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H01L2225/1082

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2225/00Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups

Current Industry

H01L2225/1082for improving alignment between containers

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package, method of bonding workpieces and method of m...
- Patent number 11,908,843
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Bingchien Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing semiconductor pac...
- Patent number 11,908,836
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor device
- Patent number 11,854,997
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jhih-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment mark design for packages
- Patent number 11,742,298
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Info structure and method forming same
- Patent number 11,682,636
- Issue date Jun 20, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for making thereof
- Patent number 11,569,208
- Issue date Jan 31, 2023
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,430,772
- Issue date Aug 30, 2022
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge interconnect self-assembly substrate
- Patent number 11,398,463
- Issue date Jul 26, 2022
- Indiana Integrated Circuits, LLC
- Jason M. Kulick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy structure of stacked and bonded semiconductor device
- Patent number 11,393,783
- Issue date Jul 19, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Hui Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor device
- Patent number 11,276,647
- Issue date Mar 15, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jhih-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked modules
- Patent number 11,239,170
- Issue date Feb 1, 2022
- Snaptrack, Inc.
- Andreas Franz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 11,205,615
- Issue date Dec 21, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Ju Tsou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal performance structure for semiconductor packages and method...
- Patent number 11,158,614
- Issue date Oct 26, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,101,253
- Issue date Aug 24, 2021
- Samsung Electronics Co., Ltd.
- Sang-uk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Info structure and method forming same
- Patent number 10,964,650
- Issue date Mar 30, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and a method of making thereof
- Patent number 10,964,676
- Issue date Mar 30, 2021
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge interconnect self-assembly substrate
- Patent number 10,896,898
- Issue date Jan 19, 2021
- Indiana Integrated Circuits, LLC
- Jason M. Kulick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 10,867,974
- Issue date Dec 15, 2020
- Samsung Electronics Co., Ltd.
- Sang-uk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solution for reducing poor contact in InFO package
- Patent number 10,861,835
- Issue date Dec 8, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of manufacturing the same
- Patent number 10,770,446
- Issue date Sep 8, 2020
- Samsung Electronics Co., Ltd.
- Young Lyong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive wire through-mold connection apparatus and method
- Patent number 10,756,072
- Issue date Aug 25, 2020
- Intel Corporation
- Mao Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor device
- Patent number 10,607,941
- Issue date Mar 31, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jhih-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 10,586,763
- Issue date Mar 10, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Ju Tsou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printing module, printing method and system of forming a printed st...
- Patent number 10,535,627
- Issue date Jan 14, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Info structure and method forming same
- Patent number 10,529,675
- Issue date Jan 7, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment mark design for packages
- Patent number 10,522,473
- Issue date Dec 31, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for a stacked and bonded semiconductor device
- Patent number 10,522,496
- Issue date Dec 31, 2019
- Taiwan Semiconductor Manufacturing Company
- Li-Hui Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a PoP device with embedd...
- Patent number 10,446,479
- Issue date Oct 15, 2019
- STATS ChipPAC Pte. Ltd.
- Pandi C. Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming wire studs as vertical i...
- Patent number 10,446,523
- Issue date Oct 15, 2019
- STATS ChipPAC Pte. Ltd.
- Pandi C. Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures for assembly in multi-layer semiconductor...
- Patent number 10,418,350
- Issue date Sep 17, 2019
- Massachusetts Institute of Technology
- Rabindra N. Das
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...
- Publication number 20240387467
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, METHOD OF BONDING WORKPIECES AND METHOD OF M...
- Publication number 20240153930
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- BINGCHIEN WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF BONDING WORKPIECES
- Publication number 20240153931
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- BINGCHIEN WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SEMICONDUCTOR DEVICE
- Publication number 20240088056
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jhih-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...
- Publication number 20230395573
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, METHOD OF BONDING WORKPIECES AND METHOD OF M...
- Publication number 20230062411
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- BINGCHIEN WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D HETEROGENEOUS INTEGRATIONS AND METHODS OF MAKING THEREOF
- Publication number 20230041977
- Publication date Feb 9, 2023
- BroadPak Corporation
- Farhang YAZDANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED SEMICONDUCTOR STRUCTURES
- Publication number 20230026177
- Publication date Jan 26, 2023
- BroadPak Corporation
- Farhang YAZDANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SECURE SEMICONDUCTOR INTEGRATION AND METHOD FOR MAKING THEREOF
- Publication number 20220293575
- Publication date Sep 15, 2022
- BroadPak Corporation
- Farhang YAZDANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND THREE-DIMENSIONAL STACKED INTEGRATED CIRC...
- Publication number 20220238498
- Publication date Jul 28, 2022
- SOFTBANK CORP.
- Takashi TSUTSUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...
- Publication number 20220223564
- Publication date Jul 14, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming Semiconductor Device
- Publication number 20220208688
- Publication date Jun 30, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jhih-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220037295
- Publication date Feb 3, 2022
- Samsung Electronics Co., Ltd.
- Hyunsoo CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING THEREOF
- Publication number 20210242185
- Publication date Aug 5, 2021
- BroadPak Corporation
- Farhang YAZDANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Info Structure and Method Forming Same
- Publication number 20210217709
- Publication date Jul 15, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Edge Interconnect Self-Assembly Substrate
- Publication number 20210050335
- Publication date Feb 18, 2021
- Indiana Integrated Circuits, LLC
- Jason M. Kulick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20210013189
- Publication date Jan 14, 2021
- Samsung Electronics Co., Ltd.
- Sang-uk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming Semiconductor Device
- Publication number 20200227357
- Publication date Jul 16, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jhih-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Info Structure and Method Forming Same
- Publication number 20200135665
- Publication date Apr 30, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20200013764
- Publication date Jan 9, 2020
- Samsung Electronics Co., Ltd.
- Sang-uk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Alignment Mark with Grating Patterns and Method Forming Same
- Publication number 20190333862
- Publication date Oct 31, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jhih-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solution for Reducing Poor Contact in InFO Package
- Publication number 20190333900
- Publication date Oct 31, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20190096869
- Publication date Mar 28, 2019
- Samsung Electronics Co., Ltd.
- Young Lyong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE WIRE THROUGH-MOLD CONNECTION APPARATUS AND METHOD
- Publication number 20180374832
- Publication date Dec 27, 2018
- Intel Corporation
- Mao GUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND A METHOD OF MAKING THEREOF
- Publication number 20180342489
- Publication date Nov 29, 2018
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solution for Reducing Poor Contact in InFO Package
- Publication number 20180096976
- Publication date Apr 5, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a POP Device with Embedd...
- Publication number 20180068937
- Publication date Mar 8, 2018
- STATS ChipPAC Pte Ltd.
- Pandi C. Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKABLE MOLDED PACKAGES AND METHODS OF MANUFACTURE THEREOF
- Publication number 20180053753
- Publication date Feb 22, 2018
- FREESCALE SEMICONDUCTOR, INC.
- Akhilesh Kumar Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE STACKING MECHANISM WITH INTEGRATED GROUND
- Publication number 20170345803
- Publication date Nov 30, 2017
- Intel Corporation
- Alan W. Tate
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE
- Publication number 20170317062
- Publication date Nov 2, 2017
- HONGBIN SHI
- H01 - BASIC ELECTRIC ELEMENTS

for improving alignment between containers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package, method of bonding workpieces and method of m...

Semiconductor package and method of manufacturing semiconductor pac...

Method of forming semiconductor device

Alignment mark design for packages

Info structure and method forming same

Semiconductor structure and method for making thereof

Semiconductor package

Edge interconnect self-assembly substrate

Dummy structure of stacked and bonded semiconductor device

Method of forming semiconductor device

Stacked modules

Semiconductor device and method of manufacture

Thermal performance structure for semiconductor packages and method...

Semiconductor package

Info structure and method forming same

Semiconductor structure and a method of making thereof

Edge interconnect self-assembly substrate

Semiconductor package and method of fabricating the same

Solution for reducing poor contact in InFO package

Semiconductor packages and methods of manufacturing the same

Conductive wire through-mold connection apparatus and method

Method of forming semiconductor device

Semiconductor device and method of manufacture

Printing module, printing method and system of forming a printed st...

Info structure and method forming same

Alignment mark design for packages

Method for a stacked and bonded semiconductor device

Semiconductor device and method of forming a PoP device with embedd...

Semiconductor device and method of forming wire studs as vertical i...

Semiconductor structures for assembly in multi-layer semiconductor...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...

SEMICONDUCTOR PACKAGE, METHOD OF BONDING WORKPIECES AND METHOD OF M...

SEMICONDUCTOR PACKAGE AND METHOD OF BONDING WORKPIECES

METHOD OF FORMING SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...

SEMICONDUCTOR PACKAGE, METHOD OF BONDING WORKPIECES AND METHOD OF M...

3D HETEROGENEOUS INTEGRATIONS AND METHODS OF MAKING THEREOF

ENHANCED SEMICONDUCTOR STRUCTURES

SECURE SEMICONDUCTOR INTEGRATION AND METHOD FOR MAKING THEREOF

SEMICONDUCTOR PACKAGE AND THREE-DIMENSIONAL STACKED INTEGRATED CIRC...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...

Method of Forming Semiconductor Device

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING THEREOF

Info Structure and Method Forming Same

Edge Interconnect Self-Assembly Substrate

SEMICONDUCTOR PACKAGE

Method of Forming Semiconductor Device

Info Structure and Method Forming Same

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

Alignment Mark with Grating Patterns and Method Forming Same

Solution for Reducing Poor Contact in InFO Package

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME

CONDUCTIVE WIRE THROUGH-MOLD CONNECTION APPARATUS AND METHOD

SEMICONDUCTOR STRUCTURE AND A METHOD OF MAKING THEREOF

Solution for Reducing Poor Contact in InFO Package

Semiconductor Device and Method of Forming a POP Device with Embedd...

STACKABLE MOLDED PACKAGES AND METHODS OF MANUFACTURE THEREOF

MODULE STACKING MECHANISM WITH INTEGRATED GROUND

METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE