number 20240014152
- Publication date Jan 11, 2024
- NXP B.V.
- Leo van Gemert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURES OF INTEGRATED CIRCUIT DEVICES AND METHOD FORMING...
- Publication number 20230387051
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY BACKBOARD AND MANUFACTURING METHOD THEREOF AND DISPLAY DEVICE
- Publication number 20230378414
- Publication date Nov 23, 2023
- BOE TECHNOLOGY GROUP CO., LTD.
- Zhiwei LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230352430
- Publication date Nov 2, 2023
- RENESAS ELECTRONICS CORPORATION
- Takashi MORIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR SEMICONDUCTOR PACKAGING
- Publication number 20230299027
- Publication date Sep 21, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY BACKPLANE ASSEMBLY, LED DISPLAY MODULE, AND RELATED METHODS...
- Publication number 20230275076
- Publication date Aug 31, 2023
- CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD.
- Feng ZHAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING METHOD AND SEMICONDUCTOR PACKAGING STRUCTURE
- Publication number 20230170318
- Publication date Jun 1, 2023
- SIPLP MICROELECTRONICS (CHONGQING) CO., LTD.
- Yan HUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE WITH SOLDER RESTRAINING WALL
- Publication number 20230106976
- Publication date Apr 6, 2023
- Texas Instruments Incorporated
- John Carlo Cruz Molina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY BACKBOARD AND MANUFACTURING METHOD THEREOF AND DISPLAY DEVICE
- Publication number 20230097502
- Publication date Mar 30, 2023
- BOE TECHNOLOGY GROUP CO., LTD.
- Zhiwei LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELASTIC BONDING LAYERS FOR SEMICONDUCTOR DIE ASSEMBLIES AND ASSOCIA...
- Publication number 20230050652
- Publication date Feb 16, 2023
- Micron Technology, Inc.
- Byung Hoon Moon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20220328437
- Publication date Oct 13, 2022
- Rohm Co., Ltd.
- Kazuki YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20220328435
- Publication date Oct 13, 2022
- MEDIATEK INC.
- Yan-Liang JI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT STRUCTURES FOR DIRECT BONDING
- Publication number 20220285303
- Publication date Sep 8, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Laura Wills Mirkarimi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Structures of Integrated Circuit Devices and Method Forming...
- Publication number 20220238466
- Publication date Jul 28, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURE, SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR...
- Publication number 20220115288
- Publication date Apr 14, 2022
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURES OF SEMICONDUCTOR DEVICES
- Publication number 20220052000
- Publication date Feb 17, 2022
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- RAMASAMY CHOCKALINGAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COLLARS FOR UNDER-BUMP METAL STRUCTURES AND ASSOCIATED SYSTEMS AND...
- Publication number 20210151400
- Publication date May 20, 2021
- Micron Technology, Inc.
- Giorgio Mariottini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200350268
- Publication date Nov 5, 2020
- WINBOND ELECTRONICS CORP.
- Yen-Jui Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES FOR PREVENTING SOLDER BRIDGING, AND ASSOCIA...
- Publication number 20200203297
- Publication date Jun 25, 2020
- Micron Technology, Inc.
- Kyle S. Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR WAFER SCALE CHIP PACKAGE
- Publication number 20190385962
- Publication date Dec 19, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Indumini W. Ranmuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES FOR PREVENTING SOLDER BRIDGING, AND ASSOCIA...
- Publication number 20190198470
- Publication date Jun 27, 2019
- Micron Technology, Inc.
- Kyle S. Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR SEMICONDUCTOR PACKAGING
- Publication number 20190109105
- Publication date Apr 11, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-VOLTAGE MOSFET STRUCTURES
- Publication number 20190081016
- Publication date Mar 14, 2019
- Polar Semiconductor, LLC
- Peter West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING METAL POSTS FOR STRESS RELIEF AT FLATN...
- Publication number 20180190606
- Publication date Jul 5, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Jaimal Mallory Williamson
- H01 - BASIC ELECTRIC ELEMENTS

for holding or confining the bonding area

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding structures of integrated circuit devices and method forming...

Semiconductor structure and method for wafer scale chip package

Semiconductor package and manufacturing method thereof

Bonding structures of integrated circuit devices and method forming...

Semiconductor device and method of manufacturing semiconductor device

Display backboard and manufacturing method thereof and display device

Structure and method for semiconductor packaging

Substrate structure, semiconductor package structure and method for...

Bonding structures of semiconductor devices

Interconnect structures for preventing solder bridging, and associa...

High-voltage MOSFET structures

Collars for under-bump metal structures and associated systems and...

Semiconductor devices having metal posts for stress relief at flatn...

Final passivation for wafer level warpage and ULK stress reduction

Interconnect structures for preventing solder bridging, and associa...

Array substrate

Interconnect structures for preventing solder bridging, and associa...

Method for positioning a carrier with electronic components and ele...

Semiconductor device and method of forming dummy pillars between se...

Semiconductor device and method of making a semiconductor device

Method for creating a connection between metallic moulded bodies an...

Interconnect structures for fine pitch assembly of semiconductor st...

Collars for under-bump metal structures and associated systems and...

Final passivation for wafer level warpage and ULK stress reduction

Waterfall wire bonding

Power semiconductor chip with a metallic moulded body for contactin...

Conductive pillar shaped for solder confinement

Semiconductor device with post-passivation interconnect structure a...

Power semiconductor chip with a metallic moulded body for contactin...

Semiconductor chip and method of manufacturing the same

Patents Applicationslast 30 patents

Bond Features For Reducing Non-Bond and Methods of Forming the Same

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

BONDING STRUCTURES OF INTEGRATED CIRCUIT DEVICES AND METHOD FORMING...

MOLDED THIN SEMICONDUCTOR DIE PACKAGES AND RELATED METHODS

INTEGRATED CIRCUIT HAVING EXPOSED LEADS

Semiconductor Device and Method of Forming Dummy vias in WLP

SEMICONDUCTOR DEVICE WITH UNDER-BUMP METALLIZATION AND METHOD THEREFOR

BONDING STRUCTURES OF INTEGRATED CIRCUIT DEVICES AND METHOD FORMING...

DISPLAY BACKBOARD AND MANUFACTURING METHOD THEREOF AND DISPLAY DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

STRUCTURE AND METHOD FOR SEMICONDUCTOR PACKAGING

DISPLAY BACKPLANE ASSEMBLY, LED DISPLAY MODULE, AND RELATED METHODS...

SEMICONDUCTOR PACKAGING METHOD AND SEMICONDUCTOR PACKAGING STRUCTURE

SEMICONDUCTOR DIE WITH SOLDER RESTRAINING WALL

DISPLAY BACKBOARD AND MANUFACTURING METHOD THEREOF AND DISPLAY DEVICE

ELASTIC BONDING LAYERS FOR SEMICONDUCTOR DIE ASSEMBLIES AND ASSOCIA...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

CONTACT STRUCTURES FOR DIRECT BONDING

Bonding Structures of Integrated Circuit Devices and Method Forming...

SUBSTRATE STRUCTURE, SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR...

BONDING STRUCTURES OF SEMICONDUCTOR DEVICES

COLLARS FOR UNDER-BUMP METAL STRUCTURES AND ASSOCIATED SYSTEMS AND...

WIRE BONDING STRUCTURE AND METHOD OF MANUFACTURING THE SAME

INTERCONNECT STRUCTURES FOR PREVENTING SOLDER BRIDGING, AND ASSOCIA...

SEMICONDUCTOR STRUCTURE AND METHOD FOR WAFER SCALE CHIP PACKAGE

INTERCONNECT STRUCTURES FOR PREVENTING SOLDER BRIDGING, AND ASSOCIA...

STRUCTURE AND METHOD FOR SEMICONDUCTOR PACKAGING

HIGH-VOLTAGE MOSFET STRUCTURES

SEMICONDUCTOR DEVICES HAVING METAL POSTS FOR STRESS RELIEF AT FLATN...