for protecting against electromagnetic or electrostatic interferences

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CPC
B81B7/0064

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81BMICRO-STRUCTURAL DEVICES OR SYSTEMS B81B7/00Micro-structural systems; Auxiliary parts of micro-structural devices or systems

Current Industry

B81B7/0064for protecting against electromagnetic or electrostatic interferences

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Microphone assembly with disturbance compensation
- Patent number 12,156,003
- Issue date Nov 26, 2024
- Knowles Electronics, LLC
- Jakob Kenn Toft
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Reduced light reflection package
- Patent number 12,133,049
- Issue date Oct 29, 2024
- Invensense, Inc.
- Roberto Brioschi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromechanical sensor device having an ASIC chip integrated into a...
- Patent number 11,906,383
- Issue date Feb 20, 2024
- Robert Bosch GmbH
- Stefan Pinter
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
System for protecting mems product under ESD event
- Patent number 11,802,040
- Issue date Oct 31, 2023
- AAC Technologies Pte. Ltd.
- David Molinero Giles
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Reduced light reflection package
- Patent number 11,800,297
- Issue date Oct 24, 2023
- Invensense, Inc.
- Roberto Brioschi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor structures
- Patent number 11,736,866
- Issue date Aug 22, 2023
- Cirrus Logic Inc.
- Rkia Achehboune
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wearable infrared temperature sensing device
- Patent number 11,719,579
- Issue date Aug 8, 2023
- PixArt Imaging Inc.
- Chih-Ming Sun
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Device package with reduced radio frequency losses
- Patent number 11,574,879
- Issue date Feb 7, 2023
- Infineon Technologies AG
- Pedro Augusto Borrego Lambin Torres Amaral
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
EMI reduction in piezoelectric micromachined ultrasound transducer...
- Patent number 11,515,465
- Issue date Nov 29, 2022
- Invensense, Inc.
- Nikhil Apte
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Capacitive sensors having temperature stable output
- Patent number 11,427,465
- Issue date Aug 30, 2022
- Sciosense B.V.
- Olaf Wunnicke
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS microphone and a manufacturing method thereof
- Patent number 11,388,525
- Issue date Jul 12, 2022
- WEIFANG GOERTEK MICROELECTRONICS CO., LTD.
- Quanbo Zou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Acoustic transducer assembly
- Patent number 11,365,118
- Issue date Jun 21, 2022
- Knowles Electronics, LLC
- Joshua Watson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Antenna apparatus
- Patent number 11,362,411
- Issue date Jun 14, 2022
- SOFANT TECHNOLOGIES LTD
- Nakul Raghavanand Haridas
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stacked structure and method for manufacturing the same
- Patent number 11,332,363
- Issue date May 17, 2022
- Advanced Semiconductor Engineering, Inc.
- Chieh-An Yeh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Piezoelectric micromachined ultrasonic transducers and methods for...
- Patent number 11,329,098
- Issue date May 10, 2022
- VANGUARD INTERNATIONAL SEMICONDUCTOR SINGAPORE PTE. LTD.
- You Qian
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaging for MEMS transducers
- Patent number 11,299,392
- Issue date Apr 12, 2022
- Cirrus Logic, Inc.
- Rkia Achehboune
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wearable infrared temperature sensing device
- Patent number 11,268,859
- Issue date Mar 8, 2022
- PixArt Imaging Inc.
- Chih-Ming Sun
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS chip and electrical packaging method for MEMS chip
- Patent number 11,242,243
- Issue date Feb 8, 2022
- Huawei Technologies Co., Ltd.
- Yuming Wei
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor structures
- Patent number 11,223,907
- Issue date Jan 11, 2022
- Cirrus Logic, Inc.
- Rkia Achehboune
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS devices and processes
- Patent number 11,197,103
- Issue date Dec 7, 2021
- Cirrus Logic, Inc.
- Marek Sebastian Piechocinski
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Over-under sensor packaging with sensor spaced apart from control chip
- Patent number 11,174,152
- Issue date Nov 16, 2021
- Infineon Technologies AG
- Sook Woon Chan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Package level thermal gradient sensing
- Patent number 11,174,153
- Issue date Nov 16, 2021
- Invensense, Inc.
- Ilya Gurin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Device for suppressing stray radiation
- Patent number 11,136,237
- Issue date Oct 5, 2021
- Infineon Technologies AG
- Werner Simbuerger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS-sensor
- Patent number 11,117,798
- Issue date Sep 14, 2021
- Infineon Technologies AG
- Gunar Lorenz
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaged circuit system structure
- Patent number 10,934,157
- Issue date Mar 2, 2021
- Murata Manufacturing Co., Ltd.
- Heikki Kuisma
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS capacitive shear sensor system having an interface circuit
- Patent number 10,859,448
- Issue date Dec 8, 2020
- University of Florida Research Foundation, Incorporated
- Casey A. Barnard
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical systems package structure
- Patent number 10,841,679
- Issue date Nov 17, 2020
- Advanced Semiconductor Engineering, Inc.
- Hsu-Liang Hsiao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS assembly
- Patent number 10,793,419
- Issue date Oct 6, 2020
- Infineon Technologies AG
- Marc Fueldner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Molded lead frame sensor package
- Patent number 10,781,095
- Issue date Sep 22, 2020
- Infineon Technologies AG
- Jochen Dangelmaier
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
CMOS-MEMS integrated device without standoff in MEMS
- Patent number 10,773,951
- Issue date Sep 15, 2020
- Invensense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
MEMS DEVICE
- Publication number 20250026632
- Publication date Jan 23, 2025
- Rohm Co., Ltd.
- Martin Wilfried HELLER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240116751
- Publication date Apr 11, 2024
- XINTEC INC.
- Chia-Ming CHENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
REDUCED LIGHT REFLECTION PACKAGE
- Publication number 20240015447
- Publication date Jan 11, 2024
- InvenSense, Inc.
- Roberto Brioschi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WEARABLE DEVICE
- Publication number 20230314229
- Publication date Oct 5, 2023
- PIXART IMAGING Inc.
- CHIH-MING SUN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE, MICROPHONE DEVICE, AND ELECTRONIC APPARATUS
- Publication number 20230269543
- Publication date Aug 24, 2023
- KYOCERA CORPORATION
- Koutarou NAKAMOTO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Device and Method of Making a MEMS Semiconductor Package
- Publication number 20230192478
- Publication date Jun 22, 2023
- UTAC Headquarters Pte. Ltd.
- Phongsak Sawasdee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PRESSURE SENSOR STRUCTURE, PRESSURE SENSOR DEVICE, AND METHOD OF MA...
- Publication number 20230146158
- Publication date May 11, 2023
- Murata Manufacturing Co., Ltd.
- Kaoru KISHIGUI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROPHONE ASSEMBLY WITH DISTURBANCE COMPENSATION
- Publication number 20230112042
- Publication date Apr 13, 2023
- KNOWLES ELECTRONICS, LLC
- Jakob Kenn Toft
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ANTENNA APPARATUS
- Publication number 20220271416
- Publication date Aug 25, 2022
- SOFANT TECHNOLOGIES LTD.
- Nakul Raghavanand HARIDAS
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
System For Protecting MEMS Product Under ESD Event
- Publication number 20220227620
- Publication date Jul 21, 2022
- AAC TECHNOLOGIES (NANJING) CO., LTD.
- David Molinero Giles
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Enclosures for Microphone Assemblies Including a Fluoropolymer Insu...
- Publication number 20220201387
- Publication date Jun 23, 2022
- KNOWLES ELECTRONICS, LLC
- Adam Ariffin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
REDUCED LIGHT REFLECTION PACKAGE
- Publication number 20220191624
- Publication date Jun 16, 2022
- InvenSense, Inc.
- Roberto Brioschi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ACOUSTIC TRANSDUCER ASSEMBLY
- Publication number 20220177299
- Publication date Jun 9, 2022
- KNOWLES ELECTRONICS, LLC
- Joshua Watson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WEARABLE INFRARED TEMPERATURE SENSING DEVICE
- Publication number 20220136905
- Publication date May 5, 2022
- PIXART IMAGING Inc.
- CHIH-MING SUN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR STRUCTURES
- Publication number 20220060835
- Publication date Feb 24, 2022
- Cirrus Logic International Semiconductor Ltd.
- Rkia ACHEHBOUNE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMECHANICAL SENSOR DEVICE AND CORRESPONDING MANUFACTURING METHOD
- Publication number 20210348976
- Publication date Nov 11, 2021
- ROBERT BOSCH GmbH
- Stefan Pinter
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS-Sensor
- Publication number 20210323813
- Publication date Oct 21, 2021
- INFINEON TECHNOLOGIES AG
- Gunar Lorenz
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Capacitive Sensors Having Temperature Stable Output
- Publication number 20210163282
- Publication date Jun 3, 2021
- Sciosense B.V.
- Olaf Wunnicke
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STACKED STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210130166
- Publication date May 6, 2021
- Advanced Semiconductor Engineering, Inc.
- Chieh-An YEH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE LEVEL THERMAL GRADIENT SENSING
- Publication number 20210053820
- Publication date Feb 25, 2021
- InvenSense, Inc.
- Ilya Gurin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE STRUCTURE OF MICRO-ELECTRO-MECHANICAL-SYSTEM (MEMS) MICROPH...
- Publication number 20200385263
- Publication date Dec 10, 2020
- SOLID STATE SYSTEM CO., LTD.
- Chien-Hsing Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGING FOR MEMS TRANSDUCERS
- Publication number 20200377363
- Publication date Dec 3, 2020
- Cirrus Logic International Semiconductor Ltd.
- Rkia ACHEHBOUNE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR STRUCTURES
- Publication number 20200304920
- Publication date Sep 24, 2020
- Cirrus Logic International Semiconductor Ltd.
- Rkia ACHEHBOUNE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
A PACKAGED CIRCUIT SYSTEM STRUCTURE
- Publication number 20200290866
- Publication date Sep 17, 2020
- MURATA MANUFACTURING CO., LTD.
- Heikki KUISMA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WEARABLE INFRARED TEMPERATURE SENSING DEVICE
- Publication number 20200240846
- Publication date Jul 30, 2020
- PIXART IMAGING Inc.
- CHIH-MING SUN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE WITH MOVABLE STAGE
- Publication number 20200212826
- Publication date Jul 2, 2020
- Industrial Technology Research Institute
- Yu-Wen HSU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MOLDED LEAD FRAME SENSOR PACKAGE
- Publication number 20200189908
- Publication date Jun 18, 2020
- INFINEON TECHNOLOGIES AG
- Jochen DANGELMAIER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
A MEMS MICROPHONE AND A MANUFACTURING METHOD THEREOF
- Publication number 20200186939
- Publication date Jun 11, 2020
- Goertek, Inc.
- Quanbo Zou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICES AND PROCESSES
- Publication number 20200137501
- Publication date Apr 30, 2020
- Cirrus Logic International Semiconductor Ltd.
- Marek Sebastian PIECHOCINSKI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SHIELDED SEMICONDUCTOR DEVICE AND LEAD FRAME THEREFOR
- Publication number 20200131030
- Publication date Apr 30, 2020
- NXP USA, Inc.
- Lee Fee Ngion
- B81 - MICRO-STRUCTURAL TECHNOLOGY

for protecting against electromagnetic or electrostatic interferences

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Microphone assembly with disturbance compensation

Reduced light reflection package

Micromechanical sensor device having an ASIC chip integrated into a...

System for protecting mems product under ESD event

Reduced light reflection package

Semiconductor structures

Wearable infrared temperature sensing device

Device package with reduced radio frequency losses

EMI reduction in piezoelectric micromachined ultrasound transducer...

Capacitive sensors having temperature stable output

MEMS microphone and a manufacturing method thereof

Acoustic transducer assembly

Antenna apparatus

Stacked structure and method for manufacturing the same

Piezoelectric micromachined ultrasonic transducers and methods for...

Packaging for MEMS transducers

Wearable infrared temperature sensing device

MEMS chip and electrical packaging method for MEMS chip

Semiconductor structures

MEMS devices and processes

Over-under sensor packaging with sensor spaced apart from control chip

Package level thermal gradient sensing

Device for suppressing stray radiation

MEMS-sensor

Packaged circuit system structure

MEMS capacitive shear sensor system having an interface circuit

Microelectromechanical systems package structure

MEMS assembly

Molded lead frame sensor package

CMOS-MEMS integrated device without standoff in MEMS

Patents Applicationslast 30 patents

MEMS DEVICE

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

REDUCED LIGHT REFLECTION PACKAGE

WEARABLE DEVICE

PACKAGE, MICROPHONE DEVICE, AND ELECTRONIC APPARATUS

Semiconductor Device and Method of Making a MEMS Semiconductor Package

PRESSURE SENSOR STRUCTURE, PRESSURE SENSOR DEVICE, AND METHOD OF MA...

MICROPHONE ASSEMBLY WITH DISTURBANCE COMPENSATION

ANTENNA APPARATUS

System For Protecting MEMS Product Under ESD Event

Enclosures for Microphone Assemblies Including a Fluoropolymer Insu...

REDUCED LIGHT REFLECTION PACKAGE

ACOUSTIC TRANSDUCER ASSEMBLY

WEARABLE INFRARED TEMPERATURE SENSING DEVICE

SEMICONDUCTOR STRUCTURES

MICROMECHANICAL SENSOR DEVICE AND CORRESPONDING MANUFACTURING METHOD

MEMS-Sensor

Capacitive Sensors Having Temperature Stable Output

STACKED STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

PACKAGE LEVEL THERMAL GRADIENT SENSING

PACKAGE STRUCTURE OF MICRO-ELECTRO-MECHANICAL-SYSTEM (MEMS) MICROPH...

PACKAGING FOR MEMS TRANSDUCERS

SEMICONDUCTOR STRUCTURES

A PACKAGED CIRCUIT SYSTEM STRUCTURE

WEARABLE INFRARED TEMPERATURE SENSING DEVICE

MEMS DEVICE WITH MOVABLE STAGE

MOLDED LEAD FRAME SENSOR PACKAGE

A MEMS MICROPHONE AND A MANUFACTURING METHOD THEREOF

MEMS DEVICES AND PROCESSES

SHIELDED SEMICONDUCTOR DEVICE AND LEAD FRAME THEREFOR