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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/82051Forming additional members

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Patents Grantslast 30 patents

Information Patent Grant
Method to electrically connect chip with top connectors using 3D pr...
- Patent number 12,046,575
- Issue date Jul 23, 2024
- IO Tech Group Ltd.
- Michael Zenou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Raised via for terminal connections on different planes
- Patent number 11,646,220
- Issue date May 9, 2023
- Taiwan Semiconductor Manufacturing Company
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and methods of manufacture
- Patent number 11,605,607
- Issue date Mar 14, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hung-Chun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Raised via for terminal connections on different planes
- Patent number 11,251,071
- Issue date Feb 15, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bare die integration with printed components on flexible substrate...
- Patent number 11,122,683
- Issue date Sep 14, 2021
- Palo Alto Research Center Incorporated
- Tse Nga Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating semiconductor package
- Patent number 11,031,371
- Issue date Jun 8, 2021
- SanDisk Information Technology (Shanghai) Co., Ltd.
- Chin Tien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Raised via for terminal connections on different planes
- Patent number 10,629,477
- Issue date Apr 21, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scalable fabrication techniques and circuit packaging devices
- Patent number 10,506,715
- Issue date Dec 10, 2019
- The Regents of the University of California
- Todd Prentice Coleman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for integrating at least one 3D interconnection for the manu...
- Patent number 10,438,923
- Issue date Oct 8, 2019
- 3DIS Technologies
- Ayad Ghannam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Raised via for terminal connections on different planes
- Patent number 10,297,494
- Issue date May 21, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bare die integration with printed components on flexible substrate...
- Patent number 10,165,677
- Issue date Dec 25, 2018
- Palo Alto Research Center Incorporated
- Ping Mei
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Selective die electrical insulation by additive process
- Patent number 9,490,230
- Issue date Nov 8, 2016
- Invensas Corporation
- Jeffrey S. Leal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,196,601
- Issue date Nov 24, 2015
- Amkor Technology, Inc.
- Doo Hyun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and methods of formation thereof
- Patent number 8,778,733
- Issue date Jul 15, 2014
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE
- Publication number 20240395757
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Chun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Methods of Manufacture
- Publication number 20220302065
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Chun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Raised Via for Terminal Connections on Different Planes
- Publication number 20220165611
- Publication date May 26, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO ELECTRICALLY CONNECT CHIP WITH TOP CONNECTORS USING 3D PR...
- Publication number 20200350275
- Publication date Nov 5, 2020
- IO TECH GROUP LTD.
- Michael Zenou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Raised Via for Terminal Connections on Different Planes
- Publication number 20200251380
- Publication date Aug 6, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Raised Via for Terminal Connections on Different Planes
- Publication number 20190273018
- Publication date Sep 5, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARE DIE INTEGRATION WITH PRINTED COMPONENTS ON FLEXIBLE SUBSTRATE...
- Publication number 20190124757
- Publication date Apr 25, 2019
- Palo Alto Research Center Incorporated
- Tse Nga Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR INTEGRATING AT LEAST ONE 3D INTERCONNECTION FOR THE MANU...
- Publication number 20180254258
- Publication date Sep 6, 2018
- 3DIS Technologies
- Ayad Ghannam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE DIE ELECTRICAL INSULATION BY ADDITIVE PROCESS
- Publication number 20160020188
- Publication date Jan 21, 2016
- Invensas Corporation
- Jeffrey S. Leal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Methods of Formation Thereof
- Publication number 20130241077
- Publication date Sep 19, 2013
- INFINEON TECHNOLOGIES AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective Die Electrical Insulation By Additive Process
- Publication number 20110266684
- Publication date Nov 3, 2011
- Vertical Circuits, Inc.
- Jeffrey S. Leal
- H01 - BASIC ELECTRIC ELEMENTS

Forming additional members

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method to electrically connect chip with top connectors using 3D pr...

Raised via for terminal connections on different planes

Semiconductor device and methods of manufacture

Raised via for terminal connections on different planes

Bare die integration with printed components on flexible substrate...

Semiconductor package and method of fabricating semiconductor package

Raised via for terminal connections on different planes

Scalable fabrication techniques and circuit packaging devices

Method for integrating at least one 3D interconnection for the manu...

Raised via for terminal connections on different planes

Bare die integration with printed components on flexible substrate...

Selective die electrical insulation by additive process

Semiconductor device

Semiconductor package and methods of formation thereof

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE

Semiconductor Device and Methods of Manufacture

Raised Via for Terminal Connections on Different Planes

METHOD TO ELECTRICALLY CONNECT CHIP WITH TOP CONNECTORS USING 3D PR...

Raised Via for Terminal Connections on Different Planes

Raised Via for Terminal Connections on Different Planes

BARE DIE INTEGRATION WITH PRINTED COMPONENTS ON FLEXIBLE SUBSTRATE...

METHOD FOR INTEGRATING AT LEAST ONE 3D INTERCONNECTION FOR THE MANU...

SELECTIVE DIE ELECTRICAL INSULATION BY ADDITIVE PROCESS

Semiconductor Package and Methods of Formation Thereof

Selective Die Electrical Insulation By Additive Process