formation by oxidation

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H01L21/0223

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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H01L21/0223formation by oxidation

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Patents Grantslast 30 patents

Information Patent Grant
Method of processing substrate, method of manufacturing semiconduct...
- Patent number 12,288,684
- Issue date Apr 29, 2025
- Kokusai Electric Corporation
- Katsuyoshi Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device, substrate processing...
- Patent number 12,283,476
- Issue date Apr 22, 2025
- Kokusai Electric Corporation
- Hiroshi Ashihara
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Dual pressure oxidation method for forming an oxide layer in a feature
- Patent number 12,272,531
- Issue date Apr 8, 2025
- Applied Materials, Inc.
- Christopher S. Olsen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Oxide-nitride-oxide stack having multiple oxynitride layers
- Patent number 12,266,521
- Issue date Apr 1, 2025
- LONGITUDE FLASH MEMORY SOLUTIONS LTD.
- Sagy Charel Levy
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 12,261,198
- Issue date Mar 25, 2025
- SK Hynix Inc.
- Jun Hyuk Seo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor devices and methods of manufacturing the same
- Patent number 12,261,220
- Issue date Mar 25, 2025
- Samsung Electronics Co., Ltd.
- Woocheol Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Source-body self-aligned method of a vertical double diffused metal...
- Patent number 12,256,559
- Issue date Mar 18, 2025
- NATIONAL YANG MING CHIAO TUNG UNIVERSITY
- Bing-Yue Tsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device, substrate processing...
- Patent number 12,249,502
- Issue date Mar 11, 2025
- Kokusai Electric Corporation
- Kazuki Nonomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device, substrate processing...
- Patent number 12,249,503
- Issue date Mar 11, 2025
- Kokusai Electric Corporation
- Kiyohisa Ishibashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conformal oxidation for gate all around nanosheet I/O device
- Patent number 12,243,941
- Issue date Mar 4, 2025
- Applied Materials, Inc.
- Myungsun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate-all-around integrated circuit structures having depopulated ch...
- Patent number 12,230,635
- Issue date Feb 18, 2025
- Intel Corporation
- Nicole Thomas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming oxide-nitride-oxide stack of non-volatile memory...
- Patent number 12,232,324
- Issue date Feb 18, 2025
- Infineon Technologies LLC
- Michael Allen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming an oxide volume within a fin
- Patent number 12,224,202
- Issue date Feb 11, 2025
- Intel Corporation
- Cheng-Ying Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device architectures with tensile and compressive strained substrates
- Patent number 12,218,201
- Issue date Feb 4, 2025
- National University of Singapore
- Bich-Yen Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DC bias in plasma process
- Patent number 12,217,936
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sheng-Liang Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device capable of controlling...
- Patent number 12,211,689
- Issue date Jan 28, 2025
- Kokusai Electric Corporation
- Keigo Nishida
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Gate-all-around integrated circuit structures having oxide sub-fins
- Patent number 12,211,925
- Issue date Jan 28, 2025
- Intel Corporation
- Leonard P. Guler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a multi-gate device having a semiconductor...
- Patent number 12,199,170
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei Ju Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus, method of processing substrate, met...
- Patent number 12,195,854
- Issue date Jan 14, 2025
- Kokusai Electric Corporation
- Teruo Yoshino
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Silicon channel tempering
- Patent number 12,199,190
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Mao-Lin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 12,200,937
- Issue date Jan 14, 2025
- SK hynix Inc.
- Moon Sik Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for manufacturing semiconductor...
- Patent number 12,191,142
- Issue date Jan 7, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Kang You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing a receiver substrate for a semiconductor-on-i...
- Patent number 12,183,624
- Issue date Dec 31, 2024
- Soitec
- Marcel Broekaart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench capacitor profile to decrease substrate warpage
- Patent number 12,176,387
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Li Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate-all-around device with trimmed channel and dipoled dielectric...
- Patent number 12,170,231
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Wei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cyclic spin-on coating process for forming dielectric material
- Patent number 12,170,199
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Je-Ming Kuo
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Semiconductor device and method
- Patent number 12,165,929
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Han Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 12,159,925
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ji-Yin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device including isolation st...
- Patent number 12,154,821
- Issue date Nov 26, 2024
- NANYA TECHNOLOGY CORPORATION
- Ying-Cheng Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing method, method of manufacturing semiconductor...
- Patent number 12,148,611
- Issue date Nov 19, 2024
- Kokusai Electric Corporation
- Takaaki Noda
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE HAVING A TRENCH FIELD ELECTRODE WITH A FIRST S...
- Publication number 20250151321
- Publication date May 8, 2025
- Infineon Technologies Austria AG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-GATE DEVICES AND METHOD OF FABRICATION THEREOF
- Publication number 20250151305
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Co., LTD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD FOR FILLING ONE OR MORE GAPS ON A SURFA...
- Publication number 20250125142
- Publication date Apr 17, 2025
- ASM IP HOLDING B.V.
- SangHeon Yong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE CAPABLE OF CONTROLLING...
- Publication number 20250125143
- Publication date Apr 17, 2025
- Kokusai Electric Corporation
- Keigo NISHIDA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF BONDING MULTIPLE COPPER ELEMENTS AND METHOD OF BONDING MU...
- Publication number 20250125185
- Publication date Apr 17, 2025
- National Cheng Kung University
- Shih-kang LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE CAPABLE OF CONTROLLING...
- Publication number 20250118549
- Publication date Apr 10, 2025
- Kokusai Electric Corporation
- Keigo NISHIDA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING OXIDE SUB-FINS
- Publication number 20250120152
- Publication date Apr 10, 2025
- Intel Corporation
- Leonard P. GULER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE-ALL-AROUND DEVICE WITH TRIMMED CHANNEL AND DIPOLED DIELECTRIC...
- Publication number 20250120166
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Wei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D DRAM WITH ENLARGE-LESS TRIM
- Publication number 20250120061
- Publication date Apr 10, 2025
- Applied Materials, Inc.
- Chang Seok Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A POWER SEMICONDUCTOR COMPONENT HAVING A PLURA...
- Publication number 20250113514
- Publication date Apr 3, 2025
- ROBERT BOSCH GmbH
- Daniel Krebs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE ETCHING OF SILICON-AND-GERMANIUM-CONTAINING MATERIALS WIT...
- Publication number 20250112051
- Publication date Apr 3, 2025
- Applied Materials, Inc.
- Jiayin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH PRESSURE GASEOUS HYDROGEN OXIDE PROVIDING DEVICE, AND HIGH PRE...
- Publication number 20250105027
- Publication date Mar 27, 2025
- HPSP Co., Ltd.
- Si Hyung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATION FILM MANUFACTURING METHOD OF SEMICONDUCTOR PROCESS
- Publication number 20250105003
- Publication date Mar 27, 2025
- HPSP Co., Ltd.
- Sung Kil CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250107091
- Publication date Mar 27, 2025
- SK HYNIX INC.
- Moon Sik SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON CARBIDE POWER MOSFET AND METHOD FOR MANUFACTURING SAME
- Publication number 20250107194
- Publication date Mar 27, 2025
- MICROCHIP TECHNOLOGY INCORPORATED
- Shesh Mani Pandey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE ARCHITECTURES WITH TENSILE AND COMPRESSIVE STRAINED SUBSTRATES
- Publication number 20250081561
- Publication date Mar 6, 2025
- SOITEC
- Bich-Yen Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH CAPACITOR PROFILE TO DECREASE SUBSTRATE WARPAGE
- Publication number 20250063744
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Li Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD
- Publication number 20250054753
- Publication date Feb 13, 2025
- ASM IP HOLDING B.V.
- KiHun Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS OF FORMING ABRUPT INTERFACES BETWEEN SILICON-AND-CARBON-CON...
- Publication number 20250037987
- Publication date Jan 30, 2025
- Applied Materials, Inc.
- Stephen Weeks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE ETCHING BETWEEN SILICON-AND-GERMANIUM-CONTAINING MATERIAL...
- Publication number 20250029841
- Publication date Jan 23, 2025
- Applied Materials, Inc.
- Jiayin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-PRESSURE OXIDATION TREATMENT METHOD AND DEVICE FOR SEMICONDUCTO...
- Publication number 20250014892
- Publication date Jan 9, 2025
- Beijing E-Town Semiconductor Technology Co., Ltd.
- Jianmin JI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR TOPOGRAPHY-SELECTIVE DEPOSITIONS
- Publication number 20250014908
- Publication date Jan 9, 2025
- ASM IP HOLDING, B.V.
- Timothee Blanquart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-PRESSURE WAFER PROCESSING METHOD USING DUAL HIGH-PRESSURE WAFE...
- Publication number 20250014928
- Publication date Jan 9, 2025
- HPSP Co., Ltd.
- Sung Kil CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE DEPOSITION PROCESSES ON SEMICONDUCTOR SUBSTRATES
- Publication number 20250006485
- Publication date Jan 2, 2025
- Applied Materials, Inc.
- Mark Saly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20250006500
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ya-Lan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME
- Publication number 20240429317
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao Po-Kai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240421213
- Publication date Dec 19, 2024
- UNITED MICROELECTRONICS CORP.
- Fu-Jung Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NESTED-LOOP PLASMA ENHANCED ATOMIC LAYER DEPOSITION
- Publication number 20240420952
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Bhaskar Soman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DENSIFIED SEAM-FREE SILICON-CONTAINING MATERIAL GAP FILL PROCESSES
- Publication number 20240420950
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Xiang Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOSHEET TRANSISTOR
- Publication number 20240413224
- Publication date Dec 12, 2024
- Adeia Semiconductor Solutions LLC
- Kangguo Cheng
- B82 - NANO-TECHNOLOGY

formation by oxidation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of processing substrate, method of manufacturing semiconduct...

Method of manufacturing semiconductor device, substrate processing...

Dual pressure oxidation method for forming an oxide layer in a feature

Oxide-nitride-oxide stack having multiple oxynitride layers

Semiconductor device and method for fabricating the same

Semiconductor devices and methods of manufacturing the same

Source-body self-aligned method of a vertical double diffused metal...

Method of manufacturing semiconductor device, substrate processing...

Method of manufacturing semiconductor device, substrate processing...

Conformal oxidation for gate all around nanosheet I/O device

Gate-all-around integrated circuit structures having depopulated ch...

Method of forming oxide-nitride-oxide stack of non-volatile memory...

Forming an oxide volume within a fin

Device architectures with tensile and compressive strained substrates

DC bias in plasma process

Method of manufacturing semiconductor device capable of controlling...

Gate-all-around integrated circuit structures having oxide sub-fins

Method of manufacturing a multi-gate device having a semiconductor...

Substrate processing apparatus, method of processing substrate, met...

Silicon channel tempering

Semiconductor device and method of manufacturing semiconductor device

Semiconductor structure and method for manufacturing semiconductor...

Process for producing a receiver substrate for a semiconductor-on-i...

Trench capacitor profile to decrease substrate warpage

Gate-all-around device with trimmed channel and dipoled dielectric...

Cyclic spin-on coating process for forming dielectric material

Semiconductor device and method

Semiconductor device and method

Method of manufacturing semiconductor device including isolation st...

Substrate processing method, method of manufacturing semiconductor...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE HAVING A TRENCH FIELD ELECTRODE WITH A FIRST S...

MULTI-GATE DEVICES AND METHOD OF FABRICATION THEREOF

SUBSTRATE PROCESSING METHOD FOR FILLING ONE OR MORE GAPS ON A SURFA...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE CAPABLE OF CONTROLLING...

METHOD OF BONDING MULTIPLE COPPER ELEMENTS AND METHOD OF BONDING MU...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE CAPABLE OF CONTROLLING...

GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING OXIDE SUB-FINS

GATE-ALL-AROUND DEVICE WITH TRIMMED CHANNEL AND DIPOLED DIELECTRIC...

3D DRAM WITH ENLARGE-LESS TRIM

METHOD FOR PRODUCING A POWER SEMICONDUCTOR COMPONENT HAVING A PLURA...

SELECTIVE ETCHING OF SILICON-AND-GERMANIUM-CONTAINING MATERIALS WIT...

HIGH PRESSURE GASEOUS HYDROGEN OXIDE PROVIDING DEVICE, AND HIGH PRE...

INSULATION FILM MANUFACTURING METHOD OF SEMICONDUCTOR PROCESS

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SILICON CARBIDE POWER MOSFET AND METHOD FOR MANUFACTURING SAME

DEVICE ARCHITECTURES WITH TENSILE AND COMPRESSIVE STRAINED SUBSTRATES

TRENCH CAPACITOR PROFILE TO DECREASE SUBSTRATE WARPAGE

SUBSTRATE PROCESSING METHOD

METHODS OF FORMING ABRUPT INTERFACES BETWEEN SILICON-AND-CARBON-CON...

SELECTIVE ETCHING BETWEEN SILICON-AND-GERMANIUM-CONTAINING MATERIAL...

LOW-PRESSURE OXIDATION TREATMENT METHOD AND DEVICE FOR SEMICONDUCTO...

METHODS AND SYSTEMS FOR TOPOGRAPHY-SELECTIVE DEPOSITIONS

HIGH-PRESSURE WAFER PROCESSING METHOD USING DUAL HIGH-PRESSURE WAFE...

SELECTIVE DEPOSITION PROCESSES ON SEMICONDUCTOR SUBSTRATES

SEMICONDUCTOR DEVICE AND METHOD

SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

NESTED-LOOP PLASMA ENHANCED ATOMIC LAYER DEPOSITION

DENSIFIED SEAM-FREE SILICON-CONTAINING MATERIAL GAP FILL PROCESSES

NANOSHEET TRANSISTOR