Formation of intermetallics

Industry

CPC
H01L2924/3651

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/3651Formation of intermetallics

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 11,887,957
- Issue date Jan 30, 2024
- Samsung Electronics Co., Ltd.
- Jubin Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromigration resistant and profile consistent contact arrays
- Patent number 11,699,648
- Issue date Jul 11, 2023
- Tahoe Research, LTD.
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,538,782
- Issue date Dec 27, 2022
- Samsung Electronics Co., Ltd.
- Jubin Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting structure and nanoparticle mounting material
- Patent number 11,515,280
- Issue date Nov 29, 2022
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Kiyohiro Hine
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Electromigration resistant and profile consistent contact arrays
- Patent number 11,309,239
- Issue date Apr 19, 2022
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Designs and methods for conductive bumps
- Patent number 11,201,129
- Issue date Dec 14, 2021
- Intel Corporation
- Valery M. Dubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Collars for under-bump metal structures and associated systems and...
- Patent number 10,886,244
- Issue date Jan 5, 2021
- Micron Technology, Inc.
- Giorgio Mariottini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromigration resistant and profile consistent contact arrays
- Patent number 10,854,541
- Issue date Dec 1, 2020
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,651,038
- Issue date May 12, 2020
- Shindengen Electric Manufacturing Co., Ltd.
- Yusuke Fukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Expanded head pillar for bump bonds
- Patent number 10,636,758
- Issue date Apr 28, 2020
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromigration resistant and profile consistent contact arrays
- Patent number 10,431,537
- Issue date Oct 1, 2019
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier layer for interconnects in 3D integrated device
- Patent number 10,354,975
- Issue date Jul 16, 2019
- Raytheon Company
- Edward R. Soares
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 10,312,211
- Issue date Jun 4, 2019
- Toyota Jidosha Kabushiki Kaisha
- Takuya Kadoguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for 3D ink jet TCB interconnect control
- Patent number 10,276,539
- Issue date Apr 30, 2019
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die bond pad with insulating separator
- Patent number 10,249,583
- Issue date Apr 2, 2019
- Infineon Technologies AG
- Christian Bretthauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Designs and methods for conductive bumps
- Patent number 10,249,588
- Issue date Apr 2, 2019
- Intel Corporation
- Valery M. Dubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with sacrificial anode and method for forming
- Patent number 10,199,339
- Issue date Feb 5, 2019
- NXP USA, INC.
- Sheila F. Chopin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of embedding WLCSP components in E-WLB and E-PLB
- Patent number 10,147,710
- Issue date Dec 4, 2018
- Intel Corporation
- Vijay K. Nair
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of embedding WLCSP components in e-WLB and e-PLB
- Patent number 9,991,239
- Issue date Jun 5, 2018
- Intel Corporation
- Vijay K. Nair
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper pillar sidewall protection
- Patent number 9,875,980
- Issue date Jan 23, 2018
- Amkor Technology, Inc.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Au-based solder die attachment semiconductor device and method for...
- Patent number 9,698,082
- Issue date Jul 4, 2017
- Nissan Motor Co., Ltd.
- Satoshi Tanimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump electrode, board which has bump electrodes, and method for man...
- Patent number 9,662,730
- Issue date May 30, 2017
- Senju Metal Industry Co., Ltd.
- Takahiro Hattori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Direct die solder of gallium arsenide integrated circuit dies and m...
- Patent number 9,530,719
- Issue date Dec 27, 2016
- Skyworks Solutions, Inc.
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroconductive microparticles, anisotropic electroconductive mat...
- Patent number 9,478,326
- Issue date Oct 25, 2016
- Sekisui Chemical Co., Ltd.
- Hiroya Ishida
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stud bump and package structure thereof and method of manufacturing...
- Patent number 9,425,168
- Issue date Aug 23, 2016
- Wire Technology Co., Ltd.
- Tung-Han Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on package devices and methods of packaging semiconductor dies
- Patent number 9,397,080
- Issue date Jul 19, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Lei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 9,391,036
- Issue date Jul 12, 2016
- Sony Corporation
- Katsuji Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-conductive film and non-conductive paste including zinc particl...
- Patent number 9,376,541
- Issue date Jun 28, 2016
- Samsung Electronics Co., Ltd.
- Un-byoung Kang
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Solder ball for semiconductor packaging and electronic member using...
- Patent number 9,024,442
- Issue date May 5, 2015
- Nippon Steel & Sumikin Materials Co., Ltd.
- Shinichi Terashima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electric connecting structure comprising preferred oriented Cu6Sn5...
- Patent number 8,952,267
- Issue date Feb 10, 2015
- National Chiao Tung University
- Chih Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20240290743
- Publication date Aug 29, 2024
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- G01 - MEASURING TESTING
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20240290745
- Publication date Aug 29, 2024
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- G01 - MEASURING TESTING
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240038698
- Publication date Feb 1, 2024
- Advanced Semiconductor Engineering, Inc.
- Erh-Ju LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PACKAGING
- Publication number 20230110402
- Publication date Apr 13, 2023
- NXP USA, Inc.
- YOU GE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230108516
- Publication date Apr 6, 2023
- Samsung Electronics Co., Ltd.
- JUBIN SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER MATERIAL, LAYER STRUCTURE, CHIP PACKAGE, METHOD OF FORMING A...
- Publication number 20230095749
- Publication date Mar 30, 2023
- Alexander Heinrich
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROMIGRATION RESISTANT AND PROFILE CONSISTENT CONTACT ARRAYS
- Publication number 20220199515
- Publication date Jun 23, 2022
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DESIGNS AND METHODS FOR CONDUCTIVE BUMPS
- Publication number 20220059484
- Publication date Feb 24, 2022
- Intel Corporation
- Valery M. DUBIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210320077
- Publication date Oct 14, 2021
- Samsung Electronics Co., Ltd.
- JUBIN SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COLLARS FOR UNDER-BUMP METAL STRUCTURES AND ASSOCIATED SYSTEMS AND...
- Publication number 20210151400
- Publication date May 20, 2021
- Micron Technology, Inc.
- Giorgio Mariottini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMIGRATION RESISTANT AND PROFILE CONSISTENT CONTACT ARRAYS
- Publication number 20210035901
- Publication date Feb 4, 2021
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPANDED HEAD PILLAR FOR BUMP BONDS
- Publication number 20200258856
- Publication date Aug 13, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING STRUCTURE AND NANOPARTICLE MOUNTING MATERIAL
- Publication number 20200185347
- Publication date Jun 11, 2020
- Panasonic Intellectual Property Management Co., Ltd.
- KIYOHIRO HINE
- B22 - CASTING POWDER METALLURGY
Information Patent Application
ELECTROMIGRATION RESISTANT AND PROFILE CONSISTENT CONTACT ARRAYS
- Publication number 20190393145
- Publication date Dec 26, 2019
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DESIGNS AND METHODS FOR CONDUCTIVE BUMPS
- Publication number 20190198472
- Publication date Jun 27, 2019
- Intel Corporation
- Valery M. DUBIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for 3D Ink Jet TCB Interconnect Control
- Publication number 20190131272
- Publication date May 2, 2019
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF EMBEDDING WLCSP COMPONENTS IN E-WLB AND E-PLB
- Publication number 20180269190
- Publication date Sep 20, 2018
- Intel Corporation
- Vijay K. NAIR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure With Sacrificial Anode and Method for Forming
- Publication number 20160329288
- Publication date Nov 10, 2016
- FREESCALE SEMICONDUCTOR, INC.
- SHEILA F. CHOPIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF EMBEDDING WLCSP COMPONENTS IN E-WLB AND E-PLB
- Publication number 20160276325
- Publication date Sep 22, 2016
- Intel Corporation
- Vijay K. NAIR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING METHOD WITH TWO STEP FREE AIR BALL FORMATION
- Publication number 20150235981
- Publication date Aug 20, 2015
- Poh Leng Eu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20140361431
- Publication date Dec 11, 2014
- SONY CORPORATION
- Katsuji Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PILLAR ON PAD INTERCONNECT STRUCTURES, SEMICONDUCTOR DEVICES INCLUD...
- Publication number 20140167259
- Publication date Jun 19, 2014
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT ASSEMBLIES AND METHODS OF MAKING AND USING SAME
- Publication number 20140145328
- Publication date May 29, 2014
- Georgia Tech Research Corporation
- Rao Tummala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTING ELEMENT HAVING NANO-TWINNED COPPER, METHOD OF...
- Publication number 20140090880
- Publication date Apr 3, 2014
- NATIONAL CHIAO-TUNG UNIVERSITY
- Chih CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE FOR SEMICONDUCTOR PACKAGE
- Publication number 20140061928
- Publication date Mar 6, 2014
- Siliconware Precision Industries Co., Ltd.
- Chang-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A METAL PAD STRUCTURE OF A DIE, A METHOD F...
- Publication number 20140054800
- Publication date Feb 27, 2014
- INFINEON TECHNOLOGIES AG
- Johann Gatterbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PILLAR ON PAD INTERCONNECT STRUCTURES, SEMICONDUCTOR DICE AND DIE A...
- Publication number 20140015124
- Publication date Jan 16, 2014
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package on Package Devices and Methods of Packaging Semiconductor Dies
- Publication number 20130341786
- Publication date Dec 26, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Lei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electric connecting structure comprising preferred oriented Cu6Sn5...
- Publication number 20130302646
- Publication date Nov 14, 2013
- NATIONAL CHIAO-TUNG UNIVERSITY
- Chih CHEN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20130237016
- Publication date Sep 12, 2013
- Fuji Electric Co., Ltd.
- Kyohei FUKUDA
- H01 - BASIC ELECTRIC ELEMENTS

Formation of intermetallics

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Electromigration resistant and profile consistent contact arrays

Semiconductor device

Mounting structure and nanoparticle mounting material

Electromigration resistant and profile consistent contact arrays

Designs and methods for conductive bumps

Collars for under-bump metal structures and associated systems and...

Electromigration resistant and profile consistent contact arrays

Semiconductor device

Expanded head pillar for bump bonds

Electromigration resistant and profile consistent contact arrays

Barrier layer for interconnects in 3D integrated device

Method of manufacturing semiconductor device

Method for 3D ink jet TCB interconnect control

Semiconductor die bond pad with insulating separator

Designs and methods for conductive bumps

Semiconductor structure with sacrificial anode and method for forming

Method of embedding WLCSP components in E-WLB and E-PLB

Method of embedding WLCSP components in e-WLB and e-PLB

Copper pillar sidewall protection

Au-based solder die attachment semiconductor device and method for...

Bump electrode, board which has bump electrodes, and method for man...

Direct die solder of gallium arsenide integrated circuit dies and m...

Electroconductive microparticles, anisotropic electroconductive mat...

Stud bump and package structure thereof and method of manufacturing...

Package on package devices and methods of packaging semiconductor dies

Semiconductor device and manufacturing method thereof

Non-conductive film and non-conductive paste including zinc particl...

Solder ball for semiconductor packaging and electronic member using...

Electric connecting structure comprising preferred oriented Cu6Sn5...

Patents Applicationslast 30 patents

BONDING WIRE FOR SEMICONDUCTOR DEVICES

BONDING WIRE FOR SEMICONDUCTOR DEVICES

PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD FOR PACKAGING

SEMICONDUCTOR DEVICE

SOLDER MATERIAL, LAYER STRUCTURE, CHIP PACKAGE, METHOD OF FORMING A...

ELECTROMIGRATION RESISTANT AND PROFILE CONSISTENT CONTACT ARRAYS

DESIGNS AND METHODS FOR CONDUCTIVE BUMPS

SEMICONDUCTOR DEVICE

COLLARS FOR UNDER-BUMP METAL STRUCTURES AND ASSOCIATED SYSTEMS AND...

ELECTROMIGRATION RESISTANT AND PROFILE CONSISTENT CONTACT ARRAYS

EXPANDED HEAD PILLAR FOR BUMP BONDS

MOUNTING STRUCTURE AND NANOPARTICLE MOUNTING MATERIAL

ELECTROMIGRATION RESISTANT AND PROFILE CONSISTENT CONTACT ARRAYS

DESIGNS AND METHODS FOR CONDUCTIVE BUMPS

Method for 3D Ink Jet TCB Interconnect Control

METHOD OF EMBEDDING WLCSP COMPONENTS IN E-WLB AND E-PLB

Semiconductor Structure With Sacrificial Anode and Method for Forming

METHOD OF EMBEDDING WLCSP COMPONENTS IN E-WLB AND E-PLB

WIRE BONDING METHOD WITH TWO STEP FREE AIR BALL FORMATION

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

PILLAR ON PAD INTERCONNECT STRUCTURES, SEMICONDUCTOR DEVICES INCLUD...

INTERCONNECT ASSEMBLIES AND METHODS OF MAKING AND USING SAME

ELECTRICAL CONNECTING ELEMENT HAVING NANO-TWINNED COPPER, METHOD OF...

INTERCONNECTION STRUCTURE FOR SEMICONDUCTOR PACKAGE

METHOD FOR MANUFACTURING A METAL PAD STRUCTURE OF A DIE, A METHOD F...

PILLAR ON PAD INTERCONNECT STRUCTURES, SEMICONDUCTOR DICE AND DIE A...

Package on Package Devices and Methods of Packaging Semiconductor Dies

Electric connecting structure comprising preferred oriented Cu6Sn5...

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD