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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with solder on pillar
- Patent number 12,107,062
- Issue date Oct 1, 2024
- Texas Instruments Incorporated
- Rafael Jose Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out interconnect integration processes and structures
- Patent number 12,074,106
- Issue date Aug 27, 2024
- Applied Materials, Inc.
- Richard W. Plavidal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures for low temperature bonding using nanoparticles
- Patent number 12,027,487
- Issue date Jul 2, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for low temperature bonding using nanoparticles
- Patent number 11,973,056
- Issue date Apr 30, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 11,855,014
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for low temperature bonding using nanoparticles
- Patent number 11,710,718
- Issue date Jul 25, 2023
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out interconnect integration processes and structures
- Patent number 11,699,651
- Issue date Jul 11, 2023
- Applied Materials, Inc.
- Richard W. Plavidal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming recesses in molding compound of wafer to reduce stress
- Patent number 11,658,153
- Issue date May 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus of processor wafer bonding for wafer-scale int...
- Patent number 11,651,973
- Issue date May 16, 2023
- International Business Machines Corporation
- Jae-Woong Nah
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Sintering materials and attachment methods using same
- Patent number 11,389,865
- Issue date Jul 19, 2022
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor devices
- Patent number 11,127,703
- Issue date Sep 21, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Yu Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure manufacturing method
- Patent number 10,937,751
- Issue date Mar 2, 2021
- LBSEMICON CO., LTD.
- Jin Kuk Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit module and manufacturing method therefor
- Patent number 10,930,573
- Issue date Feb 23, 2021
- Murata Manufacturing Co., Ltd.
- Shingo Funakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for low temperature bonding using nanoparticles
- Patent number 10,892,246
- Issue date Jan 12, 2021
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for low temperature bonding using nanoparticles
- Patent number 10,886,250
- Issue date Jan 5, 2021
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 10,867,941
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal bonding pads for packaging applications
- Patent number 10,825,792
- Issue date Nov 3, 2020
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor device manufacturing method
- Patent number 10,714,443
- Issue date Jul 14, 2020
- Lapis Semiconductor Co., Ltd.
- Hirokazu Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming recesses in molding compound of wafer to reduce stress
- Patent number 10,685,936
- Issue date Jun 16, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having first and second electrode layers elect...
- Patent number 10,593,814
- Issue date Mar 17, 2020
- Rohm Co., Ltd.
- Hiroki Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for low temperature bonding using nanoparticles
- Patent number 10,535,626
- Issue date Jan 14, 2020
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal bonding pads for packaging applications
- Patent number 10,381,323
- Issue date Aug 13, 2019
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective tape and method for manufacturing semiconductor device u...
- Patent number 10,312,125
- Issue date Jun 4, 2019
- Dexerials Corporation
- Hironobu Moriyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semicondcutor device and manufacturing method thereof
- Patent number 10,276,528
- Issue date Apr 30, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chin-Yu Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of forming thereof
- Patent number 10,262,959
- Issue date Apr 16, 2019
- Infineon Technologies AG
- Evelyn Napetschnig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having first and second electrode layers elect...
- Patent number 10,164,125
- Issue date Dec 25, 2018
- Rohm Co., Ltd.
- Hiroki Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 10,141,295
- Issue date Nov 27, 2018
- Renesas Electronics Corporation
- Bunji Yasumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure with array of micrometer scale copper pillar ba...
- Patent number 10,128,123
- Issue date Nov 13, 2018
- Imec VZW
- Bivragh Majeed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive connections, structures with such connections, and metho...
- Patent number 10,049,998
- Issue date Aug 14, 2018
- Invensas Corporation
- Rajesh Katkar
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and semiconductor device manufacturing method
- Patent number 10,043,773
- Issue date Aug 7, 2018
- Lapis Semiconductor Co., Ltd.
- Hirokazu Saito
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
- Publication number 20240312954
- Publication date Sep 19, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING SOLDER BUMPS ON A SUPERCONDUCTING QUBIT SUBSTRATE
- Publication number 20240297136
- Publication date Sep 5, 2024
- IMEC vzw
- Jaber Derakhshandeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20240120207
- Publication date Apr 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Lung-Kai Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
- Publication number 20230335531
- Publication date Oct 19, 2023
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SOLDER ON PILLAR
- Publication number 20230299031
- Publication date Sep 21, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Rafael Jose Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming Recesses in Molding Compound of Wafer to Reduce Stress
- Publication number 20230253370
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING SHEET AND WAFER PROCESSING METHOD
- Publication number 20230230870
- Publication date Jul 20, 2023
- Denka Company Limited
- Mizuki HASUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
- Publication number 20230132060
- Publication date Apr 27, 2023
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND FORMATION METHOD THEREOF
- Publication number 20220278075
- Publication date Sep 1, 2022
- NANTONG TONGFU MICROELECTRONICS CO., LTD
- Lei SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structures And Methods For Low Temperature Bonding Using Nanoparticles
- Publication number 20210225801
- Publication date Jul 22, 2021
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming Recesses in Molding Compound of Wafer to Reduce Stress
- Publication number 20200286863
- Publication date Sep 10, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE MANUFACTURING METHOD
- Publication number 20200266163
- Publication date Aug 20, 2020
- LBSEMICON CO., LTD.
- Jin Kuk LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structures And Methods For Low Temperature Bonding Using Nanoparticles
- Publication number 20200152598
- Publication date May 14, 2020
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL BONDING PADS FOR PACKAGING APPLICATIONS
- Publication number 20190304948
- Publication date Oct 3, 2019
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20190229081
- Publication date Jul 25, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chin-Yu Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT MODULE AND MANUFACTURING METHOD THEREFOR
- Publication number 20190181068
- Publication date Jun 13, 2019
- MURATA MANUFACTURING CO., LTD.
- Shingo FUNAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDCUTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20190027452
- Publication date Jan 24, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chin-Yu Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20180315726
- Publication date Nov 1, 2018
- LAPIS SEMICONDUCTOR CO., LTD.
- HIROKAZU SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTIVE TAPE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE U...
- Publication number 20180151405
- Publication date May 31, 2018
- DEXERIALS CORPORATION
- Hironobu MORIYAMA
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20180040598
- Publication date Feb 8, 2018
- Renesas Electronics Corporation
- Bunji Yasumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20180040579
- Publication date Feb 8, 2018
- LAPIS SEMICONDUCTOR CO., LTD.
- HIROKAZU SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20170092610
- Publication date Mar 30, 2017
- LAPIS SEMICONDUCTOR CO., LTD.
- HIROKAZU SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRY-REMOVABLE PROTECTIVE COATINGS
- Publication number 20170033069
- Publication date Feb 2, 2017
- Intel Corporation
- Mihir A. Oka
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PRE-PACKAGE AND METHODS OF MANUFACTURING SEMICONDUCTOR PACKAGE AND...
- Publication number 20160141260
- Publication date May 19, 2016
- Gun-ho Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRY-REMOVABLE PROTECTIVE COATINGS
- Publication number 20150270235
- Publication date Sep 24, 2015
- Mihir A. Oka
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND MANUFACTURING METHOD
- Publication number 20150262955
- Publication date Sep 17, 2015
- Taiwan Semiconductor Manufacturing Co., LTD
- Li-Guo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20140361431
- Publication date Dec 11, 2014
- SONY CORPORATION
- Katsuji Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESS FOR MOLDED CHIP SCALE PACKAGE (MCSP) WITH THICK BACKS...
- Publication number 20140315350
- Publication date Oct 23, 2014
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Conductive Vias Using Ba...
- Publication number 20140300002
- Publication date Oct 9, 2014
- STATS ChipPAC, Ltd.
- Duk Ju Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP DIODE AND DIODE PACKAGE
- Publication number 20140284754
- Publication date Sep 25, 2014
- Rohm Co., Ltd.
- Hiroki Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS

for protecting parts during manufacture

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device with solder on pillar

Fan-out interconnect integration processes and structures

Structures for low temperature bonding using nanoparticles

Methods for low temperature bonding using nanoparticles

Semiconductor device and method

Structures and methods for low temperature bonding using nanoparticles

Fan-out interconnect integration processes and structures

Forming recesses in molding compound of wafer to reduce stress

Method and apparatus of processor wafer bonding for wafer-scale int...

Sintering materials and attachment methods using same

Semiconductor devices

Bump structure manufacturing method

Circuit module and manufacturing method therefor

Structures and methods for low temperature bonding using nanoparticles

Structures and methods for low temperature bonding using nanoparticles

Semiconductor device and method

Metal bonding pads for packaging applications

Semiconductor device and semiconductor device manufacturing method

Forming recesses in molding compound of wafer to reduce stress

Semiconductor device having first and second electrode layers elect...

Structures and methods for low temperature bonding using nanoparticles

Metal bonding pads for packaging applications

Protective tape and method for manufacturing semiconductor device u...

Semicondcutor device and manufacturing method thereof

Semiconductor devices and methods of forming thereof

Semiconductor device having first and second electrode layers elect...

Method for manufacturing semiconductor device

Substrate structure with array of micrometer scale copper pillar ba...

Conductive connections, structures with such connections, and metho...

Semiconductor device and semiconductor device manufacturing method

Patents Applicationslast 30 patents

STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES

METHOD FOR PRODUCING SOLDER BUMPS ON A SUPERCONDUCTING QUBIT SUBSTRATE

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF

STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES

SEMICONDUCTOR DEVICE WITH SOLDER ON PILLAR

Forming Recesses in Molding Compound of Wafer to Reduce Stress

WAFER PROCESSING SHEET AND WAFER PROCESSING METHOD

METHODS FOR LOW TEMPERATURE BONDING USING NANOPARTICLES

PACKAGING STRUCTURE AND FORMATION METHOD THEREOF

Structures And Methods For Low Temperature Bonding Using Nanoparticles

Forming Recesses in Molding Compound of Wafer to Reduce Stress

BUMP STRUCTURE MANUFACTURING METHOD

Structures And Methods For Low Temperature Bonding Using Nanoparticles

METAL BONDING PADS FOR PACKAGING APPLICATIONS

SEMICONDUCTOR DEVICES

CIRCUIT MODULE AND MANUFACTURING METHOD THEREFOR

SEMICONDCUTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

PROTECTIVE TAPE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE U...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

DRY-REMOVABLE PROTECTIVE COATINGS

PRE-PACKAGE AND METHODS OF MANUFACTURING SEMICONDUCTOR PACKAGE AND...

DRY-REMOVABLE PROTECTIVE COATINGS

SEMICONDUCTOR DEVICE STRUCTURE AND MANUFACTURING METHOD

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

WAFER PROCESS FOR MOLDED CHIP SCALE PACKAGE (MCSP) WITH THICK BACKS...

Semiconductor Device and Method of Forming Conductive Vias Using Ba...

CHIP DIODE AND DIODE PACKAGE