formed in openings in a dielectric

Industry

CPC
H01L21/76843

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76843formed in openings in a dielectric

Industries

Patents Grantslast 30 patents

Information Patent Grant
Via for component electrode connection
- Patent number 12,142,524
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Different via configurations for different via interface requirements
- Patent number 12,142,565
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Che Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and semiconductor device having the same
- Patent number 12,142,521
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Bo-Jiun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fully self-aligned interconnect structure
- Patent number 12,136,567
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsin-Ping Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor structure having a porous st...
- Patent number 12,136,592
- Issue date Nov 5, 2024
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming recesses in source/drain regions and devices fo...
- Patent number 12,132,089
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom-up formation of contact plugs
- Patent number 12,131,949
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of manufacturing the same
- Patent number 12,131,992
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pit-less chemical mechanical planarization process and device struc...
- Patent number 12,131,915
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jheng-Hong Jiang
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 12,132,001
- Issue date Oct 29, 2024
- Samsung Electronics Co., Ltd.
- Yong Kong Siew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom-up formation of contact plugs
- Patent number 12,125,747
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming same
- Patent number 12,125,749
- Issue date Oct 22, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Yuanhao Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device suppressing leakage current...
- Patent number 12,125,785
- Issue date Oct 22, 2024
- Samsung Electronics Co., Ltd.
- Junghoo Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and method for forming the same
- Patent number 12,125,783
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Liang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for manufacturing semiconductor structures including isolat...
- Patent number 12,119,260
- Issue date Oct 15, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Yuan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with protection liners and air gaps and method...
- Patent number 12,119,302
- Issue date Oct 15, 2024
- NANYA TECHNOLOGY CORPORATION
- Te-Yin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanoscale resolution, spatially-controlled conductivity modulation...
- Patent number 12,112,982
- Issue date Oct 8, 2024
- Northwestern University
- Hooman Mohseni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including vertical routing structure and metho...
- Patent number 12,113,063
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chih Wen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal plate corner structure on metal insulator metal
- Patent number 12,107,041
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yuan-Yang Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field effect transistor contact with reduced contact resistance
- Patent number 12,107,086
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Su-Hao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-situ CMP self-assembled monolayer for enhancing metal-dielectric...
- Patent number 12,107,004
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Zhen Yu Guan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing memory and memory
- Patent number 12,096,620
- Issue date Sep 17, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Yexiao Yu
- G11 - INFORMATION STORAGE
Information Patent Grant
Metal-insulator-metal capacitor (MIMCAP) and methods of forming the...
- Patent number 12,094,763
- Issue date Sep 17, 2024
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Kwang Sing Yew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and method
- Patent number 12,094,771
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Bo-Jiun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and methods of forming the same
- Patent number 12,094,764
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Chin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having dielectric-on-dielectric structure a...
- Patent number 12,094,815
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Chin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual silicide process using ruthenium silicide
- Patent number 12,094,785
- Issue date Sep 17, 2024
- Applied Materials, Inc.
- Thomas Anthony Empante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having inter-metal dielectric patterns and met...
- Patent number 12,094,820
- Issue date Sep 17, 2024
- United Semiconductor (Xiamen) Co., Ltd.
- Bin Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming semiconductor structures
- Patent number 12,094,821
- Issue date Sep 17, 2024
- Winbond Electronics Corp.
- Chia-Hsin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor interconnect structure with double conductors
- Patent number 12,087,685
- Issue date Sep 10, 2024
- TESSERA LLC
- Benjamin D. Briggs
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CONTACT FEATURES OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME
- Publication number 20240387265
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pin-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Through-Circuit Vias In Interconnect Structures
- Publication number 20240387331
- Publication date Nov 21, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Jian-Hong LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THEREOF
- Publication number 20240387372
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yen-Chih Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240387251
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Wei LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240387252
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Kai Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure of Semiconductor Device and Method of Formin...
- Publication number 20240387360
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tung Ying Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVATION LAYERS WITH ROUNDED CORNERS
- Publication number 20240387244
- Publication date Nov 21, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Mingni CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Via for Component Electrode Connection
- Publication number 20240387263
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240387663
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Che LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE HYBRID CAPPING LAYER FOR METAL GATES OF TRANSISTORS
- Publication number 20240387257
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Chiang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED COPPER INTERCONNECTS WITH HYBRID MICROSTRUCTURE
- Publication number 20240387264
- Publication date Nov 21, 2024
- Adeia Semiconductor Solutions LLC
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION OF VIA AND BOTTOM ELECTRODE FOR MEMORY CELL
- Publication number 20240379533
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240379540
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Chung-Liang CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240379413
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240379417
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bo-Jiun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fully Self-Aligned Interconnect Structure
- Publication number 20240379434
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Hsin-Ping Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIT-LESS CHEMICAL MECHANICAL PLANARIZATION PROCESS AND DEVICE STRUC...
- Publication number 20240379379
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jheng-Hong JIANG
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
CONTACT FORMATION METHOD AND RELATED STRUCTURE
- Publication number 20240379432
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Che LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL PLATE CORNER STRUCTURE ON METAL INSULATOR METAL
- Publication number 20240379529
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Yuan-Yang Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL MIM STRUCTURE
- Publication number 20240379532
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Chun-huan WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIELD EFFECT TRANSISTOR WITH TOP-PROTECTED GATE ELECTRODE AND METHO...
- Publication number 20240381637
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yu-Hsiang Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIN FIELD-EFFECT TRANSISTOR DEVICE AND METHOD
- Publication number 20240379680
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kai-Hsuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT FOR ELECTRONIC COMPONENT
- Publication number 20240379415
- Publication date Nov 14, 2024
- STMicroelectronics International N.V.
- Pascal Fornara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE AND METHOD OF FORMING SAME
- Publication number 20240379598
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED LINES AND METHODS FOR FABRICATING THE SAME
- Publication number 20240379418
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yong-Jie WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING SILICIDE LAYER
- Publication number 20240379806
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Ming HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIR SPACER SURROUNDING CONDUCTIVE FEATURES AND METHOD FORMING SAME
- Publication number 20240379414
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Nien Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH REFLECTANCE ISOLATION STRUCTURE TO INCREASE IMAGE SENSOR PERFO...
- Publication number 20240379721
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Chan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING VERTICAL ROUTING STRUCTURE AND METHO...
- Publication number 20240371861
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chih WEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH POROUS LAYER AND METHOD FOR FABRICATING T...
- Publication number 20240371683
- Publication date Nov 7, 2024
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS

formed in openings in a dielectric

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Via for component electrode connection

Different via configurations for different via interface requirements

Interconnect structure and semiconductor device having the same

Fully self-aligned interconnect structure

Method for manufacturing semiconductor structure having a porous st...

Methods for forming recesses in source/drain regions and devices fo...

Bottom-up formation of contact plugs

Semiconductor structure and method of manufacturing the same

Pit-less chemical mechanical planarization process and device struc...

Semiconductor devices and methods of manufacturing semiconductor de...

Bottom-up formation of contact plugs

Semiconductor structure and method for forming same

Semiconductor integrated circuit device suppressing leakage current...

Interconnect structure and method for forming the same

Methods for manufacturing semiconductor structures including isolat...

Semiconductor device with protection liners and air gaps and method...

Nanoscale resolution, spatially-controlled conductivity modulation...

Semiconductor device including vertical routing structure and metho...

Metal plate corner structure on metal insulator metal

Field effect transistor contact with reduced contact resistance

In-situ CMP self-assembled monolayer for enhancing metal-dielectric...

Method for manufacturing memory and memory

Metal-insulator-metal capacitor (MIMCAP) and methods of forming the...

Interconnect structure and method

Interconnect structure and methods of forming the same

Semiconductor structure having dielectric-on-dielectric structure a...

Dual silicide process using ruthenium silicide

Semiconductor device having inter-metal dielectric patterns and met...

Methods for forming semiconductor structures

Semiconductor interconnect structure with double conductors

Patents Applicationslast 30 patents

CONTACT FEATURES OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME

Through-Circuit Vias In Interconnect Structures

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THEREOF

INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

Interconnect Structure of Semiconductor Device and Method of Formin...

PASSIVATION LAYERS WITH ROUNDED CORNERS

Via for Component Electrode Connection

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

SELECTIVE HYBRID CAPPING LAYER FOR METAL GATES OF TRANSISTORS

ADVANCED COPPER INTERCONNECTS WITH HYBRID MICROSTRUCTURE

INTEGRATION OF VIA AND BOTTOM ELECTRODE FOR MEMORY CELL

INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME

INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME

INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME

Fully Self-Aligned Interconnect Structure

PIT-LESS CHEMICAL MECHANICAL PLANARIZATION PROCESS AND DEVICE STRUC...

CONTACT FORMATION METHOD AND RELATED STRUCTURE

METAL PLATE CORNER STRUCTURE ON METAL INSULATOR METAL

NOVEL MIM STRUCTURE

FIELD EFFECT TRANSISTOR WITH TOP-PROTECTED GATE ELECTRODE AND METHO...

FIN FIELD-EFFECT TRANSISTOR DEVICE AND METHOD

CONTACT FOR ELECTRONIC COMPONENT

BONDING STRUCTURE AND METHOD OF FORMING SAME

SELF-ALIGNED LINES AND METHODS FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICES HAVING SILICIDE LAYER

AIR SPACER SURROUNDING CONDUCTIVE FEATURES AND METHOD FORMING SAME

HIGH REFLECTANCE ISOLATION STRUCTURE TO INCREASE IMAGE SENSOR PERFO...

SEMICONDUCTOR DEVICE INCLUDING VERTICAL ROUTING STRUCTURE AND METHO...

SEMICONDUCTOR DEVICE WITH POROUS LAYER AND METHOD FOR FABRICATING T...