for measurement of a wafer

Industry

CPC
G01B2210/48

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

GPHYSICS G01Measuring instruments G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS MEASURING ANGLES MEASURING AREAS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS G01B2210/00Aspects not specifically covered by any group under G01B

Current Industry

G01B2210/48for measurement of a wafer

Industries

Patents Grantslast 30 patents

Information Patent Grant
Height detection apparatus and coating apparatus equipped with the...
- Patent number 11,402,195
- Issue date Aug 2, 2022
- NTN Corporation
- Hiroaki Ohba
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Height detection apparatus and coating apparatus equipped with the...
- Patent number 11,326,871
- Issue date May 10, 2022
- NTN Corporation
- Hiroaki Ohba
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Chip defect detection device and detection method
- Patent number 10,942,129
- Issue date Mar 9, 2021
- SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
- Pengli Zhang
- G01 - MEASURING TESTING
Information Patent Grant
Patterned wafer geometry measurements for semiconductor process con...
- Patent number 10,576,603
- Issue date Mar 3, 2020
- KLA-Tencor Corporation
- Pradeep Vukkadala
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Sample observation method and sample observation device
- Patent number 10,229,812
- Issue date Mar 12, 2019
- Hitachi High-Technologies Corporation
- Minoru Harada
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Scatterometry system and method for generating non-overlapping and...
- Patent number 10,209,183
- Issue date Feb 19, 2019
- KLA-Tencor Corporation
- Tzahi Grunzweig
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Scatterometry system and method for generating non-overlapping and...
- Patent number 9,719,920
- Issue date Aug 1, 2017
- KLA-Tencor Corporation
- Tzahi Grunzweig
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Predictive wafer modeling based focus error prediction using correl...
- Patent number 9,707,660
- Issue date Jul 18, 2017
- KLA-Tencor Corporation
- Pradeep Vukkadala
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for measuring the shape and thickness variatio...
- Patent number 8,537,369
- Issue date Sep 17, 2013
- KLA Tencor
- Shouhong Tang
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for moving an article relative to and between...
- Patent number 6,242,926
- Issue date Jun 5, 2001
- Ipec Precision, Inc.
- George J. Gardopee
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for separating fixture-induced error from meas...
- Patent number 4,750,141
- Issue date Jun 7, 1988
- ADE Corporation
- Neil H. Judell
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
HEIGHT DETECTION APPARATUS AND COATING APPARATUS EQUIPPED WITH THE...
- Publication number 20200378748
- Publication date Dec 3, 2020
- NTN Corporation
- Hiroaki Ohba
- G01 - MEASURING TESTING
Information Patent Application
CHIP DEFECT DETECTION DEVICE AND DETECTION METHOD
- Publication number 20200173932
- Publication date Jun 4, 2020
- SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
- Pengli ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR MEASURING HEIGHT IN THE PRESENCE OF THIN LAYERS
- Publication number 20180364028
- Publication date Dec 20, 2018
- UNITY SEMICONDUCTOR
- Jean-Philippe PIEL
- G01 - MEASURING TESTING
Information Patent Application
Scatterometry System and Method for Generating Non-Overlapping and...
- Publication number 20180003630
- Publication date Jan 4, 2018
- KLA-Tencor Corporation
- Tzahi Grunzweig
- G01 - MEASURING TESTING
Information Patent Application
METHOD AND APPARATUS FOR MEASURING SHAPE AND THICKNESS VARIATION OF...
- Publication number 20130188179
- Publication date Jul 25, 2013
- KLA-Tencor Corporation
- Shouhong Tang
- G01 - MEASURING TESTING
Information Patent Application
METHOD AND APPARATUS OF ARRAYED, CLUSTERED OR COUPLED EDDY CURRENT...
- Publication number 20070163712
- Publication date Jul 19, 2007
- Yehiel Gotkis
- G01 - MEASURING TESTING

for measurement of a wafer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Height detection apparatus and coating apparatus equipped with the...

Height detection apparatus and coating apparatus equipped with the...

Chip defect detection device and detection method

Patterned wafer geometry measurements for semiconductor process con...

Sample observation method and sample observation device

Scatterometry system and method for generating non-overlapping and...

Scatterometry system and method for generating non-overlapping and...

Predictive wafer modeling based focus error prediction using correl...

Method and apparatus for measuring the shape and thickness variatio...

Method and apparatus for moving an article relative to and between...

Method and apparatus for separating fixture-induced error from meas...

Patents Applicationslast 30 patents

HEIGHT DETECTION APPARATUS AND COATING APPARATUS EQUIPPED WITH THE...

CHIP DEFECT DETECTION DEVICE AND DETECTION METHOD

DEVICE AND METHOD FOR MEASURING HEIGHT IN THE PRESENCE OF THIN LAYERS

Scatterometry System and Method for Generating Non-Overlapping and...

METHOD AND APPARATUS FOR MEASURING SHAPE AND THICKNESS VARIATION OF...

METHOD AND APPARATUS OF ARRAYED, CLUSTERED OR COUPLED EDDY CURRENT...