Formation of self-aligned vias or contact plugs

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H01L21/76897

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76897Formation of self-aligned vias or contact plugs

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and a method for fabricating the same
- Patent number 12,211,845
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiang-Ku Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked vias with bottom portions formed using selective growth
- Patent number 12,211,786
- Issue date Jan 28, 2025
- Intel Corporation
- Andy Chih-Hung Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field effect transistors comprising a matrix of gate-all-around cha...
- Patent number 12,211,848
- Issue date Jan 28, 2025
- International Business Machines Corporation
- Julien Frougier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having interconnection lines with different li...
- Patent number 12,199,042
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Wonhyuk Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate line plug structures for advanced integrated circuit structure...
- Patent number 12,199,167
- Issue date Jan 14, 2025
- Intel Corporation
- Byron Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure, circuit and electronic apparatus includi...
- Patent number 12,199,031
- Issue date Jan 14, 2025
- Institute of Microelectronics, Chinese Academy of Sciences
- Huilong Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned gate endcap (SAGE) architecture having gate contacts
- Patent number 12,199,101
- Issue date Jan 14, 2025
- Intel Corporation
- Sairam Subramanian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and fabrication method thereof
- Patent number 12,199,155
- Issue date Jan 14, 2025
- Semiconductor Manufacturing International (Shanghai) Corporation
- Wufeng Deng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 12,198,930
- Issue date Jan 14, 2025
- Institute of Microelectronics, Chinese Academy of Sciences
- Libin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plugs for interconnect lines for advanced integrated circuit struct...
- Patent number 12,199,168
- Issue date Jan 14, 2025
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device and a semiconductor...
- Patent number 12,191,304
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tung Ying Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor device and semiconductor device
- Patent number 12,193,212
- Issue date Jan 7, 2025
- CHANIGXIN MEMORY TECHNOLOGIES, INC.
- Feng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact openings in semiconductor devices
- Patent number 12,191,202
- Issue date Jan 7, 2025
- Tokyo Electron Limited
- Blaze Messer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric cap structure in semiconductor devices and methods of ma...
- Patent number 12,183,633
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Te-Chih Hsiung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective recessing to form a fully aligned via
- Patent number 12,183,634
- Issue date Dec 31, 2024
- Adeia Semiconductor Solutions LLC
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with air gap on gate structure and method for...
- Patent number 12,183,784
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tien-Lu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming fin field effect transistor (FinFET) device stru...
- Patent number 12,176,435
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chao-Hsun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for fabricating semiconductor structures
- Patent number 12,170,205
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Nien Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 12,165,920
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hwei-Jay Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Graphene/nanostructure FET with self-aligned contact and gate
- Patent number 12,166,106
- Issue date Dec 10, 2024
- International Business Machines Corporation
- Jeffrey W. Sleight
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Semiconductor structure with buried power rail, integrated circuit...
- Patent number 12,165,927
- Issue date Dec 10, 2024
- Mediatek Inc.
- Po-Chao Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method for fabricating the same
- Patent number 12,166,038
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shun-Jang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure and manufacturing method thereof
- Patent number 12,154,852
- Issue date Nov 26, 2024
- United Microelectronics Corp.
- Min-Shiang Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned patterning with colored blocking and structures result...
- Patent number 12,154,855
- Issue date Nov 26, 2024
- Intel Corporation
- Mohit K. Haran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing via structures on source/drain contacts
- Patent number 12,154,856
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Chiang Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,154,902
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yuan Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tiered-profile contact for semiconductor
- Patent number 12,148,663
- Issue date Nov 19, 2024
- International Business Machines Corporation
- Kisik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method for fabricating the same
- Patent number 12,148,831
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FinFET structure having a gate contact above a metal gate and strad...
- Patent number 12,148,834
- Issue date Nov 19, 2024
- Huawei Technologies Co., Ltd.
- Xinfang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,148,701
- Issue date Nov 19, 2024
- Samsung Electronics Co., Ltd.
- Hongsik Shin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ISOLATION MODULE FOR BACKSIDE POWER DELIVERY
- Publication number 20250040170
- Publication date Jan 30, 2025
- Applied Materials, Inc.
- Veeraraghavan S. BASKER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBTRACTIVE PLUG AND TAB PATTERNING WITH PHOTOBUCKETS FOR BACK END...
- Publication number 20250029876
- Publication date Jan 23, 2025
- Tahoe Research, Ltd.
- Kevin LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING STACKED TRENCH CONTACTS AND STRUCTURES FORMED THE...
- Publication number 20250029926
- Publication date Jan 23, 2025
- Intel Corporation
- Bernhard SELL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED GATE ENDCAP (SAGE) ARCHITECTURE HAVING GATE CONTACTS
- Publication number 20250022881
- Publication date Jan 16, 2025
- Intel Corporation
- Sairam Subramanian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED GATE ENDCAP (SAGE) ARCHITECTURES WITH REDUCED CAP
- Publication number 20250022936
- Publication date Jan 16, 2025
- Intel Corporation
- Seung Hoon SUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT OVER ACTIVE GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT...
- Publication number 20250022939
- Publication date Jan 16, 2025
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE LOCAL INTERCONNECT
- Publication number 20250022795
- Publication date Jan 16, 2025
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD FOR FABRICATING THE SAME
- Publication number 20250015185
- Publication date Jan 9, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Lien HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE SUPPRESSING LEAKAGE CURRENT...
- Publication number 20250014998
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- JUNGHOO SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED NANOMETER THROUGH-SILICON-VIA STRUCTURE AND METHOD OF...
- Publication number 20250006556
- Publication date Jan 2, 2025
- Institute of Microelectronics, Chinese Academy of Sciences
- Xianyu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20250006551
- Publication date Jan 2, 2025
- NANYA TECHNOLOGY CORPORATION
- Chiang-Lin SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE CUT OF SELF-ALIGNED CONTACT POST REPLACEMENT METAL GATE
- Publication number 20240429096
- Publication date Dec 26, 2024
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MERGED SELF-ALIGNED BACKSIDE CONTACT
- Publication number 20240429098
- Publication date Dec 26, 2024
- International Business Machines Corporation
- Albert M. Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED BACKSIDE CONTACT
- Publication number 20240429097
- Publication date Dec 26, 2024
- International Business Machines Corporation
- Tao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO CREATE AIR GAPS
- Publication number 20240429091
- Publication date Dec 26, 2024
- LAM RESEARCH CORPORATION
- Patrick A. Van Cleemput
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE CONTACT MITIGATING CONTACT TO GATE SHORT
- Publication number 20240429103
- Publication date Dec 26, 2024
- International Business Machines Corporation
- Tao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR SEMICONDUCTOR DEVICE HAVING GATE SPACER PR...
- Publication number 20240412975
- Publication date Dec 12, 2024
- Parabellum Strategic Opportunities Fund LLC
- Chih Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240414909
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- Sohyun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED BACKSIDE CONTACT WITH PROTRUDING SOURCE/DRAIN
- Publication number 20240413201
- Publication date Dec 12, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING LOW-K METAL GATE ISOLATION AND METH...
- Publication number 20240404882
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Tsung WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED BUILD-UP PROCESSING
- Publication number 20240404828
- Publication date Dec 5, 2024
- Geminatio, Inc.
- Brennan Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20240405086
- Publication date Dec 5, 2024
- Fujian Jinhua Integrated Circuit Co., Ltd.
- Chi-Ren Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR MEMORY DEVICE
- Publication number 20240395605
- Publication date Nov 28, 2024
- Fujian Jinhua Integrated Circuit Co., Ltd.
- Janbo Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240395811
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yuan LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY ARRAY CIRCUIT
- Publication number 20240395668
- Publication date Nov 28, 2024
- Invention And Collaboration Laboratory, Inc.
- Chun Shiah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEHTOD OF MAKING SEMICONDUCTOR DEVICE HAVING SELF-ALIGNED INTERCONN...
- Publication number 20240395671
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Yu LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE
- Publication number 20240387260
- Publication date Nov 21, 2024
- NANYA TECHNOLOGY CORPORATION
- Cheng Yan JI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT PLUG
- Publication number 20240387267
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hsuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECESSED CONTACTS AT LINE END AND METHODS FORMING SAME
- Publication number 20240387266
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Te-Chih Hsiung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
2D-Channel Transistor Structure with Asymmetric Substrate Contacts
- Publication number 20240387657
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Ting Chung
- H01 - BASIC ELECTRIC ELEMENTS

Formation of self-aligned vias or contact plugs

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and a method for fabricating the same

Stacked vias with bottom portions formed using selective growth

Field effect transistors comprising a matrix of gate-all-around cha...

Semiconductor device having interconnection lines with different li...

Gate line plug structures for advanced integrated circuit structure...

Interconnection structure, circuit and electronic apparatus includi...

Self-aligned gate endcap (SAGE) architecture having gate contacts

Semiconductor structure and fabrication method thereof

Method for manufacturing semiconductor device

Plugs for interconnect lines for advanced integrated circuit struct...

Method of manufacturing a semiconductor device and a semiconductor...

Method of forming semiconductor device and semiconductor device

Contact openings in semiconductor devices

Dielectric cap structure in semiconductor devices and methods of ma...

Selective recessing to form a fully aligned via

Semiconductor device with air gap on gate structure and method for...

Method for forming fin field effect transistor (FinFET) device stru...

Methods for fabricating semiconductor structures

Semiconductor structure and method for forming the same

Graphene/nanostructure FET with self-aligned contact and gate

Semiconductor structure with buried power rail, integrated circuit...

Semiconductor device and a method for fabricating the same

Interconnection structure and manufacturing method thereof

Self-aligned patterning with colored blocking and structures result...

Methods of manufacturing via structures on source/drain contacts

Semiconductor device and manufacturing method thereof

Tiered-profile contact for semiconductor

Semiconductor device and a method for fabricating the same

FinFET structure having a gate contact above a metal gate and strad...

Semiconductor device

Patents Applicationslast 30 patents

ISOLATION MODULE FOR BACKSIDE POWER DELIVERY

SUBTRACTIVE PLUG AND TAB PATTERNING WITH PHOTOBUCKETS FOR BACK END...

METHOD OF FORMING STACKED TRENCH CONTACTS AND STRUCTURES FORMED THE...

SELF-ALIGNED GATE ENDCAP (SAGE) ARCHITECTURE HAVING GATE CONTACTS

SELF-ALIGNED GATE ENDCAP (SAGE) ARCHITECTURES WITH REDUCED CAP

CONTACT OVER ACTIVE GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT...

BACKSIDE LOCAL INTERCONNECT

SEMICONDUCTOR DEVICE AND A METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE SUPPRESSING LEAKAGE CURRENT...

SELF-ALIGNED NANOMETER THROUGH-SILICON-VIA STRUCTURE AND METHOD OF...

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

GATE CUT OF SELF-ALIGNED CONTACT POST REPLACEMENT METAL GATE

MERGED SELF-ALIGNED BACKSIDE CONTACT

SELF-ALIGNED BACKSIDE CONTACT

METHOD TO CREATE AIR GAPS

BACKSIDE CONTACT MITIGATING CONTACT TO GATE SHORT

METHOD AND STRUCTURE FOR SEMICONDUCTOR DEVICE HAVING GATE SPACER PR...

SEMICONDUCTOR DEVICE

SELF-ALIGNED BACKSIDE CONTACT WITH PROTRUDING SOURCE/DRAIN

SEMICONDUCTOR DEVICES INCLUDING LOW-K METAL GATE ISOLATION AND METH...

SELF-ALIGNED BUILD-UP PROCESSING

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

METHOD OF MANUFACTURING SEMICONDUCTOR MEMORY DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

MEMORY ARRAY CIRCUIT

MEHTOD OF MAKING SEMICONDUCTOR DEVICE HAVING SELF-ALIGNED INTERCONN...

MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE

CONTACT PLUG

RECESSED CONTACTS AT LINE END AND METHODS FORMING SAME

2D-Channel Transistor Structure with Asymmetric Substrate Contacts