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H01L2224/27013

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/27013for holding or confining the layer connector

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Molded packaging for wide band gap semiconductor devices
- Patent number 12,087,677
- Issue date Sep 10, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Maria Clemens Ypil Quinones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging substrate fine pitch metal bump and reinfor...
- Patent number 11,908,819
- Issue date Feb 20, 2024
- Apple Inc.
- Jun Chung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method for manufacturing same
- Patent number 11,901,253
- Issue date Feb 13, 2024
- Denso Corporation
- Wataru Kobayashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,769,763
- Issue date Sep 26, 2023
- Powertech Technology Inc.
- Shang-Yu Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modified leadframe design with adhesive overflow recesses
- Patent number 11,552,007
- Issue date Jan 10, 2023
- STMicroelectronics, Inc.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method for manufacturing same
- Patent number 11,367,668
- Issue date Jun 21, 2022
- Denso Corporation
- Wataru Kobayashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaged semiconductor devices and methods of packaging thereof
- Patent number 11,094,622
- Issue date Aug 17, 2021
- Taiwan Semiconductor Manufacturing Company
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a cooling body with a groove
- Patent number 11,088,045
- Issue date Aug 10, 2021
- Mitsubishi Electric Corporation
- Noboru Miyamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure for power converter and manufacture method thereof
- Patent number 11,056,421
- Issue date Jul 6, 2021
- Silergy Semiconductor Technology (Hangzhou) Ltd.
- Jiaming Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modified leadframe design with adhesive overflow recesses
- Patent number 10,957,634
- Issue date Mar 23, 2021
- STMicroelectronics, Inc.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,943,859
- Issue date Mar 9, 2021
- Denso Corporation
- Eiji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method for manufacturing same
- Patent number 10,937,711
- Issue date Mar 2, 2021
- Denso Corporation
- Wataru Kobayashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic substrate and electronic apparatus
- Patent number 10,910,289
- Issue date Feb 2, 2021
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Masataka Maehara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dam for three-dimensional integrated circuit
- Patent number 10,867,878
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company
- Tsung-Ding Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,825,758
- Issue date Nov 3, 2020
- Rohm Co., Ltd.
- Shoji Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method with clip arrangement in IC package
- Patent number 10,825,757
- Issue date Nov 3, 2020
- Nexperia B.V.
- Haibo Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module for an inverter circuit and method of ma...
- Patent number 10,777,542
- Issue date Sep 15, 2020
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit module and manufacturing method thereof
- Patent number 10,679,916
- Issue date Jun 9, 2020
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package with recessed substrate for underfill con...
- Patent number 10,672,625
- Issue date Jun 2, 2020
- Intel Corporation
- Sergio A. Chan Arguedas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having an electric device with a recess
- Patent number 10,658,238
- Issue date May 19, 2020
- STMicroelectronics Pte Ltd
- Kim-Yong Goh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device
- Patent number 10,658,324
- Issue date May 19, 2020
- Mitsubishi Electric Corporation
- Daisuke Murata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modified leadframe design with adhesive overflow recesses
- Patent number 10,615,104
- Issue date Apr 7, 2020
- STMicroelectronics, Inc.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (IC) package with a solder receiving area and as...
- Patent number 10,529,652
- Issue date Jan 7, 2020
- STMicroelectronics Pte Ltd
- Wing Shenq Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light source module and backlight assembly having the same
- Patent number 10,509,159
- Issue date Dec 17, 2019
- Samsung Electronics Co., Ltd.
- Dong-soo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,490,486
- Issue date Nov 26, 2019
- Renesas Electronics Corporation
- Hajime Hasebe
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device
- Patent number 10,431,529
- Issue date Oct 1, 2019
- Rohm Co., Ltd.
- Shoji Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming flipchip interconnect st...
- Patent number 10,388,626
- Issue date Aug 20, 2019
- STATS ChipPAC Pte. Ltd.
- Rajendra D. Pendse
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit (IC) package with a solder receiving area and as...
- Patent number 10,297,534
- Issue date May 21, 2019
- STMicroelectronics Pte Ltd
- Wing Shenq Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of machining a lead frame, and lead frame
- Patent number 10,192,756
- Issue date Jan 29, 2019
- Osram Opto Semiconductors GmbH
- Daniel Richter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film, method for its production, and method for producing semicondu...
- Patent number 10,141,204
- Issue date Nov 27, 2018
- AGC Inc.
- Seigo Kotera
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
MULTI-BARRIER SYSTEM FOR LOW-VOID THERMAL TRANSFER
- Publication number 20240258262
- Publication date Aug 1, 2024
- The Indium Corporation of America
- Milos Lazic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH SOLDER MASK
- Publication number 20240170438
- Publication date May 23, 2024
- NXP USA, Inc.
- Aznita Abdul Aziz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID-REPELLING COATING FOR UNDERFILL BLEED OUT CONTROL
- Publication number 20240145422
- Publication date May 2, 2024
- Micron Technology, Inc.
- Jungbae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL SHIELD FOR FINE PITCH INTERCONNECTS
- Publication number 20240145420
- Publication date May 2, 2024
- Intel Corporation
- Bok Eng CHEAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20230387063
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220045041
- Publication date Feb 10, 2022
- Powertech Technology Inc.
- Shang-Yu Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE FOR POWER CONVERTER AND MANUFACTURE METHOD THEREOF
- Publication number 20210296213
- Publication date Sep 23, 2021
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Jiaming Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODIFIED LEADFRAME DESIGN WITH ADHESIVE OVERFLOW RECESSES
- Publication number 20210183750
- Publication date Jun 17, 2021
- STMICROELECTRONICS, INC.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20210090967
- Publication date Mar 25, 2021
- DENSO CORPORATION
- Wataru KOBAYASHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20200328132
- Publication date Oct 15, 2020
- DENSO CORPORATION
- Wataru KOBAYASHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODIFIED LEADFRAME DESIGN WITH ADHESIVE OVERFLOW RECESSES
- Publication number 20200194355
- Publication date Jun 18, 2020
- STMICROELECTRONICS, INC.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190378787
- Publication date Dec 12, 2019
- ROHM CO., LTD.
- Shoji YASUNAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190355656
- Publication date Nov 21, 2019
- DENSO CORPORATION
- Eiji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH ISOLATION STRUCTURE
- Publication number 20190157222
- Publication date May 23, 2019
- NXP USA, Inc.
- Nishant LAKHERA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE
- Publication number 20190074199
- Publication date Mar 7, 2019
- Intel Corporation
- Sergio A. Chan Arguedas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODIFIED LEADFRAME DESIGN WITH ADHESIVE OVERFLOW RECESSES
- Publication number 20190043790
- Publication date Feb 7, 2019
- STMICROELECTRONICS, INC.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190027427
- Publication date Jan 24, 2019
- RENESAS ELECTRONICS CORPORATION
- Hajime HASEBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20180366388
- Publication date Dec 20, 2018
- International Business Machines Corporation
- Akihiro HORIBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE FOR POWER CONVERTER AND MANUFACTURE METHOD THEREOF
- Publication number 20180366395
- Publication date Dec 20, 2018
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Jiaming Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180358319
- Publication date Dec 13, 2018
- Mitsubishi Electric Corporation
- Daisuke MURATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE FOR AN INVERTER CIRCUIT AND METHOD OF MA...
- Publication number 20180286845
- Publication date Oct 4, 2018
- ROHM CO., LTD.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit (IC) Package with a Solder Receiving Area and As...
- Publication number 20180226325
- Publication date Aug 9, 2018
- STMicroelectronics Pte Ltd
- Wing Shenq Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR
- Publication number 20180068972
- Publication date Mar 8, 2018
- Rohm Co., Ltd.
- Shoji Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM, METHOD FOR ITS PRODUCTION, AND METHOD FOR PRODUCING SEMICONDU...
- Publication number 20170323805
- Publication date Nov 9, 2017
- Asahi Glass Company, Limited
- Seigo KOTERA
- B32 - LAYERED PRODUCTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20170323848
- Publication date Nov 9, 2017
- RENESAS ELECTRONICS CORPORATION
- Takanori Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOMICROCRYSTALLITE PASTE FOR PRESSURELESS SINTERING
- Publication number 20170317046
- Publication date Nov 2, 2017
- Indium Corporation
- Sihai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGE WITH A SOLDER RECEIVING AREA AND AS...
- Publication number 20160172272
- Publication date Jun 16, 2016
- STMicroelectronics Pte Ltd
- Wing Shenq Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140374890
- Publication date Dec 25, 2014
- Renesas Electronics Corporation
- Takanori Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140370660
- Publication date Dec 18, 2014
- Takumi IHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH POWER DIELECTRIC CARRIER WITH ACCURATE DIE ATTACH LAYER
- Publication number 20140339709
- Publication date Nov 20, 2014
- Hong Kong Applied Science and Technology Research Institute Company Limited
- Yuxing Ren
- H01 - BASIC ELECTRIC ELEMENTS

for holding or confining the layer connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Molded packaging for wide band gap semiconductor devices

Semiconductor packaging substrate fine pitch metal bump and reinfor...

Electronic device and method for manufacturing same

Package structure and manufacturing method thereof

Modified leadframe design with adhesive overflow recesses

Electronic device and method for manufacturing same

Packaged semiconductor devices and methods of packaging thereof

Semiconductor device having a cooling body with a groove

Package structure for power converter and manufacture method thereof

Modified leadframe design with adhesive overflow recesses

Semiconductor device

Electronic device and method for manufacturing same

Electronic substrate and electronic apparatus

Dam for three-dimensional integrated circuit

Semiconductor device

Semiconductor device and method with clip arrangement in IC package

Power semiconductor module for an inverter circuit and method of ma...

Circuit module and manufacturing method thereof

Electronic device package with recessed substrate for underfill con...

Semiconductor packages having an electric device with a recess

Semiconductor device

Modified leadframe design with adhesive overflow recesses

Integrated circuit (IC) package with a solder receiving area and as...

Light source module and backlight assembly having the same

Semiconductor device

Semiconductor device

Semiconductor device and method of forming flipchip interconnect st...

Integrated circuit (IC) package with a solder receiving area and as...

Method of machining a lead frame, and lead frame

Film, method for its production, and method for producing semicondu...

Patents Applicationslast 30 patents

MULTI-BARRIER SYSTEM FOR LOW-VOID THERMAL TRANSFER

PACKAGE WITH SOLDER MASK

LIQUID-REPELLING COATING FOR UNDERFILL BLEED OUT CONTROL

LIQUID METAL SHIELD FOR FINE PITCH INTERCONNECTS

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE FOR POWER CONVERTER AND MANUFACTURE METHOD THEREOF

MODIFIED LEADFRAME DESIGN WITH ADHESIVE OVERFLOW RECESSES

ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING SAME

ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING SAME

MODIFIED LEADFRAME DESIGN WITH ADHESIVE OVERFLOW RECESSES

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

PACKAGE WITH ISOLATION STRUCTURE

ELECTRONIC DEVICE PACKAGE

MODIFIED LEADFRAME DESIGN WITH ADHESIVE OVERFLOW RECESSES

SEMICONDUCTOR DEVICE

CIRCUIT MODULE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE FOR POWER CONVERTER AND MANUFACTURE METHOD THEREOF

SEMICONDUCTOR DEVICE

POWER SEMICONDUCTOR MODULE FOR AN INVERTER CIRCUIT AND METHOD OF MA...

Integrated Circuit (IC) Package with a Solder Receiving Area and As...

SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR

FILM, METHOD FOR ITS PRODUCTION, AND METHOD FOR PRODUCING SEMICONDU...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

NANOMICROCRYSTALLITE PASTE FOR PRESSURELESS SINTERING

INTEGRATED CIRCUIT (IC) PACKAGE WITH A SOLDER RECEIVING AREA AND AS...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

HIGH POWER DIELECTRIC CARRIER WITH ACCURATE DIE ATTACH LAYER