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WET CLEAN APPARATUS FOR SINGLE WAFER
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Publication number 20240038552
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Publication date Feb 1, 2024
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Shanghai Huali Integrated Circuit Corporation
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Wenqian XIE
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H01 - BASIC ELECTRIC ELEMENTS
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DIE PROCESSING
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Publication number 20240021572
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Publication date Jan 18, 2024
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ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
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Cyprian Emeka Uzoh
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H01 - BASIC ELECTRIC ELEMENTS
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SUBSTRATE PROCESSING APPARATUS
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Publication number 20230405762
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Publication date Dec 21, 2023
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EBARA CORPORATION
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Kuniaki YAMAGUCHI
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B24 - GRINDING POLISHING
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WAFER CLEANING METHOD
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Publication number 20230360938
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Publication date Nov 9, 2023
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Kuo-Shu TSENG
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H01 - BASIC ELECTRIC ELEMENTS
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Post-CMP Cleaning and Apparatus
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Publication number 20230352295
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Publication date Nov 2, 2023
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Taiwan Semiconductor Manufacturing Co., Ltd.
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Fu-Ming Huang
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B08 - CLEANING
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WAFER CLEANING APPARATUS
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Publication number 20230294144
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Publication date Sep 21, 2023
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ZEUS CO., LTD.
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Sanghoon LEE
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B08 - CLEANING
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APPARATUS FOR TREATING SUBSTRATE
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Publication number 20230162994
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Publication date May 25, 2023
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SEMES CO., LTD.
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JAE SEONG LEE
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C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...