for testing individual semiconductor components within integrated circuits

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CPC
G01R31/275

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GPHYSICS G01Measuring instruments G01RMEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES G01R31/00Arrangements for testing electric properties Arrangements for locating electric faults Arrangements for electrical testing characterised by what is being tested not provided for elsewhere

Current Industry

G01R31/275for testing individual semiconductor components within integrated circuits

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Ultrasonic testing device and ultrasonic testing method
- Patent number 12,209,996
- Issue date Jan 28, 2025
- National University Corporation Toyohashi University of Technology
- Naohiro Hozumi
- G01 - MEASURING TESTING
Information Patent Grant
Metal-free frame design for silicon bridges for semiconductor packages
- Patent number 12,170,253
- Issue date Dec 17, 2024
- Intel Corporation
- Dae-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrasonic testing device and ultrasonic testing method
- Patent number 12,153,021
- Issue date Nov 26, 2024
- National University Corporation Toyohashi University of Technology
- Naohiro Hozumi
- G01 - MEASURING TESTING
Information Patent Grant
Virtual quality control interpolation and process feedback in the p...
- Patent number 12,105,137
- Issue date Oct 1, 2024
- SanDisk Technologies LLC
- Yusuke Ikawa
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Metal-free frame design for silicon bridges for semiconductor packages
- Patent number 12,074,121
- Issue date Aug 27, 2024
- Intel Corporation
- Dae-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package test apparatus and method
- Patent number 12,072,370
- Issue date Aug 27, 2024
- Samsung Electronics Co., Ltd.
- Sung Ok Kim
- G01 - MEASURING TESTING
Information Patent Grant
Apparatus and method for managing power of test circuits
- Patent number 12,007,429
- Issue date Jun 11, 2024
- IC ANALYTICA, LLC
- Patrick G. Drennan
- G01 - MEASURING TESTING
Information Patent Grant
Test method for tolerance against the hot carrier effect
- Patent number 11,953,542
- Issue date Apr 9, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Yifei Pan
- G11 - INFORMATION STORAGE
Information Patent Grant
Power semi-conductor module, mask, measurement method, computer sof...
- Patent number 11,927,619
- Issue date Mar 12, 2024
- Mitsubishi Electric Corporation
- Nicolas Degrenne
- G01 - MEASURING TESTING
Information Patent Grant
Testing module and testing method using the same
- Patent number 11,906,573
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao Chen
- G01 - MEASURING TESTING
Information Patent Grant
Method for checking a semiconductor switch for a fault
- Patent number 11,881,848
- Issue date Jan 23, 2024
- Webasto SE
- Philipp Eck
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Memory system tester using test pad real time monitoring
- Patent number 11,763,908
- Issue date Sep 19, 2023
- Micron Technology, Inc.
- Andrea Vigilante
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuitry for electrical redundancy in bonded structures
- Patent number 11,721,653
- Issue date Aug 8, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Javier A. DeLACruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Testing module and testing method using the same
- Patent number 11,693,045
- Issue date Jul 4, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao Chen
- G01 - MEASURING TESTING
Information Patent Grant
Internal failure detection of an external failure detection system...
- Patent number 11,635,341
- Issue date Apr 25, 2023
- DISTRAN AG
- Florian Perrodin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Metal-free frame design for silicon bridges for semiconductor packages
- Patent number 11,626,372
- Issue date Apr 11, 2023
- Intel Corporation
- Dae-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Testing module and testing method using the same
- Patent number 11,585,846
- Issue date Feb 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao Chen
- G01 - MEASURING TESTING
Information Patent Grant
Probe card for characterizing processes of submicron semiconductor...
- Patent number 11,579,171
- Issue date Feb 14, 2023
- Meta Platforms Technologies, LLC
- Christopher Percival
- G02 - OPTICS
Information Patent Grant
Testing an integrated capacitor
- Patent number 11,467,204
- Issue date Oct 11, 2022
- Semtech Corporation
- Jonah Edward Nuttgens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Screening method and apparatus for detecting deep trench isolation...
- Patent number 11,448,690
- Issue date Sep 20, 2022
- NXP USA, INC.
- Laurent Segarra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for calculating kink current of SOI device
- Patent number 11,442,097
- Issue date Sep 13, 2022
- Soochow University
- Mingxiang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for monitoring multi-die power module
- Patent number 11,415,625
- Issue date Aug 16, 2022
- Mitsubishi Electric Corporation
- Jeffrey Ewanchuk
- G01 - MEASURING TESTING
Information Patent Grant
IGBT module reliability evaluation method and device based on bondi...
- Patent number 11,378,613
- Issue date Jul 5, 2022
- WUHAN UNIVERSITY
- Yigang He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Control method and electronic device with removable components
- Patent number 11,327,452
- Issue date May 10, 2022
- Lenovo (Beijing) Co., Ltd.
- Tianyu Wang
- G05 - CONTROLLING REGULATING
Information Patent Grant
Apparatus and method for testing semiconductor devices
- Patent number 11,237,208
- Issue date Feb 1, 2022
- Testmetrix, Inc.
- Christian O. Cojocneanu
- G01 - MEASURING TESTING
Information Patent Grant
Memory system tester using test pad real time monitoring
- Patent number 11,211,136
- Issue date Dec 28, 2021
- Micron Technology, Inc.
- Andrea Vigilante
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Aging detector for an electrical circuit component, method for moni...
- Patent number 11,175,331
- Issue date Nov 16, 2021
- Robert Bosch GmbH
- Daniel Schneider
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for the characterization and monitoring of integrated circuits
- Patent number 11,169,200
- Issue date Nov 9, 2021
- International Business Machines Corporation
- Raphael P. Robertazzi
- G01 - MEASURING TESTING
Information Patent Grant
Position correction method, inspection apparatus, and probe card
- Patent number 11,119,122
- Issue date Sep 14, 2021
- Tokyo Electron Limited
- Kunihiro Furuya
- G01 - MEASURING TESTING
Information Patent Grant
Method for the characterization and monitoring of integrated circuits
- Patent number 11,061,063
- Issue date Jul 13, 2021
- International Business Machines Corporation
- Raphael P. Robertazzi
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
AN ADAPTIVE BODY BIASING SYSTEM FOR SILICON ON INSULATOR SEMICONDUC...
- Publication number 20250055455
- Publication date Feb 13, 2025
- RACYICS GMBH
- Alexander OEFELEIN
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
STRESS CALIBRATION METHOD, CORRESPONDING ELECTRONIC DEVICE
- Publication number 20250027985
- Publication date Jan 23, 2025
- STMicroelectronics International N.V.
- Emanuele Moretti
- G01 - MEASURING TESTING
Information Patent Application
MEASURING ARRANGEMENT FOR EXAMINING A LIGHT-EMITTING DIODE ASSEMBLY...
- Publication number 20240353485
- Publication date Oct 24, 2024
- ams-OSRAM International GmbH
- Stefan Kerscher
- G01 - MEASURING TESTING
Information Patent Application
CIRCUITRY FOR ELECTRICAL REDUNDANCY IN BONDED STRUCTURES
- Publication number 20240162178
- Publication date May 16, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TESTING MODULE AND TESTING METHOD USING THE SAME
- Publication number 20240133942
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao Chen
- G01 - MEASURING TESTING
Information Patent Application
EVALUATION CIRCUIT, SEMICONDUCTOR DEVICE, AND EVALUATION METHOD
- Publication number 20240110967
- Publication date Apr 4, 2024
- WINBOND ELECTRONICS CORP.
- Taihei SHIDO
- G01 - MEASURING TESTING
Information Patent Application
INTEGRATED CIRCUIT THAT MITIGATES INDUCTIVE-INDUCED VOLTAGE DROOP
- Publication number 20240085965
- Publication date Mar 14, 2024
- SambaNova Systems, Inc.
- Darshan GANDHI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTEGRATED CIRCUIT THAT MITIGATES INDUCTIVE-INDUCED VOLTAGE OVERSHOOT
- Publication number 20240085967
- Publication date Mar 14, 2024
- SambaNova Systems, Inc.
- Darshan GANDHI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CIRCUITRY FOR ELECTRICAL REDUNDANCY IN BONDED STRUCTURES
- Publication number 20230395544
- Publication date Dec 7, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES
- Publication number 20230223361
- Publication date Jul 13, 2023
- Intel Corporation
- Dae-Woo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A TESTING MODULE AND TESTING METHOD USING THE SAME
- Publication number 20230168296
- Publication date Jun 1, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao Chen
- G01 - MEASURING TESTING
Information Patent Application
TEST METHOD FOR TOLERANCE AGAINST THE HOT CARRIER EFFECT
- Publication number 20230068128
- Publication date Mar 2, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Yifei PAN
- G11 - INFORMATION STORAGE
Information Patent Application
APPARATUS AND METHOD FOR MANAGING POWER OF TEST CIRCUITS
- Publication number 20220413037
- Publication date Dec 29, 2022
- IC ANALYTICA, LLC
- Patrick G. DRENNAN
- G01 - MEASURING TESTING
Information Patent Application
VIRTUAL QUALITY CONTROL INTERPOLATION AND PROCESS FEEDBACK IN THE P...
- Publication number 20220413036
- Publication date Dec 29, 2022
- SANDISK TECHNOLOGIES LLC
- Yusuke Ikawa
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TESTING MODULE AND TESTING METHOD USING THE SAME
- Publication number 20220381817
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao Chen
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR CHECKING A SEMICONDUCTOR SWITCH FOR A FAULT
- Publication number 20220158633
- Publication date May 19, 2022
- Webasto SE
- Philipp ECK
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
TESTING AN INTEGRATED CAPACITOR
- Publication number 20220113346
- Publication date Apr 14, 2022
- SEMTECH CORPORATION
- Jonah Edward NUTTGENS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE TEST APPARATUS AND METHOD
- Publication number 20220057444
- Publication date Feb 24, 2022
- Samsung Electronics Co., Ltd.
- Sung Ok KIM
- G01 - MEASURING TESTING
Information Patent Application
SCREENING METHOD AND APPARATUS FOR DETECTING DEEP TRENCH ISOLATION...
- Publication number 20220003812
- Publication date Jan 6, 2022
- NXP USA, Inc.
- Laurent Segarra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMI-CONDUCTOR MODULE, MASK, MEASUREMENT METHOD, COMPUTER SOF...
- Publication number 20210223307
- Publication date Jul 22, 2021
- Mitsubishi Electric Corporation
- Nicolas DEGRENNE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUITRY FOR ELECTRICAL REDUNDANCY IN BONDED STRUCTURES
- Publication number 20210193603
- Publication date Jun 24, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Javier A. DeLACruz
- G01 - MEASURING TESTING
Information Patent Application
METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES
- Publication number 20210125942
- Publication date Apr 29, 2021
- Intel Corporation
- Dae-Woo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TESTING MODULE AND TESTING METHOD USING THE SAME
- Publication number 20210063471
- Publication date Mar 4, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hao Chen
- G01 - MEASURING TESTING
Information Patent Application
DEVICE AND METHOD FOR MONITORING MULTI-DIE POWER MODULE
- Publication number 20210011079
- Publication date Jan 14, 2021
- Mitsubishi Electric Corporation
- Jeffrey EWANCHUK
- G01 - MEASURING TESTING
Information Patent Application
DIRECT MEASUREMENT TEST STRUCTURES FOR MEASURING STATIC RANDOM ACCE...
- Publication number 20200319243
- Publication date Oct 8, 2020
- The Boeing Company
- Mark Yao
- G11 - INFORMATION STORAGE
Information Patent Application
CONTROL METHOD AND ELECTRONIC DEVICE
- Publication number 20200201274
- Publication date Jun 25, 2020
- LENOVO (BEIJING) CO., LTD.
- Tianyu WANG
- G05 - CONTROLLING REGULATING
Information Patent Application
INTERMEDIATE CONNECTION MEMBER AND INSPECTION APPARATUS
- Publication number 20200116756
- Publication date Apr 16, 2020
- TOKYO ELECTRON LIMITED
- Jun MOCHIZUKI
- G01 - MEASURING TESTING
Information Patent Application
Apparatus and Method for Testing Semiconductor Devices
- Publication number 20200041564
- Publication date Feb 6, 2020
- Testmetrix, Inc.
- Christian O. Cojocneanu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES
- Publication number 20200013734
- Publication date Jan 9, 2020
- Intel Corporation
- Dae-Woo KIM
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR FAULT ANALYSIS DEVICE AND FAULT ANALYSIS METHOD THEREOF
- Publication number 20190385695
- Publication date Dec 19, 2019
- Samsung Electronics Co., Ltd.
- Changwook JEONG
- G01 - MEASURING TESTING

for testing individual semiconductor components within integrated circuits

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Ultrasonic testing device and ultrasonic testing method

Metal-free frame design for silicon bridges for semiconductor packages

Ultrasonic testing device and ultrasonic testing method

Virtual quality control interpolation and process feedback in the p...

Metal-free frame design for silicon bridges for semiconductor packages

Semiconductor package test apparatus and method

Apparatus and method for managing power of test circuits

Test method for tolerance against the hot carrier effect

Power semi-conductor module, mask, measurement method, computer sof...

Testing module and testing method using the same

Method for checking a semiconductor switch for a fault

Memory system tester using test pad real time monitoring

Circuitry for electrical redundancy in bonded structures

Testing module and testing method using the same

Internal failure detection of an external failure detection system...

Metal-free frame design for silicon bridges for semiconductor packages

Testing module and testing method using the same

Probe card for characterizing processes of submicron semiconductor...

Testing an integrated capacitor

Screening method and apparatus for detecting deep trench isolation...

Method and apparatus for calculating kink current of SOI device

Device and method for monitoring multi-die power module

IGBT module reliability evaluation method and device based on bondi...

Control method and electronic device with removable components

Apparatus and method for testing semiconductor devices

Memory system tester using test pad real time monitoring

Aging detector for an electrical circuit component, method for moni...

Method for the characterization and monitoring of integrated circuits

Position correction method, inspection apparatus, and probe card

Method for the characterization and monitoring of integrated circuits

Patents Applicationslast 30 patents

AN ADAPTIVE BODY BIASING SYSTEM FOR SILICON ON INSULATOR SEMICONDUC...

STRESS CALIBRATION METHOD, CORRESPONDING ELECTRONIC DEVICE

MEASURING ARRANGEMENT FOR EXAMINING A LIGHT-EMITTING DIODE ASSEMBLY...

CIRCUITRY FOR ELECTRICAL REDUNDANCY IN BONDED STRUCTURES

TESTING MODULE AND TESTING METHOD USING THE SAME

EVALUATION CIRCUIT, SEMICONDUCTOR DEVICE, AND EVALUATION METHOD

INTEGRATED CIRCUIT THAT MITIGATES INDUCTIVE-INDUCED VOLTAGE DROOP

INTEGRATED CIRCUIT THAT MITIGATES INDUCTIVE-INDUCED VOLTAGE OVERSHOOT

CIRCUITRY FOR ELECTRICAL REDUNDANCY IN BONDED STRUCTURES

METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES

A TESTING MODULE AND TESTING METHOD USING THE SAME

TEST METHOD FOR TOLERANCE AGAINST THE HOT CARRIER EFFECT

APPARATUS AND METHOD FOR MANAGING POWER OF TEST CIRCUITS

VIRTUAL QUALITY CONTROL INTERPOLATION AND PROCESS FEEDBACK IN THE P...

TESTING MODULE AND TESTING METHOD USING THE SAME

METHOD FOR CHECKING A SEMICONDUCTOR SWITCH FOR A FAULT

TESTING AN INTEGRATED CAPACITOR

SEMICONDUCTOR PACKAGE TEST APPARATUS AND METHOD

SCREENING METHOD AND APPARATUS FOR DETECTING DEEP TRENCH ISOLATION...

POWER SEMI-CONDUCTOR MODULE, MASK, MEASUREMENT METHOD, COMPUTER SOF...

CIRCUITRY FOR ELECTRICAL REDUNDANCY IN BONDED STRUCTURES

METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES

TESTING MODULE AND TESTING METHOD USING THE SAME

DEVICE AND METHOD FOR MONITORING MULTI-DIE POWER MODULE

DIRECT MEASUREMENT TEST STRUCTURES FOR MEASURING STATIC RANDOM ACCE...

CONTROL METHOD AND ELECTRONIC DEVICE

INTERMEDIATE CONNECTION MEMBER AND INSPECTION APPARATUS

Apparatus and Method for Testing Semiconductor Devices

METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES

SEMICONDUCTOR FAULT ANALYSIS DEVICE AND FAULT ANALYSIS METHOD THEREOF