for supporting the semiconductor or solid-state body

Industry

CPC
H01L2224/27002

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/27002for supporting the semiconductor or solid-state body

Industries

Patents Grantslast 30 patents

Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 12,199,058
- Issue date Jan 14, 2025
- VueReal Inc.
- Gholamreza Chaji
- G01 - MEASURING TESTING
Information Patent Grant
Dicing die attach film, and semiconductor package using the same an...
- Patent number 12,176,314
- Issue date Dec 24, 2024
- Furukawa Electric Co., Ltd.
- Minoru Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective transfer of micro devices
- Patent number 12,075,565
- Issue date Aug 27, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D-interconnect
- Patent number 11,929,337
- Issue date Mar 12, 2024
- Invensas LLC
- Chok J. Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,735,545
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,735,547
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,735,546
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,728,302
- Issue date Aug 15, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,728,306
- Issue date Aug 15, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,476,216
- Issue date Oct 18, 2022
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sintering materials and attachment methods using same
- Patent number 11,389,865
- Issue date Jul 19, 2022
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Integrated fan-out package and method of fabricating the same
- Patent number 11,282,796
- Issue date Mar 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film-shaped firing material and film-shaped firing material with su...
- Patent number 11,267,992
- Issue date Mar 8, 2022
- Lintec Corporation
- Isao Ichikawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Microelectronic structures having multiple microelectronic devices...
- Patent number 11,075,166
- Issue date Jul 27, 2021
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D-interconnect
- Patent number 11,031,362
- Issue date Jun 8, 2021
- Invensas Corporation
- Chok J. Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming interposer frame over se...
- Patent number RE48408
- Issue date Jan 26, 2021
- JCET Semiconductor (Shaoxing) Co., Ltd.
- Reza A. Pagaila
Information Patent Grant
Integrated fan-out package and method of fabricating the same
- Patent number 10,790,235
- Issue date Sep 29, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic structures having multiple microelectronic devices...
- Patent number 10,790,231
- Issue date Sep 29, 2020
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming interposer frame over se...
- Patent number RE48111
- Issue date Jul 21, 2020
- JCET Semiconductor (Shaoxing) Co. Ltd.
- Reza A. Pagaila
Information Patent Grant
Circuit module and manufacturing method thereof
- Patent number 10,679,916
- Issue date Jun 9, 2020
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for minimizing average surface roughness of soft metal layer...
- Patent number 10,643,848
- Issue date May 5, 2020
- MIKRO MESA TECHNOLOGY CO., LTD.
- Li-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for minimizing average surface roughness of soft metal layer...
- Patent number 10,629,439
- Issue date Apr 21, 2020
- MIKRO MESA TECHNOLOGY CO., LTD.
- Li-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die with integrated microphone device using through-silicon vias (T...
- Patent number 10,455,308
- Issue date Oct 22, 2019
- Intel Corporation
- Kevin J. Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of transferring micro devices
- Patent number 10,431,569
- Issue date Oct 1, 2019
- PlayNitride Inc.
- Yun-Li Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic structures having multiple microelectronic devices...
- Patent number 10,418,329
- Issue date Sep 17, 2019
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced chip to wafer stacking
- Patent number 10,269,760
- Issue date Apr 23, 2019
- International Business Machines Corporation
- Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced chip to wafer stacking
- Patent number 10,170,447
- Issue date Jan 1, 2019
- International Business Machines Corporation
- Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertically stacked wafers and methods of forming same
- Patent number 10,163,864
- Issue date Dec 25, 2018
- GLOBALFOUNDRIES Inc.
- Luke G. England
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit module and manufacturing method thereof
- Patent number 10,074,583
- Issue date Sep 11, 2018
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill material, laminated sheet and method for producing semico...
- Patent number 10,014,235
- Issue date Jul 3, 2018
- Nitto Denko Corporation
- Naohide Takamoto
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20250015030
- Publication date Jan 9, 2025
- VueReal Inc.
- Gholamreza CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D-INTERCONNECT
- Publication number 20250015031
- Publication date Jan 9, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Chok J. Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE TRANSFER OF MICRO DEVICES
- Publication number 20240381531
- Publication date Nov 14, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240145417
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Hyeongwoo JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20220254745
- Publication date Aug 11, 2022
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20220139856
- Publication date May 5, 2022
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20220139857
- Publication date May 5, 2022
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20220130783
- Publication date Apr 28, 2022
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DICING DIE ATTACH FILM, AND SEMICONDUCTOR PACKAGE USING THE SAME AN...
- Publication number 20220077101
- Publication date Mar 10, 2022
- FURUKAWA ELECTRIC CO., LTD.
- Minoru MORITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20210327739
- Publication date Oct 21, 2021
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20210327740
- Publication date Oct 21, 2021
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE TRANSFER OF MICRO DEVICES
- Publication number 20210243894
- Publication date Aug 5, 2021
- VueReal Inc.
- Gholamreza Chaji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROELECTRONIC STRUCTURES HAVING MULTIPLE MICROELECTRONIC DEVICES...
- Publication number 20200395301
- Publication date Dec 17, 2020
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20200350281
- Publication date Nov 5, 2020
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM-SHAPED FIRING MATERIAL AND FILM-SHAPED FIRING MATERIAL WITH SU...
- Publication number 20200277515
- Publication date Sep 3, 2020
- LINTEC CORPORATION
- Isao ICHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC STRUCTURES HAVING MULTIPLE MICROELECTRONIC DEVICES...
- Publication number 20190355666
- Publication date Nov 21, 2019
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20180366388
- Publication date Dec 20, 2018
- International Business Machines Corporation
- Akihiro HORIBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED CHIP TO WAFER STACKING
- Publication number 20170179077
- Publication date Jun 22, 2017
- International Business Machines Corporation
- Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH DIELECTRIC OR ANISOTROPIC CONDUCTIVE (ACF) BUILDUP LAYER
- Publication number 20170179099
- Publication date Jun 22, 2017
- Intel Corporation
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID RESIN COMPOSITION, DIE ATTACHING METHOD USING SAME AND SEMIC...
- Publication number 20170158926
- Publication date Jun 8, 2017
- Shin-Etsu Chemical Co., Ltd.
- Koichi TSUDA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Semiconductor Device and Method of Forming Interposer Frame Over Se...
- Publication number 20140327145
- Publication date Nov 6, 2014
- STATS ChipPAC, Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH DIELECTRIC OR ANISOTROPIC CONDUCTIVE (ACF) BUILDUP LAYER
- Publication number 20140167217
- Publication date Jun 19, 2014
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Guard Ring Around Conduc...
- Publication number 20130299998
- Publication date Nov 14, 2013
- Duk Ju Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedded Electrical Component Surface Interconnect
- Publication number 20130215583
- Publication date Aug 22, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-CUT WAFER APPLIED UNDERFILL FILM ON DICING TAPE
- Publication number 20130196472
- Publication date Aug 1, 2013
- Henkel Corporation
- Gina Hoang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Guard Ring Around Conduc...
- Publication number 20130147055
- Publication date Jun 13, 2013
- STATS ChipPAC, Ltd.
- Duk Ju Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE DEVICE, AND LIQUI...
- Publication number 20130120699
- Publication date May 16, 2013
- RENESAS ELECTRONICS CORPORATION
- Seiichi ICHIHARA
- G02 - OPTICS
Information Patent Application
Semiconductor Device and Method of Forming Interposer Frame Over Se...
- Publication number 20130105989
- Publication date May 2, 2013
- STATS ChipPAC, Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BACKSIDE STANDOFF STRUCTURES FOR SEMICONDUCTOR DEVICES
- Publication number 20120322211
- Publication date Dec 20, 2012
- Michael Gruenhagen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE...
- Publication number 20120263946
- Publication date Oct 18, 2012
- Kazuyuki Mitsukura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

for supporting the semiconductor or solid-state body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Selective micro device transfer to receiver substrate

Dicing die attach film, and semiconductor package using the same an...

Selective transfer of micro devices

3D-interconnect

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Sintering materials and attachment methods using same

Integrated fan-out package and method of fabricating the same

Film-shaped firing material and film-shaped firing material with su...

Microelectronic structures having multiple microelectronic devices...

3D-interconnect

Semiconductor device and method of forming interposer frame over se...

Integrated fan-out package and method of fabricating the same

Microelectronic structures having multiple microelectronic devices...

Semiconductor device and method of forming interposer frame over se...

Circuit module and manufacturing method thereof

Method for minimizing average surface roughness of soft metal layer...

Method for minimizing average surface roughness of soft metal layer...

Die with integrated microphone device using through-silicon vias (T...

Method of transferring micro devices

Microelectronic structures having multiple microelectronic devices...

Advanced chip to wafer stacking

Advanced chip to wafer stacking

Vertically stacked wafers and methods of forming same

Circuit module and manufacturing method thereof

Underfill material, laminated sheet and method for producing semico...

Patents Applicationslast 30 patents

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

3D-INTERCONNECT

SELECTIVE TRANSFER OF MICRO DEVICES

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

DICING DIE ATTACH FILM, AND SEMICONDUCTOR PACKAGE USING THE SAME AN...

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

SELECTIVE TRANSFER OF MICRO DEVICES

MICROELECTRONIC STRUCTURES HAVING MULTIPLE MICROELECTRONIC DEVICES...

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

FILM-SHAPED FIRING MATERIAL AND FILM-SHAPED FIRING MATERIAL WITH SU...

MICROELECTRONIC STRUCTURES HAVING MULTIPLE MICROELECTRONIC DEVICES...

CIRCUIT MODULE AND MANUFACTURING METHOD THEREOF

ADVANCED CHIP TO WAFER STACKING

PACKAGE WITH DIELECTRIC OR ANISOTROPIC CONDUCTIVE (ACF) BUILDUP LAYER

LIQUID RESIN COMPOSITION, DIE ATTACHING METHOD USING SAME AND SEMIC...

Semiconductor Device and Method of Forming Interposer Frame Over Se...

PACKAGE WITH DIELECTRIC OR ANISOTROPIC CONDUCTIVE (ACF) BUILDUP LAYER

Semiconductor Device and Method of Forming Guard Ring Around Conduc...

Embedded Electrical Component Surface Interconnect

PRE-CUT WAFER APPLIED UNDERFILL FILM ON DICING TAPE

Semiconductor Device and Method of Forming Guard Ring Around Conduc...

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE DEVICE, AND LIQUI...

Semiconductor Device and Method of Forming Interposer Frame Over Se...

DIE BACKSIDE STANDOFF STRUCTURES FOR SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE...