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Formation of self-aligned vias or contact plugs
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H01L21/76897
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ELECTRICITY
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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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H01L21/76897
Formation of self-aligned vias or contact plugs
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Patents Grants
last 30 patents
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Patent Grant
Self-aligned metal gate for multigate device and method of forming...
Patent number
11,961,763
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Jia-Chuan You
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dual metal gate structure having portions of metal gate layers in c...
Patent number
11,955,532
Issue date
Apr 9, 2024
Intel Corporation
Jeffrey S. Leib
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor memory device and method for manufacturing same
Patent number
11,956,959
Issue date
Apr 9, 2024
Kioxia Corporation
Jun Fujiki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnect structure for logic circuit
Patent number
11,955,425
Issue date
Apr 9, 2024
Taiwan Semiconducotr Manufacturing Co., Ltd.
Fang Chen
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Heterogeneous metal line compositions for advanced integrated circu...
Patent number
11,955,534
Issue date
Apr 9, 2024
Intel Corporation
Andrew W. Yeoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods for forming air spacers in semiconductor devices
Patent number
11,955,535
Issue date
Apr 9, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Chia-Hao Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metal adhesion layer to promote metal plug adhesion
Patent number
11,955,379
Issue date
Apr 9, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Pei-Wen Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method for preparing semiconductor device
Patent number
11,955,371
Issue date
Apr 9, 2024
CHANGXIN MEMORY TECHNOLOGIES, INC.
Jingwen Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Differential hardmasks for modulation of electrobucket sensitivity
Patent number
11,955,377
Issue date
Apr 9, 2024
Intel Corporation
Kevin L. Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Self-aligned backside source contact structure
Patent number
11,948,987
Issue date
Apr 2, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Lung-Kun Chu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Trench contact structures for advanced integrated circuit structure...
Patent number
11,948,997
Issue date
Apr 2, 2024
Intel Corporation
Subhash M. Joshi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
11,948,888
Issue date
Apr 2, 2024
Samsung Electronics Co., Ltd.
Hongsik Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure having alternating selective metal and diel...
Patent number
11,942,426
Issue date
Mar 26, 2024
International Business Machines Corporation
Son Nguyen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of manufacture
Patent number
11,942,367
Issue date
Mar 26, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chan Syun David Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method, structures and devices for intra-connection structures
Patent number
11,943,908
Issue date
Mar 26, 2024
Taiwan Semiconductor Manufacturing Company Limited
Feng-Ming Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Contact features of semiconductor devices
Patent number
11,935,786
Issue date
Mar 19, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Tsui-Ling Yen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Three-dimensional memory device containing self-aligned bit line co...
Patent number
11,935,784
Issue date
Mar 19, 2024
SanDisk Technologies LLC
Fumitaka Amano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of manufacturing semiconductor devices
Patent number
11,935,835
Issue date
Mar 19, 2024
Samsung Electronics Co., Ltd.
Hyo-Jin Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming integrated semiconductor device with 2D material...
Patent number
11,935,890
Issue date
Mar 19, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Cheng-Yi Peng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Self-aligned gate endcap (SAGE) architecture having gate contacts
Patent number
11,935,892
Issue date
Mar 19, 2024
Intel Corporation
Sairam Subramanian
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Selective deposition for integrated circuit interconnect structures
Patent number
11,935,783
Issue date
Mar 19, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Hsin-Yen Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing a semiconductor structure, and a semiconduc...
Patent number
11,935,785
Issue date
Mar 19, 2024
CHANGXIN MEMORY TECHNOLOGIES, INC.
Shuai Guo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Silicon carbide oxide hard mask for reducing dishing effects
Patent number
11,935,942
Issue date
Mar 19, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Yi-Lun Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and a method for fabricating the same
Patent number
11,935,787
Issue date
Mar 19, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Hui-Chi Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Surface finishes with low RBTV for fine and mixed bump pitch archit...
Patent number
11,935,857
Issue date
Mar 19, 2024
Intel Corporation
Kristof Darmawaikarta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Via connection to a partially filled trench
Patent number
11,929,258
Issue date
Mar 12, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Shih-Ming Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metal gate structure and method of fabricating the same
Patent number
11,929,418
Issue date
Mar 12, 2024
United Microelectronics Corp.
Jie-Ning Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Via CD controllable top via structure
Patent number
11,923,246
Issue date
Mar 5, 2024
International Business Machines Corporation
Koichi Motoyama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method of the semiconductor...
Patent number
11,925,021
Issue date
Mar 5, 2024
SK hynix Inc.
Young Geun Jang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device pre-cleaning
Patent number
11,915,976
Issue date
Feb 27, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Li-Wei Chu
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SELF-ALIGNED CONTACT LANDING ON A METAL CIRCUIT
Publication number
20240112954
Publication date
Apr 4, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Ming-Hsun LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONTACT AIR GAP FORMATION AND STRUCTURES THEREOF
Publication number
20240112958
Publication date
Apr 4, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Sai-Hooi YEONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Self-Aligned Wafer Backside Gate Signal with Airgap
Publication number
20240113023
Publication date
Apr 4, 2024
International Business Machines Corporation
Tao Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LOCAL LINE EXTENSION FOR ENLARGED VIA-TO-LINE CONTACT AREA
Publication number
20240105506
Publication date
Mar 28, 2024
International Business Machines Corporation
Brent A. Anderson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SELECTIVE TUNGSTEN CONTACT PLUGS ABOVE GATE AND SOURCE/DRAIN CONTACTS
Publication number
20240096698
Publication date
Mar 21, 2024
QUALCOMM Incorporated
Junjing BAO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS OF FORMING ELECTRONIC DEVICES INCLUDING RECESSED CONDUCTIVE...
Publication number
20240099006
Publication date
Mar 21, 2024
Micron Technology, Inc.
Sidhartha Gupta
G11 - INFORMATION STORAGE
Information
Patent Application
SELECTIVE ILD DEPOSITION FOR FULLY ALIGNED VIA WITH AIRGAP
Publication number
20240096693
Publication date
Mar 21, 2024
TESSERA LLC
Christopher J. Penny
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SELF-ALIGNED BACKSIDE CONTACT IN NANOSHEET WITHOUT BDI
Publication number
20240096699
Publication date
Mar 21, 2024
International Business Machines Corporation
Chen Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MEHTOD OF MAKING SEMICONDUCTOR DEVICE HAVING SELF-ALIGNED INTERCONN...
Publication number
20240096756
Publication date
Mar 21, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Yu LAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-METAL FILL WITH SELF-ALIGNED PATTERNING AND DIELECTRIC WITH V...
Publication number
20240085803
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Tai-I YANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240087956
Publication date
Mar 14, 2024
Samsung Electronics Co., Ltd.
Woojin LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20240088097
Publication date
Mar 14, 2024
SK HYNIX INC.
Da Il RIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE INCLUDING EPITAXIAL REGION
Publication number
20240087884
Publication date
Mar 14, 2024
Samsung Electronics Co., Ltd.
Gyeom Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
Publication number
20240063276
Publication date
Feb 22, 2024
Samsung Electronics Co., Ltd.
Heon Bok Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Publication number
20240055378
Publication date
Feb 15, 2024
Samsung Electronics Co., Ltd.
Yongho KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20240055254
Publication date
Feb 15, 2024
Institute of Microelectronics, Chinese Academy of Sciences
Libin Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Structure and Method for Deep Trench Capacitor with Reduced Deforma...
Publication number
20240047552
Publication date
Feb 8, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Fu-Chiang Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HETEROGENEOUS METAL LINE COMPOSITIONS FOR ADVANCED INTEGRATED CIRCU...
Publication number
20240047556
Publication date
Feb 8, 2024
Intel Corporation
Andrew W. YEOH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUPERCONDUCTIVE INTERCONNECT STRUCTURE
Publication number
20240038589
Publication date
Feb 1, 2024
IMEC vzw
Anna Yurievna HERR
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS OF FORMING THE MICROELECTRONIC DEVICES, AND RELATED MICROEL...
Publication number
20240038588
Publication date
Feb 1, 2024
Micron Technology, Inc.
Terrence B. McDaniel
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATION OF FULLY ALIGNED VIA THROUGH SELECTIVE DEPOSITION AND R...
Publication number
20240030062
Publication date
Jan 25, 2024
LAM RESEARCH CORPORATION
Dennis M. Hausmann
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
SEMICONDUCTOR DEVICE INCLUDING A SELF-ALIGNED CONTACT LAYER WITH EN...
Publication number
20240030311
Publication date
Jan 25, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
I-Ming CHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SELF-ALIGNED CONTACTS
Publication number
20240030067
Publication date
Jan 25, 2024
Intel Corporation
Mark T. BOHR
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SELF-ALIGNED METAL GATE FOR MULTIGATE DEVICE AND METHOD OF FORMING...
Publication number
20240030066
Publication date
Jan 25, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Jia-Chuan You
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF FORMATION
Publication number
20240030134
Publication date
Jan 25, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chung-Liang CHENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20240030299
Publication date
Jan 25, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
I-Wen Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND METHODS FOR MANUFACTURING THE SAME
Publication number
20240021475
Publication date
Jan 18, 2024
Vanguard International Semiconductor Corporation
Po-Hsiang Liao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Transistor Contacts and Methods of Forming the Same
Publication number
20240021476
Publication date
Jan 18, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Yu-Lien Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONTACT STRUCTURE FOR SEMICONDUCTOR DEVICE
Publication number
20240021474
Publication date
Jan 18, 2024
Taiwan Semiconductor Manufacturing Co., Lid.
Yun-Yu HSIEH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Protection Structures for Bonded Wafers
Publication number
20240021469
Publication date
Jan 18, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Ssu-Chiang Weng
H01 - BASIC ELECTRIC ELEMENTS