for single side lapping

Industry

CPC
B24B37/10

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B24Grinding technology B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS B24B37/00Lapping machines or devices Accessories

Current Industry

B24B37/10for single side lapping

Industries

Patents Grantslast 30 patents

Information Patent Grant
Substrate processing apparatus and substrate processing method
- Patent number 12,211,733
- Issue date Jan 28, 2025
- Ebara Corporation
- Nobuyuki Takada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing and loading/unloading component module
- Patent number 12,194,592
- Issue date Jan 14, 2025
- HANGZHOU SIZONE ELECTRONIC TECHNOLOGY INC.
- Linghan Shen
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus and polishing method
- Patent number 12,131,923
- Issue date Oct 29, 2024
- Ebara Corporation
- Yuta Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for chemical mechanical polishing process
- Patent number 12,131,897
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-I Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical cleaning tool for wafer polishing tool system
- Patent number 12,128,455
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Wen Liu
- B08 - CLEANING
Information Patent Grant
Machine for finishing a work piece, and having a highly controllabl...
- Patent number 12,122,012
- Issue date Oct 22, 2024
- II-VI DELAWARE, INC.
- Edward J. Gratrix
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical-mechanical polishing apparatus
- Patent number 12,103,133
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Hsi Huang
- B24 - GRINDING POLISHING
Information Patent Grant
Platen rotation device
- Patent number 12,090,602
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Bruce Cho
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing platens and polishing platen manufacturing methods
- Patent number 12,076,877
- Issue date Sep 3, 2024
- Applied Materials, Inc.
- Bum Jick Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of using polishing pad
- Patent number 12,070,833
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- ChunHung Chen
- B24 - GRINDING POLISHING
Information Patent Grant
Elastic membrane, substrate holding device, and polishing apparatus
- Patent number 12,068,189
- Issue date Aug 20, 2024
- Ebara Corporation
- Satoru Yamaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface projection polishing pad
- Patent number 12,048,980
- Issue date Jul 30, 2024
- 3M Innovative Properties Company
- Lian S. Tan
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing system, polishing pad and method of manufacturing semicon...
- Patent number 12,042,900
- Issue date Jul 23, 2024
- SK ENPULSE CO., LTD.
- Jae In Ahn
- B24 - GRINDING POLISHING
Information Patent Grant
Process for making anti-reflective optical glass and product thereof
- Patent number 12,043,568
- Issue date Jul 23, 2024
- TACHI METAL MATERIAL TECHNOLOGY CO., LTD.
- Kuan-Wei Chen
- B24 - GRINDING POLISHING
Information Patent Grant
Mega-sonic vibration assisted chemical mechanical planarization
- Patent number 12,036,636
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Hao Kung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing carrier head with piezoelectric pressure control
- Patent number 12,030,156
- Issue date Jul 9, 2024
- Applied Materials, Inc.
- Brian J. Brown
- B24 - GRINDING POLISHING
Information Patent Grant
Retaining ring having inner surfaces with facets
- Patent number 12,033,865
- Issue date Jul 9, 2024
- Applied Materials, Inc.
- Jeonghoon Oh
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing head system and polishing apparatus
- Patent number 12,017,323
- Issue date Jun 25, 2024
- Ebara Corporation
- Itsuki Kobata
- B24 - GRINDING POLISHING
Information Patent Grant
Carrier head having abrasive structure on retainer ring
- Patent number 12,011,803
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chang-Sheng Lin
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical-mechanical polishing system with a potentiostat and pulsed...
- Patent number 12,011,800
- Issue date Jun 18, 2024
- BRUKER NANO INC.
- Vladimir Gulkov
- B24 - GRINDING POLISHING
Information Patent Grant
Planar grinder
- Patent number 12,000,764
- Issue date Jun 4, 2024
- Illinois Tool Works Inc.
- Kurt G. Adair
- G01 - MEASURING TESTING
Information Patent Grant
Substrate holding apparatus, substrate processing apparatus having...
- Patent number 12,002,704
- Issue date Jun 4, 2024
- Ebara Corporation
- Makoto Kashiwagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for chemical mechanical polishing and forming interconnect...
- Patent number 12,002,684
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ji Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Slurry distribution device for chemical mechanical polishing
- Patent number 11,986,926
- Issue date May 21, 2024
- Applied Materials, Inc.
- Yen-Chu Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical polishing apparatus and method
- Patent number 11,964,358
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shang-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing system, substrate processing method and comput...
- Patent number 11,929,268
- Issue date Mar 12, 2024
- Tokyo Electron Limited
- Munehisa Kodama
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus for polishing and method of polishing
- Patent number 11,926,018
- Issue date Mar 12, 2024
- Ebara Corporation
- Masayoshi Ito
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus and method for CMP temperature control
- Patent number 11,919,123
- Issue date Mar 5, 2024
- Applied Materials, Inc.
- Surajit Kumar
- B24 - GRINDING POLISHING
Information Patent Grant
Low-temperature metal CMP for minimizing dishing and corrosion, and...
- Patent number 11,897,079
- Issue date Feb 13, 2024
- Applied Materials, Inc.
- Haosheng Wu
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus for smoothing diamonds
- Patent number 11,897,087
- Issue date Feb 13, 2024
- Board of Trustees of Michigan State University
- Aaron Hardy
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
MACHINE FOR FINISHING A WORK PIECE, AND HAVING A HIGHLY CONTROLLABL...
- Publication number 20250018521
- Publication date Jan 16, 2025
- II-VI Delaware, Inc.
- Edward J. GRATRIX
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING DEVICE, SUBSTRATE TREATING APPARATUS, AND POLISHING METHOD
- Publication number 20250018523
- Publication date Jan 16, 2025
- SCREEN Holdings Co., Ltd.
- Hiroaki ISHII
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR POLISHING A SUBSTRATE
- Publication number 20250001542
- Publication date Jan 2, 2025
- Illumina, Inc.
- Alisina BAZRAFSHAN
- B24 - GRINDING POLISHING
Information Patent Application
PLATEN ROTATION DEVICE
- Publication number 20240367286
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bruce CHO
- B24 - GRINDING POLISHING
Information Patent Application
ELECTRICAL CLEANING TOOL FOR WAFER POLISHING TOOL SYSTEM
- Publication number 20240367202
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wen Liu
- B24 - GRINDING POLISHING
Information Patent Application
METHOD OF USING POLISHING PAD
- Publication number 20240359288
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- ChunHung CHEN
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL MECHANICAL POLISHING APPARATUS AND A METHOD OF POLISHING A...
- Publication number 20240359286
- Publication date Oct 31, 2024
- Samsung Electronics Co., Ltd.
- Donghoon KWON
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING METHOD AND POLISHING APPARATUS
- Publication number 20240351161
- Publication date Oct 24, 2024
- EBARA CORPORATION
- Tomoko OWADA
- B24 - GRINDING POLISHING
Information Patent Application
METHODS FOR CHEMICAL MECHANICAL POLISHING AND FORMING INTERCONNECT...
- Publication number 20240290629
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- JI CUI
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL-MECHANICAL POLISHING SYSTEM WITH A POTENTIOSTAT AND PULSED...
- Publication number 20240286242
- Publication date Aug 29, 2024
- Bruker Nano Inc.
- Vladimir Gulkov
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING METHOD AND POLISHING APPARATUS
- Publication number 20240278380
- Publication date Aug 22, 2024
- EBARA CORPORATION
- Shinro OTA
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE HOLDING APPARATUS, SUBSTRATE PROCESSING APPARATUS HAVING...
- Publication number 20240282619
- Publication date Aug 22, 2024
- EBARA CORPORATION
- Makoto KASHIWAGI
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20240261932
- Publication date Aug 8, 2024
- EBARA CORPORATION
- Yuichi SATO
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL MECHANICAL POLISHING (CMP) APPARATUS AND METHOD OF CONTROL...
- Publication number 20240238936
- Publication date Jul 18, 2024
- SMSUNG ELECTRONICS CO., LTD.
- Wonkeun CHO
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD
- Publication number 20240217054
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shang-Yu Wang
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20240213046
- Publication date Jun 27, 2024
- TOKYO ELECTRON LIMITED
- Nobuhiko Mouri
- B08 - CLEANING
Information Patent Application
POLISHING APPARATUS AND POLISHING METHOD
- Publication number 20240208002
- Publication date Jun 27, 2024
- EBARA CORPORATION
- Masaki KINOSHITA
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING HEAD, POLISHING APPARATUS, AND ELASTIC BODY
- Publication number 20240181595
- Publication date Jun 6, 2024
- KIOXIA Corporation
- Tomonori KAWASAKI
- B24 - GRINDING POLISHING
Information Patent Application
APPARATUS AND METHOD FOR CMP TEMPERATURE CONTROL
- Publication number 20240157504
- Publication date May 16, 2024
- Applied Materials, Inc.
- Surajit Kumar
- B24 - GRINDING POLISHING
Information Patent Application
COMPENSATION FOR SLURRY COMPOSITION IN IN-SITU ELECTROMAGNETIC INDU...
- Publication number 20240123565
- Publication date Apr 18, 2024
- Applied Materials, Inc.
- Kun Xu
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING APPARATUS
- Publication number 20240091899
- Publication date Mar 21, 2024
- EBARA CORPORATION
- Kenichi KOBAYASHI
- B24 - GRINDING POLISHING
Information Patent Application
MODULAR CHEMICAL MECHANICAL POLISHER WITH SIMULTANEOUS POLISHING AN...
- Publication number 20240075582
- Publication date Mar 7, 2024
- Applied Materials, Inc.
- Steven M. Zuniga
- B24 - GRINDING POLISHING
Information Patent Application
LOW-TEMPERATURE METAL CMP FOR MINIMIZING DISHING AND CORROSION, AND...
- Publication number 20240066660
- Publication date Feb 29, 2024
- Applied Materials, Inc.
- Haosheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WORKPIECE PROCESSING METHOD
- Publication number 20240058922
- Publication date Feb 22, 2024
- Disco Corporation
- Minoru MATSUZAWA
- B24 - GRINDING POLISHING
Information Patent Application
ELECTRICAL CLEANING TOOL FOR WAFER POLISHING TOOL SYSTEM
- Publication number 20240050995
- Publication date Feb 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wen Liu
- B08 - CLEANING
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20240051080
- Publication date Feb 15, 2024
- EBARA CORPORATION
- Kohei OTA
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING CARRIER HEAD WITH MULTIPLE ZONES
- Publication number 20230405758
- Publication date Dec 21, 2023
- Applied Materials, Inc.
- Steven M. Zuniga
- B24 - GRINDING POLISHING
Information Patent Application
SEMICONDUCTOR SUBSTRATE GRINDING APPARATUS AND SEMICONDUCTOR SUBSTR...
- Publication number 20230373058
- Publication date Nov 23, 2023
- Samsung Electronics Co., Ltd.
- Donghoon KWON
- B08 - CLEANING
Information Patent Application
CHEMICAL MECHANICAL POLISHING APPARATUS WITH INTEGRATED SLURRY MIXE...
- Publication number 20230373062
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Yu-Chen Wei
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL MECHANICAL POLISHING TEMPERATURE SCANNING APPARATUS FOR TE...
- Publication number 20230356351
- Publication date Nov 9, 2023
- Applied Materials, Inc.
- Hari Soundararajan
- B24 - GRINDING POLISHING

for single side lapping

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Substrate processing apparatus and substrate processing method

Polishing and loading/unloading component module

Polishing apparatus and polishing method

Method and system for chemical mechanical polishing process

Electrical cleaning tool for wafer polishing tool system

Machine for finishing a work piece, and having a highly controllabl...

Chemical-mechanical polishing apparatus

Platen rotation device

Polishing platens and polishing platen manufacturing methods

Method of using polishing pad

Elastic membrane, substrate holding device, and polishing apparatus

Surface projection polishing pad

Polishing system, polishing pad and method of manufacturing semicon...

Process for making anti-reflective optical glass and product thereof

Mega-sonic vibration assisted chemical mechanical planarization

Polishing carrier head with piezoelectric pressure control

Retaining ring having inner surfaces with facets

Polishing head system and polishing apparatus

Carrier head having abrasive structure on retainer ring

Chemical-mechanical polishing system with a potentiostat and pulsed...

Planar grinder

Substrate holding apparatus, substrate processing apparatus having...

Methods for chemical mechanical polishing and forming interconnect...

Slurry distribution device for chemical mechanical polishing

Chemical mechanical polishing apparatus and method

Substrate processing system, substrate processing method and comput...

Apparatus for polishing and method of polishing

Apparatus and method for CMP temperature control

Low-temperature metal CMP for minimizing dishing and corrosion, and...

Polishing apparatus for smoothing diamonds

Patents Applicationslast 30 patents

MACHINE FOR FINISHING A WORK PIECE, AND HAVING A HIGHLY CONTROLLABL...

POLISHING DEVICE, SUBSTRATE TREATING APPARATUS, AND POLISHING METHOD

METHOD FOR POLISHING A SUBSTRATE

PLATEN ROTATION DEVICE

ELECTRICAL CLEANING TOOL FOR WAFER POLISHING TOOL SYSTEM

METHOD OF USING POLISHING PAD

CHEMICAL MECHANICAL POLISHING APPARATUS AND A METHOD OF POLISHING A...

POLISHING METHOD AND POLISHING APPARATUS

METHODS FOR CHEMICAL MECHANICAL POLISHING AND FORMING INTERCONNECT...

CHEMICAL-MECHANICAL POLISHING SYSTEM WITH A POTENTIOSTAT AND PULSED...

POLISHING METHOD AND POLISHING APPARATUS

SUBSTRATE HOLDING APPARATUS, SUBSTRATE PROCESSING APPARATUS HAVING...

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

CHEMICAL MECHANICAL POLISHING (CMP) APPARATUS AND METHOD OF CONTROL...

CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

POLISHING APPARATUS AND POLISHING METHOD

POLISHING HEAD, POLISHING APPARATUS, AND ELASTIC BODY

APPARATUS AND METHOD FOR CMP TEMPERATURE CONTROL

COMPENSATION FOR SLURRY COMPOSITION IN IN-SITU ELECTROMAGNETIC INDU...

POLISHING APPARATUS

MODULAR CHEMICAL MECHANICAL POLISHER WITH SIMULTANEOUS POLISHING AN...

LOW-TEMPERATURE METAL CMP FOR MINIMIZING DISHING AND CORROSION, AND...

WORKPIECE PROCESSING METHOD

ELECTRICAL CLEANING TOOL FOR WAFER POLISHING TOOL SYSTEM

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

POLISHING CARRIER HEAD WITH MULTIPLE ZONES

SEMICONDUCTOR SUBSTRATE GRINDING APPARATUS AND SEMICONDUCTOR SUBSTR...

CHEMICAL MECHANICAL POLISHING APPARATUS WITH INTEGRATED SLURRY MIXE...

CHEMICAL MECHANICAL POLISHING TEMPERATURE SCANNING APPARATUS FOR TE...