for integrated passive components

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H01L2223/6672

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00

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H01L2223/6672for integrated passive components

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Patents Grantslast 30 patents

Information Patent Grant
Transistor with integrated passive components
- Patent number 12,159,845
- Issue date Dec 3, 2024
- NXP USA, INC.
- Humayun Kabir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices designed with mold patterning to create pac...
- Patent number 12,155,133
- Issue date Nov 26, 2024
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with different types of semiconductor dies attached to a fl...
- Patent number 12,080,660
- Issue date Sep 3, 2024
- MACOM Technology Solutions Holdings, Inc.
- Xikun Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Doherty amplifier
- Patent number 12,081,174
- Issue date Sep 3, 2024
- Mitsubishi Electric Corporation
- Katsuya Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi level radio frequency (RF) integrated circuit components incl...
- Patent number 12,074,123
- Issue date Aug 27, 2024
- MACOM Technology Solutions Holdings, Inc.
- Richard Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures with integrated passive component
- Patent number 12,057,383
- Issue date Aug 6, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor die embedded in package substrate for providing capacitan...
- Patent number 12,046,568
- Issue date Jul 23, 2024
- Intel Corporation
- Andrew Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film resistor (TFR) device structure for high performance radi...
- Patent number 12,040,268
- Issue date Jul 16, 2024
- QUALCOMM Incorporated
- Je-Hsiung Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switch capacitance cancellation circuit
- Patent number 12,028,060
- Issue date Jul 2, 2024
- Murata Manufacturing Co., Ltd.
- David Kovac
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Loss compensation in radio-frequency filters
- Patent number 12,020,858
- Issue date Jun 25, 2024
- VAYYAR IMAGING LTD.
- Naftali Chayat
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor packages having a die, an encapsulant, and a redistri...
- Patent number 12,021,047
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer
- Patent number 11,973,013
- Issue date Apr 30, 2024
- AMOSENSE CO., LTD.
- Changwoo Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-integrated multi-turn coil embedded in a package magnetic core
- Patent number 11,955,426
- Issue date Apr 9, 2024
- Intel Corporation
- Huong Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Impedance element with built-in odd-mode oscillation suppression
- Patent number 11,936,348
- Issue date Mar 19, 2024
- Telefonaktiebolaget LM Ericsson (publ)
- Rob Salmond
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated passive device (IPD) components and a package and proces...
- Patent number 11,935,879
- Issue date Mar 19, 2024
- Wolfspeed, Inc.
- Eng Wah Woo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated tunable filter architecture
- Patent number 11,923,322
- Issue date Mar 5, 2024
- pSemi Corporation
- William R. Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna module
- Patent number 11,909,099
- Issue date Feb 20, 2024
- Samsung Electronics Co., Ltd.
- Won Wook So
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cavity resonator for enhancing radio-frequency performance and meth...
- Patent number 11,848,291
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Jheng-Hong Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor doped region with biased isolated members
- Patent number 11,830,830
- Issue date Nov 28, 2023
- Texas Instruments Incorporated
- Alexei Sadovnikov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure including antenna
- Patent number 11,824,020
- Issue date Nov 21, 2023
- Mediatek Inc.
- Yen-Yao Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency switch biasing topologies
- Patent number 11,777,499
- Issue date Oct 3, 2023
- Skyworks Solutions, Inc.
- Lui Ray Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor having a backside wafer cavity for radio frequency (R...
- Patent number 11,735,538
- Issue date Aug 22, 2023
- Wolfspeed, Inc.
- Fabian Radulescu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-mode wireless charging device
- Patent number 11,735,518
- Issue date Aug 22, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Wei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-package passive inductive element for reflection mitigation
- Patent number 11,735,519
- Issue date Aug 22, 2023
- Xilinx, Inc.
- Zhaoyin Daniel Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor die embedded in package substrate for providing capacitan...
- Patent number 11,728,294
- Issue date Aug 15, 2023
- Intel Corporation
- Andrew Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Terahertz element and semiconductor device
- Patent number 11,699,846
- Issue date Jul 11, 2023
- Rohm Co., Ltd.
- Toshikazu Mukai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices designed with mold patterning to create pac...
- Patent number 11,658,418
- Issue date May 23, 2023
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for an inductor structure having an unconventio...
- Patent number 11,652,135
- Issue date May 16, 2023
- Marvell International Ltd.
- Huy Thong Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures with integrated passive component
- Patent number 11,626,363
- Issue date Apr 11, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-to-die isolation structures for packaged transistor devices
- Patent number 11,621,322
- Issue date Apr 4, 2023
- Wolfspeed, Inc.
- Lei Zhao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Making an Interconnect Bridge wi...
- Publication number 20240404956
- Publication date Dec 5, 2024
- STATS ChipPAC Pte Ltd.
- YongTaek Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAVITY RESONATOR FOR ENHANCING RADIO-FREQUENCY PERFORMANCE AND METH...
- Publication number 20240395739
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jheng-Hong JIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240371711
- Publication date Nov 7, 2024
- Advanced Semiconductor Engineering, Inc.
- Cheng-Ting CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED MILLIMETER WAVE ANTENNA ESD PROTECTION
- Publication number 20240363556
- Publication date Oct 31, 2024
- Intel Corporation
- Harald Gossner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL CLIP IN INTEGRATED DEVICE PACKAGE FOR GROUNDING AND ELECTROMA...
- Publication number 20240347474
- Publication date Oct 17, 2024
- Skyworks Solutions, Inc.
- Andrew Christopher Laib
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR DIE EMBEDDED IN PACKAGE SUBSTRATE FOR PROVIDING CAPACITAN...
- Publication number 20240321785
- Publication date Sep 26, 2024
- Intel Corporation
- Andrew COLLINS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SWITCH CAPACITANCE CANCELLATION CIRCUIT
- Publication number 20240313772
- Publication date Sep 19, 2024
- Murata Manufacturing Co., Ltd.
- David KOVAC
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING SEMICONDUCTOR PACKAGES HAVING A DIE WITH AN ENCA...
- Publication number 20240297131
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Tunable Filter Architecture
- Publication number 20240274551
- Publication date Aug 15, 2024
- pSemi Corporation
- William R. Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES DESIGNED WITH MOLD PATTERNING TO CREATE PAC...
- Publication number 20240266745
- Publication date Aug 8, 2024
- Intel Corporation
- Feras EID
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TSV SEMICONDUCTOR DEVICE INCLUDING INDUCTIVE COMPENSATION LOOPS
- Publication number 20240213151
- Publication date Jun 27, 2024
- Western Digital Technologies, Inc.
- John T. Contreras
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED PASSIVE DEVICES (IPD) HAVING A BASEBAND DAMPING RESISTOR...
- Publication number 20240213184
- Publication date Jun 27, 2024
- Wolfspeed, Inc.
- Haedong JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER WITH INTEGRATIVE PASSIVE COMPONENTS
- Publication number 20240203911
- Publication date Jun 20, 2024
- NXP USA, Inc.
- Zhiwei Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITIVE COUPLING PACKAGE STRUCTURE
- Publication number 20240194573
- Publication date Jun 13, 2024
- LITE-ON SINGAPORE PTE. LTD.
- You-Fa WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER MODULE WITH TRANSISTOR DIES FOR MULTIPLE AMPLIFIER...
- Publication number 20240186212
- Publication date Jun 6, 2024
- NXP USA, Inc.
- Stephen Reza Hiemstra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED STRUCTURE WITH TRAP RICH REGIONS AND LOW RESISTIVITY REG...
- Publication number 20240162232
- Publication date May 16, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Vibhor JAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SWITCHING MODULE
- Publication number 20240113667
- Publication date Apr 4, 2024
- KYOSAN ELECTRIC MFG. CO., LTD.
- Hiroshi Kunitama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH ANTENNA
- Publication number 20240088083
- Publication date Mar 14, 2024
- Fujitsu Limited
- Junya IKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packages and Methods of Forming the Same
- Publication number 20240079356
- Publication date Mar 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOHERTY AMPLIFIERS
- Publication number 20240063756
- Publication date Feb 22, 2024
- NXP USA, Inc.
- Qi Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY SWITCH BIASING TOPOLOGIES
- Publication number 20240048143
- Publication date Feb 8, 2024
- Skyworks Solutions, Inc.
- Lui Ray Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DOPED REGION WITH BIASED ISOLATED MEMBERS
- Publication number 20240047387
- Publication date Feb 8, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Alexei Sadovnikov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE INTEGRATED WITH PASSIVE DEVICE AND METHOD FOR MANUFACTURI...
- Publication number 20240047507
- Publication date Feb 8, 2024
- BOE TECHNOLOGY GROUP CO., LTD.
- Yingwei LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE
- Publication number 20240038692
- Publication date Feb 1, 2024
- Murata Manufacturing Co., Ltd.
- Takashi YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO-FREQUENCY MODULE
- Publication number 20240030166
- Publication date Jan 25, 2024
- Murata Manufacturing Co., Ltd.
- Hiromichi KITAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCY MODULE
- Publication number 20240030165
- Publication date Jan 25, 2024
- Murata Manufacturing Co., Ltd.
- Kiyoshi AIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM RESISTOR (TFR) DEVICE STRUCTURE FOR HIGH PERFORMANCE RADI...
- Publication number 20230395491
- Publication date Dec 7, 2023
- QUALCOMM Incorporated
- Je-Hsiung LAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER CIRCUIT
- Publication number 20230378105
- Publication date Nov 23, 2023
- MURATA MANUFACTURING CO., LTD.
- Shohei IMAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TERAHERTZ ELEMENT AND SEMICONDUCTOR DEVICE
- Publication number 20230378640
- Publication date Nov 23, 2023
- ROHM CO., LTD.
- Toshikazu MUKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAVITY RESONATOR FOR ENHANCING RADIO-FREQUENCY PERFORMANCE AND METH...
- Publication number 20230378104
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Jheng-Hong JIANG
- H01 - BASIC ELECTRIC ELEMENTS

for integrated passive components

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Transistor with integrated passive components

Microelectronic devices designed with mold patterning to create pac...

Package with different types of semiconductor dies attached to a fl...

Doherty amplifier

Multi level radio frequency (RF) integrated circuit components incl...

Bonded structures with integrated passive component

Capacitor die embedded in package substrate for providing capacitan...

Thin film resistor (TFR) device structure for high performance radi...

Switch capacitance cancellation circuit

Loss compensation in radio-frequency filters

Semiconductor packages having a die, an encapsulant, and a redistri...

Interposer

Package-integrated multi-turn coil embedded in a package magnetic core

Impedance element with built-in odd-mode oscillation suppression

Integrated passive device (IPD) components and a package and proces...

Integrated tunable filter architecture

Antenna module

Cavity resonator for enhancing radio-frequency performance and meth...

Semiconductor doped region with biased isolated members

Semiconductor package structure including antenna

Radio frequency switch biasing topologies

Semiconductor having a backside wafer cavity for radio frequency (R...

Dual-mode wireless charging device

In-package passive inductive element for reflection mitigation

Capacitor die embedded in package substrate for providing capacitan...

Terahertz element and semiconductor device

Microelectronic devices designed with mold patterning to create pac...

Systems and methods for an inductor structure having an unconventio...

Bonded structures with integrated passive component

Die-to-die isolation structures for packaged transistor devices

Patents Applicationslast 30 patents

Semiconductor Device and Method of Making an Interconnect Bridge wi...

CAVITY RESONATOR FOR ENHANCING RADIO-FREQUENCY PERFORMANCE AND METH...

PACKAGE STRUCTURE

INTEGRATED MILLIMETER WAVE ANTENNA ESD PROTECTION

METAL CLIP IN INTEGRATED DEVICE PACKAGE FOR GROUNDING AND ELECTROMA...

CAPACITOR DIE EMBEDDED IN PACKAGE SUBSTRATE FOR PROVIDING CAPACITAN...

SWITCH CAPACITANCE CANCELLATION CIRCUIT

METHODS OF FORMING SEMICONDUCTOR PACKAGES HAVING A DIE WITH AN ENCA...

Integrated Tunable Filter Architecture

MICROELECTRONIC DEVICES DESIGNED WITH MOLD PATTERNING TO CREATE PAC...

TSV SEMICONDUCTOR DEVICE INCLUDING INDUCTIVE COMPENSATION LOOPS

INTEGRATED PASSIVE DEVICES (IPD) HAVING A BASEBAND DAMPING RESISTOR...

INTERPOSER WITH INTEGRATIVE PASSIVE COMPONENTS

CAPACITIVE COUPLING PACKAGE STRUCTURE

POWER AMPLIFIER MODULE WITH TRANSISTOR DIES FOR MULTIPLE AMPLIFIER...

INTEGRATED STRUCTURE WITH TRAP RICH REGIONS AND LOW RESISTIVITY REG...

SWITCHING MODULE

SEMICONDUCTOR DEVICE WITH ANTENNA

Integrated Circuit Packages and Methods of Forming the Same

DOHERTY AMPLIFIERS

RADIO FREQUENCY SWITCH BIASING TOPOLOGIES

SEMICONDUCTOR DOPED REGION WITH BIASED ISOLATED MEMBERS

SUBSTRATE INTEGRATED WITH PASSIVE DEVICE AND METHOD FOR MANUFACTURI...

HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE

RADIO-FREQUENCY MODULE

HIGH-FREQUENCY MODULE

THIN FILM RESISTOR (TFR) DEVICE STRUCTURE FOR HIGH PERFORMANCE RADI...

POWER AMPLIFIER CIRCUIT

TERAHERTZ ELEMENT AND SEMICONDUCTOR DEVICE

CAVITY RESONATOR FOR ENHANCING RADIO-FREQUENCY PERFORMANCE AND METH...