Formation of self-aligned vias or contact plugs

Industry

CPC
H01L21/76897

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76897Formation of self-aligned vias or contact plugs

Industries

Patents Grantslast 30 patents

Information Patent Grant
Methods for fabricating semiconductor structures
- Patent number 12,170,205
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Nien Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Graphene/nanostructure FET with self-aligned contact and gate
- Patent number 12,166,106
- Issue date Dec 10, 2024
- International Business Machines Corporation
- Jeffrey W. Sleight
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 12,165,920
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hwei-Jay Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with buried power rail, integrated circuit...
- Patent number 12,165,927
- Issue date Dec 10, 2024
- Mediatek Inc.
- Po-Chao Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method for fabricating the same
- Patent number 12,166,038
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shun-Jang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure and manufacturing method thereof
- Patent number 12,154,852
- Issue date Nov 26, 2024
- United Microelectronics Corp.
- Min-Shiang Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned patterning with colored blocking and structures result...
- Patent number 12,154,855
- Issue date Nov 26, 2024
- Intel Corporation
- Mohit K. Haran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing via structures on source/drain contacts
- Patent number 12,154,856
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Chiang Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,154,902
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yuan Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tiered-profile contact for semiconductor
- Patent number 12,148,663
- Issue date Nov 19, 2024
- International Business Machines Corporation
- Kisik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method for fabricating the same
- Patent number 12,148,831
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FinFET structure having a gate contact above a metal gate and strad...
- Patent number 12,148,834
- Issue date Nov 19, 2024
- Huawei Technologies Co., Ltd.
- Xinfang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,148,701
- Issue date Nov 19, 2024
- Samsung Electronics Co., Ltd.
- Hongsik Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming source/drain contacts
- Patent number 12,142,663
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shahaji B. More
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Replacement contact process
- Patent number 12,142,534
- Issue date Nov 12, 2024
- Applied Materials, Inc.
- Sankuei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming stacked trench contacts and structures formed the...
- Patent number 12,142,566
- Issue date Nov 12, 2024
- Intel Corporation
- Bernhard Sell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligning backside contact process and devices thereof
- Patent number 12,142,647
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Han Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligning spacer tight pitch via
- Patent number 12,142,525
- Issue date Nov 12, 2024
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked device with buried interconnect
- Patent number 12,142,526
- Issue date Nov 12, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact over active gate structures for advanced integrated circuit...
- Patent number 12,142,667
- Issue date Nov 12, 2024
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fully self-aligned interconnect structure
- Patent number 12,136,567
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsin-Ping Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and methods of forming the same
- Patent number 12,132,000
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shao-Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with a contact to source/drain layers and f...
- Patent number 12,131,990
- Issue date Oct 29, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Fei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a semiconductor device
- Patent number 12,131,950
- Issue date Oct 29, 2024
- SK Hynix Inc.
- Jae Man Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device suppressing leakage current...
- Patent number 12,125,785
- Issue date Oct 22, 2024
- Samsung Electronics Co., Ltd.
- Junghoo Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Buried metal track and methods forming same
- Patent number 12,125,850
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pochun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact plug
- Patent number 12,125,748
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Hsuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method of the same
- Patent number 12,119,261
- Issue date Oct 15, 2024
- Winbond Electronics Corp.
- Chun-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor with multi-level self-aligned gate and source/drain term...
- Patent number 12,119,383
- Issue date Oct 15, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Johnatan A. Kantarovsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to create air gaps
- Patent number 12,112,980
- Issue date Oct 8, 2024
- Lam Research Corporation
- Patrick A. Van Cleemput
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND STRUCTURE FOR SEMICONDUCTOR DEVICE HAVING GATE SPACER PR...
- Publication number 20240412975
- Publication date Dec 12, 2024
- Parabellum Strategic Opportunities Fund LLC
- Chih Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240414909
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- Sohyun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED BACKSIDE CONTACT WITH PROTRUDING SOURCE/DRAIN
- Publication number 20240413201
- Publication date Dec 12, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING LOW-K METAL GATE ISOLATION AND METH...
- Publication number 20240404882
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Tsung WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED BUILD-UP PROCESSING
- Publication number 20240404828
- Publication date Dec 5, 2024
- Geminatio, Inc.
- Brennan Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20240405086
- Publication date Dec 5, 2024
- Fujian Jinhua Integrated Circuit Co., Ltd.
- Chi-Ren Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR MEMORY DEVICE
- Publication number 20240395605
- Publication date Nov 28, 2024
- Fujian Jinhua Integrated Circuit Co., Ltd.
- Janbo Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240395811
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yuan LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY ARRAY CIRCUIT
- Publication number 20240395668
- Publication date Nov 28, 2024
- Invention And Collaboration Laboratory, Inc.
- Chun Shiah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEHTOD OF MAKING SEMICONDUCTOR DEVICE HAVING SELF-ALIGNED INTERCONN...
- Publication number 20240395671
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Yu LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE
- Publication number 20240387260
- Publication date Nov 21, 2024
- NANYA TECHNOLOGY CORPORATION
- Cheng Yan JI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT PLUG
- Publication number 20240387267
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hsuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
2D-Channel Transistor Structure with Asymmetric Substrate Contacts
- Publication number 20240387657
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Ting Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECESSED CONTACTS AT LINE END AND METHODS FORMING SAME
- Publication number 20240387266
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Te-Chih Hsiung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20240387268
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Ren Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SOURCE/DRAIN CONTACTS
- Publication number 20240379814
- Publication date Nov 14, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD.
- Shahaji B. More
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fully Self-Aligned Interconnect Structure
- Publication number 20240379434
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Hsin-Ping Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20240379437
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- HWEI-JAY CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240379436
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cai-Ling Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING SEAM SEALED
- Publication number 20240379419
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Lien HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING SELF-ALIGNED CONDUCTIVE STRUCTURE AN...
- Publication number 20240379435
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shao-Kuan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING SILICIDE LAYER
- Publication number 20240379806
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Ming HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20240379550
- Publication date Nov 14, 2024
- Samsung Electronics Co., Ltd.
- Heeseop Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNING BACKSIDE CONTACT PROCESS AND DEVICES THEREOF
- Publication number 20240379772
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Han Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR IMPROVEMENT OF PHOTORESIST PATTERNING PROFILE
- Publication number 20240379441
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ke-Ming CHEN
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240379560
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shao-Kuan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BURIED METAL TRACK AND METHODS FORMING SAME
- Publication number 20240371868
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pochun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240371694
- Publication date Nov 7, 2024
- SK HYNIX INC.
- Nam Jae LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR MAKING SEMICONDUCTOR DEVICES THAT INCLUDE METAL CAP LAYERS
- Publication number 20240363410
- Publication date Oct 31, 2024
- TOKYO ELECTRON LIMITED
- Ryota Yonezawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING SLOT STRUCTURES EXTENDING THROUGH...
- Publication number 20240357820
- Publication date Oct 24, 2024
- Lodestar Licensing Group LLC
- S M Istiaque Hossain
- H01 - BASIC ELECTRIC ELEMENTS

Formation of self-aligned vias or contact plugs

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods for fabricating semiconductor structures

Graphene/nanostructure FET with self-aligned contact and gate

Semiconductor structure and method for forming the same

Semiconductor structure with buried power rail, integrated circuit...

Semiconductor device and a method for fabricating the same

Interconnection structure and manufacturing method thereof

Self-aligned patterning with colored blocking and structures result...

Methods of manufacturing via structures on source/drain contacts

Semiconductor device and manufacturing method thereof

Tiered-profile contact for semiconductor

Semiconductor device and a method for fabricating the same

FinFET structure having a gate contact above a metal gate and strad...

Semiconductor device

Method for forming source/drain contacts

Replacement contact process

Method of forming stacked trench contacts and structures formed the...

Self-aligning backside contact process and devices thereof

Self-aligning spacer tight pitch via

Stacked device with buried interconnect

Contact over active gate structures for advanced integrated circuit...

Fully self-aligned interconnect structure

Semiconductor device structure and methods of forming the same

Semiconductor structure with a contact to source/drain layers and f...

Method for fabricating a semiconductor device

Semiconductor integrated circuit device suppressing leakage current...

Buried metal track and methods forming same

Contact plug

Semiconductor structure and manufacturing method of the same

Transistor with multi-level self-aligned gate and source/drain term...

Method to create air gaps

Patents Applicationslast 30 patents

METHOD AND STRUCTURE FOR SEMICONDUCTOR DEVICE HAVING GATE SPACER PR...

SEMICONDUCTOR DEVICE

SELF-ALIGNED BACKSIDE CONTACT WITH PROTRUDING SOURCE/DRAIN

SEMICONDUCTOR DEVICES INCLUDING LOW-K METAL GATE ISOLATION AND METH...

SELF-ALIGNED BUILD-UP PROCESSING

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

METHOD OF MANUFACTURING SEMICONDUCTOR MEMORY DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

MEMORY ARRAY CIRCUIT

MEHTOD OF MAKING SEMICONDUCTOR DEVICE HAVING SELF-ALIGNED INTERCONN...

MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE

CONTACT PLUG

2D-Channel Transistor Structure with Asymmetric Substrate Contacts

RECESSED CONTACTS AT LINE END AND METHODS FORMING SAME

SEMICONDUCTOR DEVICE AND METHOD

METHOD FOR FORMING SOURCE/DRAIN CONTACTS

Fully Self-Aligned Interconnect Structure

SEMICONDUCTOR STRUCTURE

SELF-ALIGNED INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR STRUCTURE HAVING SEAM SEALED

SEMICONDUCTOR STRUCTURE HAVING SELF-ALIGNED CONDUCTIVE STRUCTURE AN...

SEMICONDUCTOR DEVICES HAVING SILICIDE LAYER

SEMICONDUCTOR DEVICES

SELF-ALIGNING BACKSIDE CONTACT PROCESS AND DEVICES THEREOF

METHODS FOR IMPROVEMENT OF PHOTORESIST PATTERNING PROFILE

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

BURIED METAL TRACK AND METHODS FORMING SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

METHODS FOR MAKING SEMICONDUCTOR DEVICES THAT INCLUDE METAL CAP LAYERS

MICROELECTRONIC DEVICES INCLUDING SLOT STRUCTURES EXTENDING THROUGH...