for testing integrated circuits on wafers

Industry

CPC
G01R1/0491

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

GPHYSICS G01Measuring instruments G01RMEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00

Current Industry

G01R1/0491for testing integrated circuits on wafers

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Wafer inspection system
- Patent number 12,117,485
- Issue date Oct 15, 2024
- Tokyo Electron Limited
- Junichi Hagihara
- G01 - MEASURING TESTING
Information Patent Grant
Method and system for thermal control of devices in an electronics...
- Patent number 12,007,451
- Issue date Jun 11, 2024
- AEHR Test Systems
- Jovan Jovanovic
- G01 - MEASURING TESTING
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 11,977,099
- Issue date May 7, 2024
- HITACHI HIGH-TECH CORPORATION
- Tomohisa Ohtaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for testing an integrated circuit of a device and its method...
- Patent number 11,977,098
- Issue date May 7, 2024
- AEHR Test Systems
- Scott E. Lindsey
- G01 - MEASURING TESTING
Information Patent Grant
Film for component manufacture and component manufacturing method
- Patent number 11,942,349
- Issue date Mar 26, 2024
- Mitsui Chemicals Tohcello, Inc.
- Eiji Hayashishita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Portable probe card assembly
- Patent number 11,933,816
- Issue date Mar 19, 2024
- Celadon Systems, Inc.
- William A. Funk
- G01 - MEASURING TESTING
Information Patent Grant
Multi-site concurrent wafer probe magnetic circuit testing
- Patent number 11,927,604
- Issue date Mar 12, 2024
- Texas Instruments Incorporated
- Xinkun Huang
- G01 - MEASURING TESTING
Information Patent Grant
Testing module and testing method using the same
- Patent number 11,906,573
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao Chen
- G01 - MEASURING TESTING
Information Patent Grant
Test board and test apparatus including the same
- Patent number 11,828,791
- Issue date Nov 28, 2023
- Samsung Electronics Co., Ltd.
- Kijae Song
- G01 - MEASURING TESTING
Information Patent Grant
Method and device for electrically contacting components in a semic...
- Patent number 11,796,567
- Issue date Oct 24, 2023
- Osram Opto Semiconductors GmbH
- Michael Bergler
- G01 - MEASURING TESTING
Information Patent Grant
Wafer inspection system
- Patent number 11,762,012
- Issue date Sep 19, 2023
- Tokyo Electron Limited
- Junichi Hagihara
- G01 - MEASURING TESTING
Information Patent Grant
Evaluation apparatus for semiconductor device
- Patent number 11,709,199
- Issue date Jul 25, 2023
- HITACHI HIGH-TECH CORPORATION
- Tomohisa Ohtaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Testing module and testing method using the same
- Patent number 11,693,045
- Issue date Jul 4, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao Chen
- G01 - MEASURING TESTING
Information Patent Grant
Pressure relief valve
- Patent number 11,592,465
- Issue date Feb 28, 2023
- AEHR Test Systems
- Scott E. Lindsey
- G01 - MEASURING TESTING
Information Patent Grant
Testing module and testing method using the same
- Patent number 11,585,846
- Issue date Feb 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao Chen
- G01 - MEASURING TESTING
Information Patent Grant
Wafer inspection system
- Patent number 11,567,123
- Issue date Jan 31, 2023
- Tokyo Electron Limited
- Junichi Hagihara
- G01 - MEASURING TESTING
Information Patent Grant
Intermediate connecting member and inspection apparatus
- Patent number 11,561,240
- Issue date Jan 24, 2023
- Tokyo Electron Limited
- Jun Mochizuki
- G01 - MEASURING TESTING
Information Patent Grant
System for monitoring and controlling an integrated circuit testing...
- Patent number 11,428,735
- Issue date Aug 30, 2022
- Maxim Integrated Products, Inc.
- Ruel Jucoy Mijares
- G01 - MEASURING TESTING
Information Patent Grant
Method for measuring an electric property of a test sample
- Patent number 11,307,245
- Issue date Apr 19, 2022
- KLA Corporation
- Alberto Cagliani
- G11 - INFORMATION STORAGE
Information Patent Grant
Film for component manufacture and component manufacturing method
- Patent number 11,276,600
- Issue date Mar 15, 2022
- Mitsui Chemicals Tohcello, Inc.
- Eiji Hayashishita
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method and system for thermal control of devices in an electronics...
- Patent number 11,209,497
- Issue date Dec 28, 2021
- AEHR Test Systems
- Jovan Jovanovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inspection device
- Patent number 11,204,368
- Issue date Dec 21, 2021
- Yokowo Co., Ltd.
- Masaki Noguchi
- G01 - MEASURING TESTING
Information Patent Grant
Alternating current solid-state switch
- Patent number 11,171,571
- Issue date Nov 9, 2021
- GM Global Technology Operations LLC
- Rashmi Prasad
- G01 - MEASURING TESTING
Information Patent Grant
Low-force wafer test probes
- Patent number 11,131,689
- Issue date Sep 28, 2021
- International Business Machines Corporation
- David M. Audette
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test system
- Patent number 11,125,814
- Issue date Sep 21, 2021
- Sintokogio, Ltd.
- Takayuki Hamada
- G01 - MEASURING TESTING
Information Patent Grant
Pressure relief valve
- Patent number 11,112,429
- Issue date Sep 7, 2021
- AEHR Test Systems
- Scott E. Lindsey
- G01 - MEASURING TESTING
Information Patent Grant
Wafer inspection system, wafer inspection apparatus and prober
- Patent number 11,061,071
- Issue date Jul 13, 2021
- Tokyo Electron Limited
- Junichi Hagihara
- G01 - MEASURING TESTING
Information Patent Grant
Probe card system for testing an integrated circuit
- Patent number 11,002,761
- Issue date May 11, 2021
- KEITHLEY INSTRUMENTS, LLC
- Vladimir V. Genkin
- G01 - MEASURING TESTING
Information Patent Grant
Electronics tester with power saving state
- Patent number 10,976,362
- Issue date Apr 13, 2021
- AEHR Test Systems
- Steven C. Steps
- G01 - MEASURING TESTING
Information Patent Grant
Test head and wafer inspection apparatus
- Patent number 10,976,364
- Issue date Apr 13, 2021
- Tokyo Electron Limited
- Junichi Hagihara
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND SYSTEM FOR THERMAL CONTROL OF DEVICS IN ELECTRONICS TESTER
- Publication number 20240426938
- Publication date Dec 26, 2024
- Aehr Test Systems
- Jovan Jovanovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR THERMAL CONTROL OF DEVICES IN AN ELECTRONICS...
- Publication number 20240426939
- Publication date Dec 26, 2024
- Aehr Test Systems
- Jovan Jovanovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER TEST SYSTEM, PROBE CARD REPLACING METHOD, AND PROBER
- Publication number 20240369623
- Publication date Nov 7, 2024
- TOKYO SEIMITSU CO., LTD.
- Akira YAMAGUCHI
- G01 - MEASURING TESTING
Information Patent Application
METHOD AND SYSTEM FOR THERMAL CONTROL OF DEVICES IN AN ELECTRONICS...
- Publication number 20240302451
- Publication date Sep 12, 2024
- Aehr Test Systems
- Jovan Jovanovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLING ALIGNMENT DURING A THERMAL CYCLE
- Publication number 20240230714
- Publication date Jul 11, 2024
- Aehr Test Systems
- Scott E. Lindsey
- G01 - MEASURING TESTING
Information Patent Application
PORTABLE PROBE CARD ASSEMBLY
- Publication number 20240219423
- Publication date Jul 4, 2024
- Celadon Systems, Inc.
- William A. FUNK
- G01 - MEASURING TESTING
Information Patent Application
MULTI-SITE CONCURRENT WAFER PROBE MAGNETIC CIRCUIT TESTING
- Publication number 20240219425
- Publication date Jul 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Xinkun Huang
- G01 - MEASURING TESTING
Information Patent Application
TESTING MODULE AND TESTING METHOD USING THE SAME
- Publication number 20240133942
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao Chen
- G01 - MEASURING TESTING
Information Patent Application
WAFER INSPECTION SYSTEM
- Publication number 20240019487
- Publication date Jan 18, 2024
- TOKYO ELECTRON LIMITED
- Junichi Hagihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TUBULAR BODY, CONTACT TERMINAL, INSPECTION JIG, AND INSPECTION APPA...
- Publication number 20230349946
- Publication date Nov 2, 2023
- Nidec-Read Corporation
- Norihiro OTA
- G01 - MEASURING TESTING
Information Patent Application
CASSETTE MAGAZINE FOR THIN WAFERS
- Publication number 20230326774
- Publication date Oct 12, 2023
- Skyworks Solutions, Inc.
- Leonardo Antonio Camarena Pulido
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER CHIP TESTING METHOD AND APPARATUS, ELECTRONIC DEVICE AND STOR...
- Publication number 20230204664
- Publication date Jun 29, 2023
- Saimeite Technology Co., Ltd.
- Gangjiang LI
- G01 - MEASURING TESTING
Information Patent Application
SYSTEM FOR TESTING AN INTEGRATED CIRCUIT OF A DEVICE AND ITS METHO...
- Publication number 20230168277
- Publication date Jun 1, 2023
- AEHR TEST SYSTEMS
- Scott E. Lindsey
- G01 - MEASURING TESTING
Information Patent Application
A TESTING MODULE AND TESTING METHOD USING THE SAME
- Publication number 20230168296
- Publication date Jun 1, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao Chen
- G01 - MEASURING TESTING
Information Patent Application
TWO-AXIS TEST FIXTURE
- Publication number 20230147392
- Publication date May 11, 2023
- MOTIONAL AD LLC
- Joseph Brassard
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
WAFER INSPECTION SYSTEM
- Publication number 20230134360
- Publication date May 4, 2023
- TOKYO ELECTRON LIMITED
- Junichi Hagihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TESTING MODULE AND TESTING METHOD USING THE SAME
- Publication number 20220381817
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao Chen
- G01 - MEASURING TESTING
Information Patent Application
TEST BOARD AND TEST APPARATUS INCLUDING THE SAME
- Publication number 20220365132
- Publication date Nov 17, 2022
- Samsung Electronics Co., Ltd.
- Kijae SONG
- G01 - MEASURING TESTING
Information Patent Application
PORTABLE PROBE CARD ASSEMBLY
- Publication number 20220163562
- Publication date May 26, 2022
- Celadon Systems, Inc.
- William A. FUNK
- G01 - MEASURING TESTING
Information Patent Application
METHOD AND DEVICE FOR ELECTRICALLY CONTACTING COMPONENTS IN A SEMIC...
- Publication number 20220163564
- Publication date May 26, 2022
- Osram Opto Semiconductors GmbH
- Michael BERGLER
- G01 - MEASURING TESTING
Information Patent Application
METHOD AND SYSTEM FOR THERMAL CONTROL OF DEVICES IN AN ELECTRONICS...
- Publication number 20220082636
- Publication date Mar 17, 2022
- Aehr Test Systems
- Jovan Jovanovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESSURE RELIEF VALVE
- Publication number 20210364549
- Publication date Nov 25, 2021
- Aehr Test Systems
- Scott E. Lindsey
- G01 - MEASURING TESTING
Information Patent Application
MULTI-SITE CONCURRENT WAFER PROBE MAGNETIC CIRCUIT TESTING
- Publication number 20210356497
- Publication date Nov 18, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Xinkun Huang
- G01 - MEASURING TESTING
Information Patent Application
INTERMEDIATE CONNECTING MEMBER AND INSPECTION APPARATUS
- Publication number 20210341515
- Publication date Nov 4, 2021
- TOKYO ELECTRON LIMITED
- Jun Mochizuki
- G01 - MEASURING TESTING
Information Patent Application
Method for Measuring An Electric Property of a Test Sample
- Publication number 20210231731
- Publication date Jul 29, 2021
- KLA Corporation
- Alberto Cagliani
- G01 - MEASURING TESTING
Information Patent Application
Wafer Fixture For Testing And Transport
- Publication number 20210208193
- Publication date Jul 8, 2021
- II-VI Delaware, Inc.
- Raven Persaud
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER INSPECTION SYSTEM
- Publication number 20210190861
- Publication date Jun 24, 2021
- TOKYO ELECTRON LIMITED
- Junichi Hagihara
- G01 - MEASURING TESTING
Information Patent Application
PROBE APPARATUS
- Publication number 20210173003
- Publication date Jun 10, 2021
- TECAT TECHNOLOGIES (SUZHOU) LIMITED
- CHANG-MING LIN
- G01 - MEASURING TESTING
Information Patent Application
ALTERNATING CURRENT SOLID-STATE SWITCH
- Publication number 20210135588
- Publication date May 6, 2021
- GM GLOBAL TECHNOLOGY OPERATIONS LLC
- Rashmi Prasad
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
TESTING MODULE AND TESTING METHOD USING THE SAME
- Publication number 20210063471
- Publication date Mar 4, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hao Chen
- G01 - MEASURING TESTING

for testing integrated circuits on wafers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wafer inspection system

Method and system for thermal control of devices in an electronics...

Method for manufacturing semiconductor device

System for testing an integrated circuit of a device and its method...

Film for component manufacture and component manufacturing method

Portable probe card assembly

Multi-site concurrent wafer probe magnetic circuit testing

Testing module and testing method using the same

Test board and test apparatus including the same

Method and device for electrically contacting components in a semic...

Wafer inspection system

Evaluation apparatus for semiconductor device

Testing module and testing method using the same

Pressure relief valve

Testing module and testing method using the same

Wafer inspection system

Intermediate connecting member and inspection apparatus

System for monitoring and controlling an integrated circuit testing...

Method for measuring an electric property of a test sample

Film for component manufacture and component manufacturing method

Method and system for thermal control of devices in an electronics...

Inspection device

Alternating current solid-state switch

Low-force wafer test probes

Test system

Pressure relief valve

Wafer inspection system, wafer inspection apparatus and prober

Probe card system for testing an integrated circuit

Electronics tester with power saving state

Test head and wafer inspection apparatus

Patents Applicationslast 30 patents

METHOD AND SYSTEM FOR THERMAL CONTROL OF DEVICS IN ELECTRONICS TESTER

METHOD AND SYSTEM FOR THERMAL CONTROL OF DEVICES IN AN ELECTRONICS...

WAFER TEST SYSTEM, PROBE CARD REPLACING METHOD, AND PROBER

METHOD AND SYSTEM FOR THERMAL CONTROL OF DEVICES IN AN ELECTRONICS...

CONTROLLING ALIGNMENT DURING A THERMAL CYCLE

PORTABLE PROBE CARD ASSEMBLY

MULTI-SITE CONCURRENT WAFER PROBE MAGNETIC CIRCUIT TESTING

TESTING MODULE AND TESTING METHOD USING THE SAME

WAFER INSPECTION SYSTEM

TUBULAR BODY, CONTACT TERMINAL, INSPECTION JIG, AND INSPECTION APPA...

CASSETTE MAGAZINE FOR THIN WAFERS

WAFER CHIP TESTING METHOD AND APPARATUS, ELECTRONIC DEVICE AND STOR...

SYSTEM FOR TESTING AN INTEGRATED CIRCUIT OF A DEVICE AND ITS METHO...

A TESTING MODULE AND TESTING METHOD USING THE SAME

TWO-AXIS TEST FIXTURE

WAFER INSPECTION SYSTEM

TESTING MODULE AND TESTING METHOD USING THE SAME

TEST BOARD AND TEST APPARATUS INCLUDING THE SAME

PORTABLE PROBE CARD ASSEMBLY

METHOD AND DEVICE FOR ELECTRICALLY CONTACTING COMPONENTS IN A SEMIC...

METHOD AND SYSTEM FOR THERMAL CONTROL OF DEVICES IN AN ELECTRONICS...

PRESSURE RELIEF VALVE

MULTI-SITE CONCURRENT WAFER PROBE MAGNETIC CIRCUIT TESTING

INTERMEDIATE CONNECTING MEMBER AND INSPECTION APPARATUS

Method for Measuring An Electric Property of a Test Sample

Wafer Fixture For Testing And Transport

WAFER INSPECTION SYSTEM

PROBE APPARATUS

ALTERNATING CURRENT SOLID-STATE SWITCH

TESTING MODULE AND TESTING METHOD USING THE SAME