formation by oxidation

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H01L21/0223

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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H01L21/0223formation by oxidation

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Gate-all-around integrated circuit structures having depopulated ch...
- Patent number 12,230,635
- Issue date Feb 18, 2025
- Intel Corporation
- Nicole Thomas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming oxide-nitride-oxide stack of non-volatile memory...
- Patent number 12,232,324
- Issue date Feb 18, 2025
- Infineon Technologies LLC
- Michael Allen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming an oxide volume within a fin
- Patent number 12,224,202
- Issue date Feb 11, 2025
- Intel Corporation
- Cheng-Ying Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device architectures with tensile and compressive strained substrates
- Patent number 12,218,201
- Issue date Feb 4, 2025
- National University of Singapore
- Bich-Yen Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DC bias in plasma process
- Patent number 12,217,936
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sheng-Liang Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device capable of controlling...
- Patent number 12,211,689
- Issue date Jan 28, 2025
- Kokusai Electric Corporation
- Keigo Nishida
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Gate-all-around integrated circuit structures having oxide sub-fins
- Patent number 12,211,925
- Issue date Jan 28, 2025
- Intel Corporation
- Leonard P. Guler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a multi-gate device having a semiconductor...
- Patent number 12,199,170
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei Ju Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus, method of processing substrate, met...
- Patent number 12,195,854
- Issue date Jan 14, 2025
- Kokusai Electric Corporation
- Teruo Yoshino
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Silicon channel tempering
- Patent number 12,199,190
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Mao-Lin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 12,200,937
- Issue date Jan 14, 2025
- SK hynix Inc.
- Moon Sik Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for manufacturing semiconductor...
- Patent number 12,191,142
- Issue date Jan 7, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Kang You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing a receiver substrate for a semiconductor-on-i...
- Patent number 12,183,624
- Issue date Dec 31, 2024
- Soitec
- Marcel Broekaart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench capacitor profile to decrease substrate warpage
- Patent number 12,176,387
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Li Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate-all-around device with trimmed channel and dipoled dielectric...
- Patent number 12,170,231
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Wei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cyclic spin-on coating process for forming dielectric material
- Patent number 12,170,199
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Je-Ming Kuo
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Semiconductor device and method
- Patent number 12,165,929
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Han Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 12,159,925
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ji-Yin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device including isolation st...
- Patent number 12,154,821
- Issue date Nov 26, 2024
- NANYA TECHNOLOGY CORPORATION
- Ying-Cheng Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing method, method of manufacturing semiconductor...
- Patent number 12,148,611
- Issue date Nov 19, 2024
- Kokusai Electric Corporation
- Takaaki Noda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate-all-around structure and methods of forming the same
- Patent number 12,148,836
- Issue date Nov 19, 2024
- Parabellum Strategic Opportunities Fund LLC
- Pei-Hsun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device and a semiconductor...
- Patent number 12,142,533
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chao-Ching Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FinFET device with high-K metal gate stack
- Patent number 12,142,685
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Cheng Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal method to integrate non-volatile memory (NVM) into logic or bi...
- Patent number 12,144,173
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Bo Shu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with patterned fin structure
- Patent number 12,131,901
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shiang-Bau Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing semiconductor structure and semiconductor stru...
- Patent number 12,119,222
- Issue date Oct 15, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Mengmeng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming epitaxial source/drain features in semiconductor...
- Patent number 12,119,378
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jia-Heng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film transistor including a compositionally-graded gate dielec...
- Patent number 12,113,115
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Wu-Wei Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having semiconductor device elements in a semi...
- Patent number 12,107,130
- Issue date Oct 1, 2024
- Infineon Technologies AG
- Ingo Muri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 12,107,151
- Issue date Oct 1, 2024
- United Microelectronics Corp.
- Fu-Jung Chuang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TRENCH CAPACITOR PROFILE TO DECREASE SUBSTRATE WARPAGE
- Publication number 20250063744
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Li Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD
- Publication number 20250054753
- Publication date Feb 13, 2025
- ASM IP HOLDING B.V.
- KiHun Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS OF FORMING ABRUPT INTERFACES BETWEEN SILICON-AND-CARBON-CON...
- Publication number 20250037987
- Publication date Jan 30, 2025
- Applied Materials, Inc.
- Stephen Weeks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE ETCHING BETWEEN SILICON-AND-GERMANIUM-CONTAINING MATERIAL...
- Publication number 20250029841
- Publication date Jan 23, 2025
- Applied Materials, Inc.
- Jiayin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-PRESSURE OXIDATION TREATMENT METHOD AND DEVICE FOR SEMICONDUCTO...
- Publication number 20250014892
- Publication date Jan 9, 2025
- Beijing E-Town Semiconductor Technology Co., Ltd.
- Jianmin JI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR TOPOGRAPHY-SELECTIVE DEPOSITIONS
- Publication number 20250014908
- Publication date Jan 9, 2025
- ASM IP HOLDING, B.V.
- Timothee Blanquart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-PRESSURE WAFER PROCESSING METHOD USING DUAL HIGH-PRESSURE WAFE...
- Publication number 20250014928
- Publication date Jan 9, 2025
- HPSP Co., Ltd.
- Sung Kil CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE DEPOSITION PROCESSES ON SEMICONDUCTOR SUBSTRATES
- Publication number 20250006485
- Publication date Jan 2, 2025
- Applied Materials, Inc.
- Mark Saly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20250006500
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ya-Lan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME
- Publication number 20240429317
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao Po-Kai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240421213
- Publication date Dec 19, 2024
- UNITED MICROELECTRONICS CORP.
- Fu-Jung Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NESTED-LOOP PLASMA ENHANCED ATOMIC LAYER DEPOSITION
- Publication number 20240420952
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Bhaskar Soman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DENSIFIED SEAM-FREE SILICON-CONTAINING MATERIAL GAP FILL PROCESSES
- Publication number 20240420950
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Xiang Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOSHEET TRANSISTOR
- Publication number 20240413224
- Publication date Dec 12, 2024
- Adeia Semiconductor Solutions LLC
- Kangguo Cheng
- B82 - NANO-TECHNOLOGY
Information Patent Application
PLASMA TREATMENT PROCESS TO DENSIFY OXIDE LAYERS
- Publication number 20240404823
- Publication date Dec 5, 2024
- Applied Materials, Inc.
- Jung Chan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240395874
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FinFET Device With High-K Metal Gate Stack
- Publication number 20240387736
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Cheng Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON CHANNEL TEMPERING
- Publication number 20240387745
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Mao-Lin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE-ALL-AROUND STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240379857
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Pei-Hsun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20240379459
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Han Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL SOURCE/DRAIN FEATURES
- Publication number 20240379807
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pei-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A MEOL CONTACT STRUCTURE
- Publication number 20240379768
- Publication date Nov 14, 2024
- Applied Materials, Inc.
- Shumao ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TREATMENTS TO ENHANCE MATERIAL STRUCTURES
- Publication number 20240379349
- Publication date Nov 14, 2024
- Applied Materials, Inc.
- Steven C. H. HUNG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20240371983
- Publication date Nov 7, 2024
- Ji-Yin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING EPITAXIAL SOURCE/DRAIN FEATURES IN SEMICONDUCTOR...
- Publication number 20240371938
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Jia-Heng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Protection Layer Formation during Plasma Etching Conductive Materials
- Publication number 20240371655
- Publication date Nov 7, 2024
- TOKYO ELECTRON LIMITED
- Yen-Tien Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORIFICE SURROUNDED LOW PRESSURE HYDROXYL COMBUSTION
- Publication number 20240360996
- Publication date Oct 31, 2024
- Applied Materials, Inc.
- Christopher S. OLSEN
- C01 - INORGANIC CHEMISTRY
Information Patent Application
LATCH-UP PREVENTION
- Publication number 20240363759
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240363724
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ding-Kang SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM TRANSISTOR INCLUDING A COMPOSITIONALLY-GRADED GATE DIELEC...
- Publication number 20240363716
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Wu-Wei TSAI
- H01 - BASIC ELECTRIC ELEMENTS

formation by oxidation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Gate-all-around integrated circuit structures having depopulated ch...

Method of forming oxide-nitride-oxide stack of non-volatile memory...

Forming an oxide volume within a fin

Device architectures with tensile and compressive strained substrates

DC bias in plasma process

Method of manufacturing semiconductor device capable of controlling...

Gate-all-around integrated circuit structures having oxide sub-fins

Method of manufacturing a multi-gate device having a semiconductor...

Substrate processing apparatus, method of processing substrate, met...

Silicon channel tempering

Semiconductor device and method of manufacturing semiconductor device

Semiconductor structure and method for manufacturing semiconductor...

Process for producing a receiver substrate for a semiconductor-on-i...

Trench capacitor profile to decrease substrate warpage

Gate-all-around device with trimmed channel and dipoled dielectric...

Cyclic spin-on coating process for forming dielectric material

Semiconductor device and method

Semiconductor device and method

Method of manufacturing semiconductor device including isolation st...

Substrate processing method, method of manufacturing semiconductor...

Gate-all-around structure and methods of forming the same

Method of manufacturing a semiconductor device and a semiconductor...

FinFET device with high-K metal gate stack

Seal method to integrate non-volatile memory (NVM) into logic or bi...

Semiconductor structure with patterned fin structure

Method for preparing semiconductor structure and semiconductor stru...

Methods of forming epitaxial source/drain features in semiconductor...

Thin film transistor including a compositionally-graded gate dielec...

Semiconductor device having semiconductor device elements in a semi...

Semiconductor device and method for fabricating the same

Patents Applicationslast 30 patents

TRENCH CAPACITOR PROFILE TO DECREASE SUBSTRATE WARPAGE

SUBSTRATE PROCESSING METHOD

METHODS OF FORMING ABRUPT INTERFACES BETWEEN SILICON-AND-CARBON-CON...

SELECTIVE ETCHING BETWEEN SILICON-AND-GERMANIUM-CONTAINING MATERIAL...

LOW-PRESSURE OXIDATION TREATMENT METHOD AND DEVICE FOR SEMICONDUCTO...

METHODS AND SYSTEMS FOR TOPOGRAPHY-SELECTIVE DEPOSITIONS

HIGH-PRESSURE WAFER PROCESSING METHOD USING DUAL HIGH-PRESSURE WAFE...

SELECTIVE DEPOSITION PROCESSES ON SEMICONDUCTOR SUBSTRATES

SEMICONDUCTOR DEVICE AND METHOD

SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

NESTED-LOOP PLASMA ENHANCED ATOMIC LAYER DEPOSITION

DENSIFIED SEAM-FREE SILICON-CONTAINING MATERIAL GAP FILL PROCESSES

NANOSHEET TRANSISTOR

PLASMA TREATMENT PROCESS TO DENSIFY OXIDE LAYERS

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

FinFET Device With High-K Metal Gate Stack

SILICON CHANNEL TEMPERING

GATE-ALL-AROUND STRUCTURE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICES

METAL SOURCE/DRAIN FEATURES

METHOD OF FORMING A MEOL CONTACT STRUCTURE

TREATMENTS TO ENHANCE MATERIAL STRUCTURES

SEMICONDUCTOR DEVICES

METHODS OF FORMING EPITAXIAL SOURCE/DRAIN FEATURES IN SEMICONDUCTOR...

Protection Layer Formation during Plasma Etching Conductive Materials

ORIFICE SURROUNDED LOW PRESSURE HYDROXYL COMBUSTION

LATCH-UP PREVENTION

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

THIN FILM TRANSISTOR INCLUDING A COMPOSITIONALLY-GRADED GATE DIELEC...