Forming a passivation layer after forming the bump connector

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H01L2224/1191

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/1191Forming a passivation layer after forming the bump connector

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method for forming semiconductor package and semiconductor package
- Patent number 12,125,776
- Issue date Oct 22, 2024
- Yibu Semiconductor Co., Ltd.
- Weiping Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable via package and method
- Patent number 12,035,472
- Issue date Jul 9, 2024
- Amkor Technology Singapore Holding Ptd. Ltd.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and semiconductor die
- Patent number 12,021,057
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a passivation layer and method of making
- Patent number 12,002,771
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Lung Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple plated via arrays of different wire heights on a same subs...
- Patent number RE49987
- Issue date May 28, 2024
- Invensas LLC
- Cyprian Emeka Uzoh
Information Patent Grant
Semiconductor structure having polygonal bonding pad
- Patent number 11,935,851
- Issue date Mar 19, 2024
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with sacrificial pillars and methods...
- Patent number 11,894,329
- Issue date Feb 6, 2024
- Micron Technology, Inc.
- Chao Wen Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroplated indium bump stacks for cryogenic electronics
- Patent number 11,862,593
- Issue date Jan 2, 2024
- Microsoft Technology Licensing, LLC
- Christopher Cantaloube
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive bump of a semiconductor device and fabricating method th...
- Patent number 11,837,562
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chang-Pin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die with metal pillars
- Patent number 11,824,028
- Issue date Nov 21, 2023
- STMicroelectronics (Tours) SAS
- Olivier Ory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,824,027
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Shih-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation structure with planar top surfaces
- Patent number 11,817,361
- Issue date Nov 14, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor structure having polygonal bo...
- Patent number 11,776,921
- Issue date Oct 3, 2023
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Industrial chip scale package for microelectronic device
- Patent number 11,749,616
- Issue date Sep 5, 2023
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable via package and method
- Patent number 11,700,692
- Issue date Jul 11, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,502,057
- Issue date Nov 15, 2022
- Kioxia Corporation
- Soichi Homma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,469,202
- Issue date Oct 11, 2022
- Samsung Electronics Co., Ltd.
- Seong-Min Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alternative integration for redistribution layer process
- Patent number 11,450,631
- Issue date Sep 20, 2022
- Lam Research Corporation
- Justin Oberst
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with sacrificial pillars and methods...
- Patent number 11,404,390
- Issue date Aug 2, 2022
- Micron Technology, Inc.
- Chao Wen Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages for semiconductor devices, packaged semiconductor devices,...
- Patent number 11,329,022
- Issue date May 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with solder cap probe test pads
- Patent number 11,309,222
- Issue date Apr 19, 2022
- Advanced Micro Devices, Inc.
- Lei Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier structures between external electrical connectors
- Patent number 11,296,012
- Issue date Apr 5, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Chun Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package including embedded conductive elements
- Patent number 11,282,817
- Issue date Mar 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Feng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices with three-dimensional structures and support elements to i...
- Patent number 11,276,658
- Issue date Mar 15, 2022
- Micron Technology, Inc.
- Christopher J. Gambee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a pillar structure having a non-metal sidewall pro...
- Patent number 11,257,714
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanisms for forming post-passivation interconnect structure
- Patent number 11,257,775
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 11,244,919
- Issue date Feb 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Wen Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable via package and method
- Patent number 11,089,685
- Issue date Aug 10, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level dicing method and semiconductor device
- Patent number 11,081,391
- Issue date Aug 3, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Ju Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnect structures and methods of forming same
- Patent number 11,043,463
- Issue date Jun 22, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METAL BUMP STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20240387430
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Jung Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20240321814
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A PASSIVATION LAYER
- Publication number 20240321787
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Lung SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240178095
- Publication date May 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUSTRIAL CHIP SCALE PACKAGE FOR MICROELECTRONIC DEVICE
- Publication number 20240162163
- Publication date May 16, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH SACRIFICIAL PILLARS AND METHODS...
- Publication number 20240136315
- Publication date Apr 25, 2024
- Micron Technology, Inc.
- Chao Wen Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240128218
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240128217
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Jung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240113089
- Publication date Apr 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tian Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROPLATED INDIUM BUMP STACKS FOR CRYOGENIC ELECTRONICS
- Publication number 20240088080
- Publication date Mar 14, 2024
- Microsoft Technology Licensing, LLC
- Christopher CANTALOUBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CONDUCTIVE PILLAR DEVICE AND METHOD
- Publication number 20240071972
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Hidenori Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE WITH METAL PILLARS
- Publication number 20240063162
- Publication date Feb 22, 2024
- STMicroelectronics (Tours) SAS
- Olivier ORY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP COPLANARITY FOR DIE-TO-DIE AND OTHER APPLICATIONS
- Publication number 20240055383
- Publication date Feb 15, 2024
- QUALCOMM Incorporated
- Dongming HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE FOR MICRO-BUMPED WAFER PROBE
- Publication number 20230384367
- Publication date Nov 30, 2023
- QUALCOMM Incorporated
- Yangyang SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Passivation Structure with Planar Top Surfaces
- Publication number 20230360992
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKABLE VIA PACKAGE AND METHOD
- Publication number 20230354523
- Publication date Nov 2, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Harvested Reconstitution Bumping
- Publication number 20230245988
- Publication date Aug 3, 2023
- Kwan-Yu Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE
- Publication number 20230217593
- Publication date Jul 6, 2023
- LG Innotek Co., Ltd.
- Il Sik NAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC SIDEWALL PROTECTION AND SEALING FOR SEMICONDUCTOR DEVICE...
- Publication number 20230187299
- Publication date Jun 15, 2023
- NXP B.V.
- Kuan-Hsiang Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING POLYGONAL BONDING PAD
- Publication number 20230178503
- Publication date Jun 8, 2023
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE HAVING POLYGONAL BO...
- Publication number 20230178501
- Publication date Jun 8, 2023
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGING ARCHITECTURE WITH CUSTOMIZED VARIABLE METAL TH...
- Publication number 20230087810
- Publication date Mar 23, 2023
- Intel Corporation
- Jeremy D. ECTON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR DIE
- Publication number 20230063539
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SN-BI-IN-BASED LOW MELTING-POINT JOINING MEMBER, PRODUCTION METHOD...
- Publication number 20220395935
- Publication date Dec 15, 2022
- SHINRYO CORPORATION
- Hirotoshi NISHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROPLATED INDIUM BUMP STACKS FOR CRYOGENIC ELECTRONICS
- Publication number 20220359444
- Publication date Nov 10, 2022
- Microsoft Technology Licensing, LLC
- Christopher CANTALOUBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH SACRIFICIAL PILLARS AND METHODS...
- Publication number 20220328442
- Publication date Oct 13, 2022
- Micron Technology, Inc.
- Chao Wen Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages for Semiconductor Devices, Packaged Semiconductor Devices,...
- Publication number 20220262765
- Publication date Aug 18, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Passivation Structure with Planar Top Surfaces
- Publication number 20220262698
- Publication date Aug 18, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Barrier Structures Between External Electrical Connectors
- Publication number 20220230940
- Publication date Jul 21, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Chun Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Forming Semiconductor Package and Semiconductor Package
- Publication number 20220208669
- Publication date Jun 30, 2022
- Yibu Semiconductor Co., Ltd.
- Weiping LI
- H01 - BASIC ELECTRIC ELEMENTS

Forming a passivation layer after forming the bump connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for forming semiconductor package and semiconductor package

Stackable via package and method

Semiconductor structure and semiconductor die

Semiconductor device having a passivation layer and method of making

Multiple plated via arrays of different wire heights on a same subs...

Semiconductor structure having polygonal bonding pad

Semiconductor device assembly with sacrificial pillars and methods...

Electroplated indium bump stacks for cryogenic electronics

Conductive bump of a semiconductor device and fabricating method th...

Die with metal pillars

Semiconductor package

Passivation structure with planar top surfaces

Method of manufacturing semiconductor structure having polygonal bo...

Industrial chip scale package for microelectronic device

Stackable via package and method

Semiconductor device and manufacturing method thereof

Semiconductor device

Alternative integration for redistribution layer process

Semiconductor device assembly with sacrificial pillars and methods...

Packages for semiconductor devices, packaged semiconductor devices,...

Semiconductor chip with solder cap probe test pads

Barrier structures between external electrical connectors

Semiconductor device package including embedded conductive elements

Devices with three-dimensional structures and support elements to i...

Method of making a pillar structure having a non-metal sidewall pro...

Mechanisms for forming post-passivation interconnect structure

Package structure and method of fabricating the same

Stackable via package and method

Wafer level dicing method and semiconductor device

Interconnect structures and methods of forming same

Patents Applicationslast 30 patents

METAL BUMP STRUCTURES AND METHODS OF FORMING THE SAME

SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR DEVICE HAVING A PASSIVATION LAYER

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

INDUSTRIAL CHIP SCALE PACKAGE FOR MICROELECTRONIC DEVICE

SEMICONDUCTOR DEVICE ASSEMBLY WITH SACRIFICIAL PILLARS AND METHODS...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTROPLATED INDIUM BUMP STACKS FOR CRYOGENIC ELECTRONICS

SEMICONDUCTOR CONDUCTIVE PILLAR DEVICE AND METHOD

DIE WITH METAL PILLARS

BUMP COPLANARITY FOR DIE-TO-DIE AND OTHER APPLICATIONS

BUMP STRUCTURE FOR MICRO-BUMPED WAFER PROBE

Passivation Structure with Planar Top Surfaces

STACKABLE VIA PACKAGE AND METHOD

Harvested Reconstitution Bumping

PACKAGE SUBSTRATE

DIELECTRIC SIDEWALL PROTECTION AND SEALING FOR SEMICONDUCTOR DEVICE...

SEMICONDUCTOR STRUCTURE HAVING POLYGONAL BONDING PAD

METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE HAVING POLYGONAL BO...

ELECTRONIC PACKAGING ARCHITECTURE WITH CUSTOMIZED VARIABLE METAL TH...

SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR DIE

SN-BI-IN-BASED LOW MELTING-POINT JOINING MEMBER, PRODUCTION METHOD...

ELECTROPLATED INDIUM BUMP STACKS FOR CRYOGENIC ELECTRONICS

SEMICONDUCTOR DEVICE ASSEMBLY WITH SACRIFICIAL PILLARS AND METHODS...

Packages for Semiconductor Devices, Packaged Semiconductor Devices,...

Passivation Structure with Planar Top Surfaces

Barrier Structures Between External Electrical Connectors

Method for Forming Semiconductor Package and Semiconductor Package