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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/11013for holding or confining the bump connector

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Light-emitting device and displayer
- Patent number 12,148,867
- Issue date Nov 19, 2024
- FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD
- Kuai Qin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer chip scale package
- Patent number 12,057,417
- Issue date Aug 6, 2024
- Texas Instruments Incorporated
- Masamitsu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing semiconductor device with bump interconnec...
- Patent number 12,002,783
- Issue date Jun 4, 2024
- SK hynix Inc.
- Jun Yong Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 11,961,810
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip packaging
- Patent number 11,817,444
- Issue date Nov 14, 2023
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless interconnect for semiconductor device assembly
- Patent number 11,810,894
- Issue date Nov 7, 2023
- Micron Technology, Inc.
- Jungbae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method for semiconductor device
- Patent number 11,756,912
- Issue date Sep 12, 2023
- Lapis Semiconductor Co., Ltd.
- Taiichi Ogumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sidewall wetting barrier for conductive pillars
- Patent number 11,694,982
- Issue date Jul 4, 2023
- QUALCOMM Incorporated
- Wei Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric molded indium bump formation and INP planarization
- Patent number 11,694,981
- Issue date Jul 4, 2023
- Princeton Infrared Technologies, Inc.
- Martin H Ettenberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure and method for reducing polymer layer...
- Patent number 11,688,728
- Issue date Jun 27, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic-part-reinforcing thermosetting resin composition, semico...
- Patent number 11,495,564
- Issue date Nov 8, 2022
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Jin Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-bump sidewall protection
- Patent number 11,476,219
- Issue date Oct 18, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jung-Hua Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
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- Issue date Oct 11, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tung-Liang Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip packaging
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- Issue date May 31, 2022
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier structures between external electrical connectors
- Patent number 11,296,012
- Issue date Apr 5, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Chun Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing electronic component and method of manufact...
- Patent number 11,282,809
- Issue date Mar 22, 2022
- Sumitomo Electric Device Innovations, Inc.
- Yasuyuki Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged microelectronic devices having stacked interconnect elemen...
- Patent number 11,217,556
- Issue date Jan 4, 2022
- Micron Technology, Inc.
- Young Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with protected bump and method of fo...
- Patent number 11,171,100
- Issue date Nov 9, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless interconnect for semiconductor device assembly
- Patent number 11,094,668
- Issue date Aug 17, 2021
- Micron Technology, Inc.
- Jungbae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor devices and methods of packaging thereof
- Patent number 11,094,622
- Issue date Aug 17, 2021
- Taiwan Semiconductor Manufacturing Company
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure and method for reducing polymer layer...
- Patent number 11,081,475
- Issue date Aug 3, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and structures for packaging semiconductor dies
- Patent number 11,069,653
- Issue date Jul 20, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Chao Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 11,043,462
- Issue date Jun 22, 2021
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flux-free solder ball mount arrangement
- Patent number 10,879,102
- Issue date Dec 29, 2020
- Boston Process Technologies, Inc
- Jian Zhang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device
- Patent number 10,867,951
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,854,564
- Issue date Dec 1, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tung-Liang Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing compliant bump
- Patent number 10,825,788
- Issue date Nov 3, 2020
- LBSEMICON CO., LTD.
- Jae Jin Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tall and fine pitch interconnects
- Patent number 10,818,629
- Issue date Oct 27, 2020
- Invensas Corporation
- Cyprian Emeka Uzoh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal-bump sidewall protection
- Patent number 10,784,222
- Issue date Sep 22, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jung-Hua Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of solder balls with injection molded solder
- Patent number 10,741,514
- Issue date Aug 11, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WAFER CHIP SCALE PACKAGE
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- Publication date Nov 14, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Masamitsu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240379604
- Publication date Nov 14, 2024
- Samsung Electronics Co., LTD
- Jihyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND A PACKAGING METHOD
- Publication number 20240371812
- Publication date Nov 7, 2024
- STATS ChipPAC Pte Ltd.
- MyungHo JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH DELAMINATION REDUCTION MECHANISM AND METH...
- Publication number 20240282733
- Publication date Aug 22, 2024
- Micron Technology, Inc.
- Jungbae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGING
- Publication number 20240128256
- Publication date Apr 18, 2024
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230411330
- Publication date Dec 21, 2023
- KIOXIA Corporation
- Masatoshi SHOMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH SENSOR FACE STRESS PROTECTION
- Publication number 20230317662
- Publication date Oct 5, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Rafael Jose Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD
- Publication number 20230307419
- Publication date Sep 28, 2023
- KIOXIA Corporation
- Soichi HOMMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230223368
- Publication date Jul 13, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Zengyan Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230067356
- Publication date Mar 2, 2023
- Samsung Electronics Co., Ltd.
- Byung Wook KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE WITH BUMP INTERCONNEC...
- Publication number 20230034877
- Publication date Feb 2, 2023
- SK HYNIX INC.
- Jun Yong SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE AND CHIP PREPARATION METHOD
- Publication number 20230012986
- Publication date Jan 19, 2023
- Huawei Technologies Co., Ltd
- Heng LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal-Bump Sidewall Protection
- Publication number 20220367397
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jung-Hua Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIDEWALL WETTING BARRIER FOR CONDUCTIVE PILLARS
- Publication number 20220270995
- Publication date Aug 25, 2022
- QUALCOMM Incorporated
- Wei HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Barrier Structures Between External Electrical Connectors
- Publication number 20220230940
- Publication date Jul 21, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Chun Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Light-Emitting Device and Displayer
- Publication number 20220231206
- Publication date Jul 21, 2022
- FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD
- Kuai QIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGING
- Publication number 20220231007
- Publication date Jul 21, 2022
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL PLACEMENT STRUCTURE AND PREPARATION PROCESS THEREOF
- Publication number 20220223556
- Publication date Jul 14, 2022
- CHIPMORE TECHNOLOGY CORPORATION LIMITED
- YAN MEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGING
- Publication number 20220157803
- Publication date May 19, 2022
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MICROELECTRONIC DEVICES HAVING STACKED INTERCONNECT ELEMEN...
- Publication number 20220122938
- Publication date Apr 21, 2022
- Micron Technology, Inc.
- Young Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20210407945
- Publication date Dec 30, 2021
- LAPIS SEMICONDUCTOR CO., LTD.
- Taiichi OGUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDERLESS INTERCONNECT FOR SEMICONDUCTOR DEVICE ASSEMBLY
- Publication number 20210375822
- Publication date Dec 2, 2021
- Micron Technology, Inc.
- Jungbae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Structure and Method for Reducing Polymer Layer...
- Publication number 20210351173
- Publication date Nov 11, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solderless Interconnection Structure and Method of Forming Same
- Publication number 20210313287
- Publication date Oct 7, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Packaging an Integrated Circuit
- Publication number 20210242097
- Publication date Aug 5, 2021
- Carbon, Inc.
- William C. HOLTON
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
ELECTRONIC-PART-REINFORCING THERMOSETTING RESIN COMPOSITION, SEMICO...
- Publication number 20210202421
- Publication date Jul 1, 2021
- Panasonic Intellectual Property Management Co., Ltd.
- Jin JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDERLESS INTERCONNECT FOR SEMICONDUCTOR DEVICE ASSEMBLY
- Publication number 20210183811
- Publication date Jun 17, 2021
- Micron Technology, Inc.
- Jungbae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH PROTECTED BUMP AND METHOD OF F...
- Publication number 20210159197
- Publication date May 27, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hui-Min HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER CHIP SCALE PACKAGE
- Publication number 20210111136
- Publication date Apr 15, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Masamitsu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20210082849
- Publication date Mar 18, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- TUNG-LIANG SHAO
- H01 - BASIC ELECTRIC ELEMENTS

for holding or confining the bump connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Light-emitting device and displayer

Wafer chip scale package

Methods of manufacturing semiconductor device with bump interconnec...

Solderless interconnection structure and method of forming same

Multi-chip packaging

Solderless interconnect for semiconductor device assembly

Semiconductor device and manufacturing method for semiconductor device

Sidewall wetting barrier for conductive pillars

Dielectric molded indium bump formation and INP planarization

Integrated circuit structure and method for reducing polymer layer...

Electronic-part-reinforcing thermosetting resin composition, semico...

Metal-bump sidewall protection

Semiconductor device and manufacturing method thereof

Multi-chip packaging

Barrier structures between external electrical connectors

Method of manufacturing electronic component and method of manufact...

Packaged microelectronic devices having stacked interconnect elemen...

Semiconductor device structure with protected bump and method of fo...

Solderless interconnect for semiconductor device assembly

Packaged semiconductor devices and methods of packaging thereof

Integrated circuit structure and method for reducing polymer layer...

Methods and structures for packaging semiconductor dies

Solderless interconnection structure and method of forming same

Flux-free solder ball mount arrangement

Semiconductor device

Semiconductor device and manufacturing method thereof

Method for manufacturing compliant bump

Tall and fine pitch interconnects

Metal-bump sidewall protection

Fabrication of solder balls with injection molded solder

Patents Applicationslast 30 patents

WAFER CHIP SCALE PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

ELECTRONIC PACKAGE AND A PACKAGING METHOD

SEMICONDUCTOR DEVICE WITH DELAMINATION REDUCTION MECHANISM AND METH...

MULTI-CHIP PACKAGING

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

ELECTRONIC DEVICE WITH SENSOR FACE STRESS PROTECTION

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE WITH BUMP INTERCONNEC...

CHIP STRUCTURE AND CHIP PREPARATION METHOD

Metal-Bump Sidewall Protection

SIDEWALL WETTING BARRIER FOR CONDUCTIVE PILLARS

Barrier Structures Between External Electrical Connectors

Light-Emitting Device and Displayer

MULTI-CHIP PACKAGING

BALL PLACEMENT STRUCTURE AND PREPARATION PROCESS THEREOF

MULTI-CHIP PACKAGING

PACKAGED MICROELECTRONIC DEVICES HAVING STACKED INTERCONNECT ELEMEN...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

SOLDERLESS INTERCONNECT FOR SEMICONDUCTOR DEVICE ASSEMBLY

Integrated Circuit Structure and Method for Reducing Polymer Layer...

Solderless Interconnection Structure and Method of Forming Same

Method of Packaging an Integrated Circuit

ELECTRONIC-PART-REINFORCING THERMOSETTING RESIN COMPOSITION, SEMICO...

SOLDERLESS INTERCONNECT FOR SEMICONDUCTOR DEVICE ASSEMBLY

SEMICONDUCTOR DEVICE STRUCTURE WITH PROTECTED BUMP AND METHOD OF F...

WAFER CHIP SCALE PACKAGE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF