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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00

Current Industry

H01L2223/54473for use after dicing

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Heterogeneous integration of components onto compact devices using...
- Patent number 12,009,247
- Issue date Jun 11, 2024
- Board of Regents, The University of Texas System
- Sidlgata V. Sreenivasan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Reclaimable semiconductor device package and associated systems and...
- Patent number 11,854,635
- Issue date Dec 26, 2023
- Micron Technology, Inc.
- Yueping Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure and method for manufacturing a circuit boar...
- Patent number 11,792,941
- Issue date Oct 17, 2023
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip comprising a multiplicity of external contacts,...
- Patent number 11,728,257
- Issue date Aug 15, 2023
- Infineon Technologies AG
- Dietrich Bonart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip singulation method
- Patent number 11,646,230
- Issue date May 9, 2023
- NUVOTON TECHNOLOGY CORPORATION JAPAN
- Takeshi Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous integration of components onto compact devices using...
- Patent number 11,469,131
- Issue date Oct 11, 2022
- Board of Regents, The University of Texas System
- Sidlgata V. Sreenivasan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Package comprising identifier on and/or in carrier
- Patent number 11,239,176
- Issue date Feb 1, 2022
- Infineon Technologies AG
- Jochen Dangelmaier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment of multiple image dice in package
- Patent number 11,205,670
- Issue date Dec 21, 2021
- TELEDYNE DIGITAL IMAGING, INC
- Anton Petrus Maria Van Arendonk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,195,819
- Issue date Dec 7, 2021
- LONGITUDE LICENSING LIMITED
- Daisuke Tsuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure and method for manufacturing a circuit boar...
- Patent number 11,134,572
- Issue date Sep 28, 2021
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment method, method for connecting electronic component, metho...
- Patent number 11,049,842
- Issue date Jun 29, 2021
- Dexerials Corporation
- Yasushi Akutsu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Bond head assemblies including reflective optical elements, related...
- Patent number 11,031,367
- Issue date Jun 8, 2021
- Kulicke and Soffa Industries, In.
- Matthew B. Wasserman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Secure permanent integrated circuit personalization
- Patent number 10,978,303
- Issue date Apr 13, 2021
- Michael C. Smayling
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor chip comprising a multiplicity of external contacts,...
- Patent number 10,892,214
- Issue date Jan 12, 2021
- Infineon Technologies AG
- Dietrich Bonart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structures for burn-in testing and methods the...
- Patent number 10,712,382
- Issue date Jul 14, 2020
- Micron Technology, Inc.
- Mark E. Tuttle
- G01 - MEASURING TESTING
Information Patent Grant
Chip on glass package assembly
- Patent number 10,692,815
- Issue date Jun 23, 2020
- Novatek Microelectronics Corp.
- Wei-Kuo Mai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit substrate and method for manufacturing the same
- Patent number 10,672,716
- Issue date Jun 2, 2020
- Infineon Technologies AG
- Michael Roesner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Secure permanent integrated circuit personalization
- Patent number 10,659,229
- Issue date May 19, 2020
- Michael C. Smayling
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Photodetector-arrays and methods of fabrication thereof
- Patent number 10,644,061
- Issue date May 5, 2020
- Semi-Conductor Devices-An Elbit Systems-Rafael Partnership
- Yoram Karni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mountable electronic component
- Patent number 10,629,485
- Issue date Apr 21, 2020
- Vishay Semiconductor GmbH
- Claus Mähner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus and memory system
- Patent number 10,615,126
- Issue date Apr 7, 2020
- SK hynix Inc.
- Sang Jin Byeon
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device having first and second electrode layers elect...
- Patent number 10,593,814
- Issue date Mar 17, 2020
- Rohm Co., Ltd.
- Hiroki Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip stack with identification section on chip side-s...
- Patent number 10,515,932
- Issue date Dec 24, 2019
- LONGITUDE LICENSING LIMITED
- Daisuke Tsuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die identification by optically reading selectively blowable fuse e...
- Patent number 10,483,213
- Issue date Nov 19, 2019
- STMicroelectronics S.r.l.
- Giona Fucili
- G11 - INFORMATION STORAGE
Information Patent Grant
Reclaimable semiconductor device package and associated systems and...
- Patent number 10,482,988
- Issue date Nov 19, 2019
- Micron Technology, Inc.
- Yueping Li
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device, method of positioning semiconductor device, a...
- Patent number 10,446,501
- Issue date Oct 15, 2019
- Olympus Corporation
- Masato Mikami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and multi-chip package using thereof and method...
- Patent number 10,438,887
- Issue date Oct 8, 2019
- Nanya Technology Corporation
- Po Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Visual identification of semiconductor dies
- Patent number 10,431,551
- Issue date Oct 1, 2019
- Texas Instruments Incorporated
- Kenneth Michael Butler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Secure permanent integrated circuit personalization
- Patent number 10,312,091
- Issue date Jun 4, 2019
- Michael C. Smayling
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Interposer with identification system
- Patent number 10,290,606
- Issue date May 14, 2019
- Advanced Micro Devices, Inc.
- Michael Alfano
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HETEROGENEOUS INTEGRATION OF COMPONENTS ONTO COMPACT DEVICES USING...
- Publication number 20240332056
- Publication date Oct 3, 2024
- Board of Regents, The University of Texas System
- Sidlgata V. Sreenivasan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED CIRCUIT DEVICE WITH ELECTRICALLY ACTIVE FIDUCIALS
- Publication number 20240063136
- Publication date Feb 22, 2024
- Intel Corporation
- Haris Khan Niazi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING RECOGNITION MARKS
- Publication number 20220415821
- Publication date Dec 29, 2022
- SK HYNIX INC.
- Hyun Chul SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit board structure and method for manufacturing a circuit boar...
- Publication number 20210392752
- Publication date Dec 16, 2021
- ImberaTek LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Chip Comprising a Multiplicity of External Contacts,...
- Publication number 20210057322
- Publication date Feb 25, 2021
- Dietrich Bonart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A PLURALITY OF ELECTRONIC COMPONENT PACKAGES AND...
- Publication number 20200335476
- Publication date Oct 22, 2020
- Amkor Technology, Inc.
- Brett Arnold Dunlap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALIGNMENT METHOD, METHOD FOR CONNECTING ELECTRONIC COMPONENT, METHO...
- Publication number 20190206831
- Publication date Jul 4, 2019
- DEXERIALS CORPORATION
- Yasushi AKUTSU
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURES FOR BURN-IN TESTING AND METHODS THE...
- Publication number 20190170811
- Publication date Jun 6, 2019
- Micron Technology, Inc.
- Mark E. Tuttle
- G01 - MEASURING TESTING
Information Patent Application
ALIGNMENT OF MULTIPLE IMAGE DICE IN PACKAGE
- Publication number 20190067351
- Publication date Feb 28, 2019
- Teledyne Dalsa, Inc.
- Anton Petrus Maria Van Arendonk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Substrate and Method for Manufacturing the Same
- Publication number 20180315713
- Publication date Nov 1, 2018
- Michael Roesner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND MEMORY SYSTEM
- Publication number 20180151509
- Publication date May 31, 2018
- SK HYNIX INC.
- Sang Jin BYEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VISUAL IDENTIFICATION OF SEMICONDUCTOR DIES
- Publication number 20180130754
- Publication date May 10, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Kenneth Michael Butler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECLAIMABLE SEMICONDUCTOR DEVICE PACKAGE AND ASSOCIATED SYSTEMS AND...
- Publication number 20180090223
- Publication date Mar 29, 2018
- Micron Technology, Inc.
- Yueping Li
- G11 - INFORMATION STORAGE
Information Patent Application
MOBILE COMPUTING DEVICE RECONFIGURATION IS RESPONSE TO ENVIRONMENTA...
- Publication number 20180024959
- Publication date Jan 25, 2018
- ETRON TECHNOLOGY, INC.
- Weng-Dah Ken
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160268212
- Publication date Sep 15, 2016
- Kabushiki Kaisha Toshiba
- Takuma SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING FLIP-CHIP TYPE SEMICONDUCTOR DEVICE
- Publication number 20140361443
- Publication date Dec 11, 2014
- Goji Shiga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE MOUNTABLE ELECTRONIC COMPONENT
- Publication number 20140346642
- Publication date Nov 27, 2014
- Vishay Semiconductor GmbH
- Claus Mähner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF POSITIONING SEMICONDUCTOR DEVICE, A...
- Publication number 20140339711
- Publication date Nov 20, 2014
- OLYMPUS CORPORATION
- Masato MIKAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140339682
- Publication date Nov 20, 2014
- Sharp Kabushiki Kaisha
- Yasushi Funakoshi
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
SEMICONDUCTOR APPARATUS AND MEMORY SYSTEM
- Publication number 20140344613
- Publication date Nov 20, 2014
- SK HYNIX INC.
- Sang Jin BYEON
- G11 - INFORMATION STORAGE
Information Patent Application
SYSTEMS AND METHODS FOR PASSIVE ALIGNMENT OF OPTO-ELECTRONIC COMPON...
- Publication number 20140334772
- Publication date Nov 13, 2014
- James Doscher
- G02 - OPTICS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
- Publication number 20140284780
- Publication date Sep 25, 2014
- RENESAS ELECTRONICS CORPORATION
- Nobuhiro Kinoshita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP DIODE AND DIODE PACKAGE
- Publication number 20140284754
- Publication date Sep 25, 2014
- Rohm Co., Ltd.
- Hiroki Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140252604
- Publication date Sep 11, 2014
- TOHOKU-MICROTEC CO., LTD
- Makoto MOTOYOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing an electronic module and an electronic module
- Publication number 20140208588
- Publication date Jul 31, 2014
- GE EMBEDDED ELECTRONICS OY
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING THROUGH-VIAS AND METHODS FOR FABRICATI...
- Publication number 20140179103
- Publication date Jun 26, 2014
- Pil-Kyu Kang
- G11 - INFORMATION STORAGE
Information Patent Application
PROGRAMMABLE REVISION CELL ID SYSTEM AND METHOD
- Publication number 20140111274
- Publication date Apr 24, 2014
- Conexant Systems, Inc.
- Khosrow Golshan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Circuit board structure and method for manufacturing a circuit boar...
- Publication number 20140059851
- Publication date Mar 6, 2014
- Imbera Electronics Oy
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE INCLUDING ALIGNMENT KEY STRUCTURES
- Publication number 20140048948
- Publication date Feb 20, 2014
- SK HYNIX INC.
- Chang Hyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND DISPLAY DEVICE HAVING ALIGNMENT MARK
- Publication number 20140035171
- Publication date Feb 6, 2014
- FITIPOWER INTEGRATED TECHNOLOGY, INC.
- CHUN-PING YANG
- H01 - BASIC ELECTRIC ELEMENTS

for use after dicing

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Heterogeneous integration of components onto compact devices using...

Reclaimable semiconductor device package and associated systems and...

Circuit board structure and method for manufacturing a circuit boar...

Semiconductor chip comprising a multiplicity of external contacts,...

Chip singulation method

Heterogeneous integration of components onto compact devices using...

Package comprising identifier on and/or in carrier

Alignment of multiple image dice in package

Semiconductor device

Circuit board structure and method for manufacturing a circuit boar...

Alignment method, method for connecting electronic component, metho...

Bond head assemblies including reflective optical elements, related...

Secure permanent integrated circuit personalization

Semiconductor chip comprising a multiplicity of external contacts,...

Semiconductor device structures for burn-in testing and methods the...

Chip on glass package assembly

Integrated circuit substrate and method for manufacturing the same

Secure permanent integrated circuit personalization

Photodetector-arrays and methods of fabrication thereof

Surface mountable electronic component

Semiconductor apparatus and memory system

Semiconductor device having first and second electrode layers elect...

Semiconductor chip stack with identification section on chip side-s...

Die identification by optically reading selectively blowable fuse e...

Reclaimable semiconductor device package and associated systems and...

Semiconductor device, method of positioning semiconductor device, a...

Semiconductor chip and multi-chip package using thereof and method...

Visual identification of semiconductor dies

Secure permanent integrated circuit personalization

Interposer with identification system

Patents Applicationslast 30 patents

HETEROGENEOUS INTEGRATION OF COMPONENTS ONTO COMPACT DEVICES USING...

INTEGRATED CIRCUIT DEVICE WITH ELECTRICALLY ACTIVE FIDUCIALS

SEMICONDUCTOR DEVICES INCLUDING RECOGNITION MARKS

Circuit board structure and method for manufacturing a circuit boar...

Semiconductor Chip Comprising a Multiplicity of External Contacts,...

METHOD OF FORMING A PLURALITY OF ELECTRONIC COMPONENT PACKAGES AND...

ALIGNMENT METHOD, METHOD FOR CONNECTING ELECTRONIC COMPONENT, METHO...

SEMICONDUCTOR DEVICE STRUCTURES FOR BURN-IN TESTING AND METHODS THE...

ALIGNMENT OF MULTIPLE IMAGE DICE IN PACKAGE

Integrated Circuit Substrate and Method for Manufacturing the Same

SEMICONDUCTOR APPARATUS AND MEMORY SYSTEM

VISUAL IDENTIFICATION OF SEMICONDUCTOR DIES

RECLAIMABLE SEMICONDUCTOR DEVICE PACKAGE AND ASSOCIATED SYSTEMS AND...

MOBILE COMPUTING DEVICE RECONFIGURATION IS RESPONSE TO ENVIRONMENTA...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

METHOD OF MANUFACTURING FLIP-CHIP TYPE SEMICONDUCTOR DEVICE

SURFACE MOUNTABLE ELECTRONIC COMPONENT

SEMICONDUCTOR DEVICE, METHOD OF POSITIONING SEMICONDUCTOR DEVICE, A...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR APPARATUS AND MEMORY SYSTEM

SYSTEMS AND METHODS FOR PASSIVE ALIGNMENT OF OPTO-ELECTRONIC COMPON...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

CHIP DIODE AND DIODE PACKAGE

STACKED DEVICE AND METHOD OF MANUFACTURING THE SAME

Method for manufacturing an electronic module and an electronic module

SEMICONDUCTOR DEVICES HAVING THROUGH-VIAS AND METHODS FOR FABRICATI...

PROGRAMMABLE REVISION CELL ID SYSTEM AND METHOD

Circuit board structure and method for manufacturing a circuit boar...

SEMICONDUCTOR MEMORY DEVICE INCLUDING ALIGNMENT KEY STRUCTURES

SEMICONDUCTOR DEVICE AND DISPLAY DEVICE HAVING ALIGNMENT MARK