for reducing stress inside of the package structure

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CPC
B81B7/0045

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BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81BMICRO-STRUCTURAL DEVICES OR SYSTEMS B81B7/00Micro-structural systems; Auxiliary parts of micro-structural devices or systems

Current Industry

B81B7/0045for reducing stress inside of the package structure

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Low-stress packaging structure for MEMS acceleration sensor chip
- Patent number 11,780,727
- Issue date Oct 10, 2023
- Zhejiang University
- Lufeng Che
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Demodulation phase calibration using external input
- Patent number 11,365,983
- Issue date Jun 21, 2022
- Invensense, Inc.
- Doruk Senkal
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stressed decoupled micro-electro-mechanical system sensor
- Patent number 10,870,575
- Issue date Dec 22, 2020
- Infineon Technologies Dresden GmbH & Co. KG
- Horst Theuss
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Deposition of protective material at wafer level in front end for e...
- Patent number 10,858,245
- Issue date Dec 8, 2020
- Infineon Technologies AG
- Florian Brandl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Cover based adhesion force measurement system for microelectromecha...
- Patent number 10,717,641
- Issue date Jul 21, 2020
- Invensense, Inc.
- Alexander Castro
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro-electro-mechanical device and manufacturing process thereof
- Patent number 10,626,008
- Issue date Apr 21, 2020
- STMicroelectronics S.r.l.
- Lorenzo Baldo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Deposition of protective material at wafer level in front end for e...
- Patent number 10,370,244
- Issue date Aug 6, 2019
- Infineon Technologies AG
- Florian Brandl
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Micro-electro-mechanical device and manufacturing process thereof
- Patent number 10,150,666
- Issue date Dec 11, 2018
- STMicroelectronics S.r.l.
- Lorenzo Baldo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stress-isolated absolute pressure sensor
- Patent number 10,060,820
- Issue date Aug 28, 2018
- Continental Automotive Systems, Inc.
- Shiuh-Hui Steven Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and structure of MEMS PLCSP fabrication
- Patent number 9,975,759
- Issue date May 22, 2018
- MCube, Inc.
- Chien Chen Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaged microsystems
- Patent number 9,950,922
- Issue date Apr 24, 2018
- The Regents of the University of Michigan
- Yogesh Gianchandani
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Package for semiconductor devices sensitive to mechanical and therm...
- Patent number 9,841,341
- Issue date Dec 12, 2017
- STMicroelectronics S.r.l.
- Fulvio Vittorio Fontana
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro-electro-mechanical device having two buried cavities and manu...
- Patent number 9,688,531
- Issue date Jun 27, 2017
- STMicroelectronics S.r.l.
- Lorenzo Baldo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hermetic-sealing package member, production method therefor, and he...
- Patent number 9,561,952
- Issue date Feb 7, 2017
- Tanaka Kikinzoku Kogyo K.K.
- Toshinori Ogashiwa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stress buffer layer for integrated microelectromechanical systems (...
- Patent number 9,056,763
- Issue date Jun 16, 2015
- Intel Corporation
- Christian Geissler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated MEMS design for manufacturing
- Patent number 9,007,119
- Issue date Apr 14, 2015
- Silicon Laboratories Inc.
- Aaron J. Caffee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Compensation of changes in MEMS capacitive transduction
- Patent number 9,000,833
- Issue date Apr 7, 2015
- Silicon Laboratories Inc.
- Aaron Caffee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor integrated device assembly process
- Patent number 8,921,164
- Issue date Dec 30, 2014
- STMicroelectronics Ltd (Malta)
- Kenneth Fonk
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
Enhanced microelectromechanical system mirror apparatus
- Publication number 20240369826
- Publication date Nov 7, 2024
- Teknologian Tutkimuskeskus VTT Oy
- Dmitry Morits
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR PREPARING SAME, AND SENSOR
- Publication number 20240359972
- Publication date Oct 31, 2024
- BEIJING BOE SENSOR TECHNOLOGY CO., LTD.
- Lihui WANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DEMODULATION PHASE CALIBRATION USING EXTERNAL INPUT
- Publication number 20220326045
- Publication date Oct 13, 2022
- InvenSense, Inc.
- Doruk Senkal
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Sensor Arrangement and Method for Producing a Sensor Arrangement
- Publication number 20220127137
- Publication date Apr 28, 2022
- TDK Corporation
- Wolfgang Pahl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTRO-MECHANICAL DEVICE AND MANUFACTURING PROCESS THEREOF
- Publication number 20200024132
- Publication date Jan 23, 2020
- STMicroelectronics S.r.l.
- Lorenzo Baldo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STRESSED DECOUPLED MICRO-ELECTRO-MECHANICAL SYSTEM SENSOR
- Publication number 20200002159
- Publication date Jan 2, 2020
- Infineon Technologies Dresden GmbH & Co. KG
- Horst THEUSS
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DEPOSITION OF PROTECTIVE MATERIAL AT WAFER LEVEL IN FRONT END FOR E...
- Publication number 20190300362
- Publication date Oct 3, 2019
- INFINEON TECHNOLOGIES AG
- Florian BRANDL
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STRESS ISOLATION FRAME FOR A SENSOR
- Publication number 20190169018
- Publication date Jun 6, 2019
- InvenSense, Inc.
- Doruk SENKAL
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DEMODULATION PHASE CALIBRATION USING EXTERNAL INPUT
- Publication number 20190120657
- Publication date Apr 25, 2019
- InvenSense, Inc.
- Doruk Senkal
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
COVER BASED ADHESION FORCE MEASUREMENT SYSTEM FOR MICROELECTROMECHA...
- Publication number 20190062147
- Publication date Feb 28, 2019
- InvenSense, Inc.
- Alexander CASTRO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SYSTEMS AND METHODS FOR MULTI-SENSOR INTEGRATED SENSOR DEVICES
- Publication number 20180327255
- Publication date Nov 15, 2018
- HONEYWELL INTERNATIONAL INC.
- Daniel Endean
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTRO-MECHANICAL DEVICE AND MANUFACTURING PROCESS THEREOF
- Publication number 20170253477
- Publication date Sep 7, 2017
- STMicroelectronics S.r.l.
- Lorenzo Baldo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGED MICROSYSTEMS
- Publication number 20170174506
- Publication date Jun 22, 2017
- The Regents of the University of Michigan
- Yogesh GIANCHANDANI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTRO-MECHANICAL DEVICE HAVING TWO BURIED CAVITIES AND MANU...
- Publication number 20170144881
- Publication date May 25, 2017
- STMicroelectronics S.r.l.
- Lorenzo Baldo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
AIRTIGHT-SEALING PACKAGE MEMBER, PRODUCTION METHOD THEREFOR, AND AI...
- Publication number 20160311677
- Publication date Oct 27, 2016
- TANAKA KIKINZOKU KOGYO K.K.
- Toshinori OGASHIWA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STRESS BUFFER LAYER FOR INTEGRATED MICROELECTROMECHANICAL SYSTEMS (...
- Publication number 20150091167
- Publication date Apr 2, 2015
- Christian Geissler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED MEMS DESIGN FOR MANUFACTURING
- Publication number 20140306623
- Publication date Oct 16, 2014
- Silicon Laboratories Inc.
- Aaron J. Caffee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
COMPENSATION OF CHANGES IN MEMS CAPACITIVE TRANSDUCTION
- Publication number 20140253219
- Publication date Sep 11, 2014
- Silicon Laboratories Inc.
- Aaron Caffee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR INTEGRATED DEVICE ASSEMBLY PROCESS
- Publication number 20130214368
- Publication date Aug 22, 2013
- STMicroelectronics S.r.l.
- Kenneth Fonk
- B81 - MICRO-STRUCTURAL TECHNOLOGY

for reducing stress inside of the package structure

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Low-stress packaging structure for MEMS acceleration sensor chip

Demodulation phase calibration using external input

Stressed decoupled micro-electro-mechanical system sensor

Deposition of protective material at wafer level in front end for e...

Cover based adhesion force measurement system for microelectromecha...

Micro-electro-mechanical device and manufacturing process thereof

Deposition of protective material at wafer level in front end for e...

Micro-electro-mechanical device and manufacturing process thereof

Stress-isolated absolute pressure sensor

Method and structure of MEMS PLCSP fabrication

Packaged microsystems

Package for semiconductor devices sensitive to mechanical and therm...

Micro-electro-mechanical device having two buried cavities and manu...

Hermetic-sealing package member, production method therefor, and he...

Stress buffer layer for integrated microelectromechanical systems (...

Integrated MEMS design for manufacturing

Compensation of changes in MEMS capacitive transduction

Semiconductor integrated device assembly process

Patents Applicationslast 30 patents

Enhanced microelectromechanical system mirror apparatus

PACKAGE STRUCTURE AND METHOD FOR PREPARING SAME, AND SENSOR

DEMODULATION PHASE CALIBRATION USING EXTERNAL INPUT

Sensor Arrangement and Method for Producing a Sensor Arrangement

MICRO-ELECTRO-MECHANICAL DEVICE AND MANUFACTURING PROCESS THEREOF

STRESSED DECOUPLED MICRO-ELECTRO-MECHANICAL SYSTEM SENSOR

DEPOSITION OF PROTECTIVE MATERIAL AT WAFER LEVEL IN FRONT END FOR E...

STRESS ISOLATION FRAME FOR A SENSOR

DEMODULATION PHASE CALIBRATION USING EXTERNAL INPUT

COVER BASED ADHESION FORCE MEASUREMENT SYSTEM FOR MICROELECTROMECHA...

SYSTEMS AND METHODS FOR MULTI-SENSOR INTEGRATED SENSOR DEVICES

MICRO-ELECTRO-MECHANICAL DEVICE AND MANUFACTURING PROCESS THEREOF

PACKAGED MICROSYSTEMS

MICRO-ELECTRO-MECHANICAL DEVICE HAVING TWO BURIED CAVITIES AND MANU...

AIRTIGHT-SEALING PACKAGE MEMBER, PRODUCTION METHOD THEREFOR, AND AI...

STRESS BUFFER LAYER FOR INTEGRATED MICROELECTROMECHANICAL SYSTEMS (...

INTEGRATED MEMS DESIGN FOR MANUFACTURING

COMPENSATION OF CHANGES IN MEMS CAPACITIVE TRANSDUCTION

SEMICONDUCTOR INTEGRATED DEVICE ASSEMBLY PROCESS