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H01L2224/85051

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/85051Forming additional members

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package including stacked semiconductor chips
- Patent number 12,142,592
- Issue date Nov 12, 2024
- SK hynix Inc.
- Jong Hyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages with electrical fuses
- Patent number 12,009,336
- Issue date Jun 11, 2024
- Texas Instruments Incorporated
- Mahmud Halim Chowdhury
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stud bump for wirebonding high voltage isolation barrier connection
- Patent number 11,973,052
- Issue date Apr 30, 2024
- Texas Instruments Incorporated
- Chien-Chang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked microfeature devices and associated methods
- Patent number 11,887,970
- Issue date Jan 30, 2024
- Micron Technology, Inc.
- Mung Suan Heng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages with high angle wire bonding and non-...
- Patent number 11,848,297
- Issue date Dec 19, 2023
- Texas Instruments Incorporated
- Bo-Hsun Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including stacked semiconductor chips
- Patent number 11,664,343
- Issue date May 30, 2023
- SK hynix Inc.
- Jong Hyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having an electrical connection between semico...
- Patent number 11,417,625
- Issue date Aug 16, 2022
- Murata Manufacturing Co., Ltd.
- Shizuki Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked microfeature devices and associated methods
- Patent number 11,373,979
- Issue date Jun 28, 2022
- Micron Technology, Inc.
- Mung Suan Heng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having an electrical connection between semico...
- Patent number 10,804,238
- Issue date Oct 13, 2020
- Murata Manufacturing Co., Ltd.
- Shizuki Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed adhesion deposition to mitigate integrated circuit package...
- Patent number 10,727,085
- Issue date Jul 28, 2020
- Texas Instruments Incorporated
- Yong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic unit
- Patent number 10,714,461
- Issue date Jul 14, 2020
- Vishay Semiconductor GmbH
- Christoph Paul Gebauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-volatile memory with stacked semiconductor chips
- Patent number 10,347,618
- Issue date Jul 9, 2019
- VALLEY DEVICE MANAGEMENT
- Masanori Onodera
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Printed adhesion deposition to mitigate integrated circuit delamina...
- Patent number 10,347,508
- Issue date Jul 9, 2019
- Texas Instruments Incorporated
- Yong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface finish for wirebonding
- Patent number 10,325,876
- Issue date Jun 18, 2019
- NXP USA, INC.
- Varughese Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,312,171
- Issue date Jun 4, 2019
- Rohm Co., Ltd.
- Kensuke Mikado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,163,850
- Issue date Dec 25, 2018
- Rohm Co., Ltd.
- Motoharu Haga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with overlapped lead terminals
- Patent number 10,134,659
- Issue date Nov 20, 2018
- Renesas Electronics Corporation
- Hiroaki Narita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked microfeature devices and associated methods
- Patent number 10,062,667
- Issue date Aug 28, 2018
- Micron Technology, Inc.
- Mung Suan Heng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 9,972,598
- Issue date May 15, 2018
- Renesas Electronics Corporation
- Yuki Yagyu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,859,182
- Issue date Jan 2, 2018
- Rohm Co., Ltd.
- Kensuke Mikado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-volatile memory and devices that use the same
- Patent number 9,837,397
- Issue date Dec 5, 2017
- VALLEY DEVICE MANAGEMENT
- Masanori Onodera
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Structure and method of reinforcing a conductor soldering point of...
- Patent number 9,837,371
- Issue date Dec 5, 2017
- TONGFU MICROELECTRONICS CO., L,TD.
- Haizhong Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,780,069
- Issue date Oct 3, 2017
- Rohm Co., Ltd.
- Motoharu Haga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 9,754,865
- Issue date Sep 5, 2017
- Renesas Electronics Corporation
- Takanori Yamashita
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Thin plastic leadless package with exposed metal die paddle
- Patent number 9,691,688
- Issue date Jun 27, 2017
- CARSEM (M) SDN. BHD.
- Mow Lum Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a plurality of circuits arranged on a s...
- Patent number 9,564,388
- Issue date Feb 7, 2017
- Renesas Electronics Corporation
- Masato Numazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packaging having plurality of wires bonding to...
- Patent number 9,536,859
- Issue date Jan 3, 2017
- Rohm Co., Ltd.
- Hiroyuki Kaneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked microfeature devices and associated methods
- Patent number 9,515,046
- Issue date Dec 6, 2016
- Micron Technology, Inc.
- Mung Suan Heng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Automatic wire tail adjustment system for wire bonders
- Patent number 9,502,374
- Issue date Nov 22, 2016
- ASM Technology Singapore Pte. Ltd.
- Keng Yew Song
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 9,490,194
- Issue date Nov 8, 2016
- Rohm Co., Ltd.
- Kensuke Mikado
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGES WITH ELECTRICAL FUSES
- Publication number 20240332243
- Publication date Oct 3, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Mahmud Halim CHOWDHURY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STUD BUMP FOR WIREBONDING HIGH VOLTAGE ISOLATION BARRIER CONNECTION
- Publication number 20240274570
- Publication date Aug 15, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Chien-Chang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP-FORMING DEVICE, BUMP-FORMING METHOD, AND NON-TRANSITORY COMPUT...
- Publication number 20240055388
- Publication date Feb 15, 2024
- SHINKAWA LTD.
- Kiyotaka TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20240030178
- Publication date Jan 25, 2024
- ROHM CO., LTD.
- Yosui FUTAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND MANUFACTURING APPARATUS
- Publication number 20240006193
- Publication date Jan 4, 2024
- SHINKAWA LTD.
- Hiroaki YOSHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING ELEMENT PACKAGE, METHOD OF MANUFACTURING THE SAME, AND ELEC...
- Publication number 20230420404
- Publication date Dec 28, 2023
- Sony Semiconductor Solutions Corporation
- Yuji HARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADED SEMICONDUCTOR PACKAGE WITH LEAD MOLD FLASH REDUCTION
- Publication number 20230275060
- Publication date Aug 31, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Xiaoling Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS
- Publication number 20230253360
- Publication date Aug 10, 2023
- SK HYNIX INC.
- Jong Hyun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PACKAGING
- Publication number 20230110402
- Publication date Apr 13, 2023
- NXP USA, Inc.
- YOU GE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES WITH HIGH ANGLE WIRE BONDING AND NON-...
- Publication number 20230005874
- Publication date Jan 5, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Bo-Hsun Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STUD BUMP FOR WIREBONDING HIGH VOLTAGE ISOLATION BARRIER CONNECTION
- Publication number 20220352111
- Publication date Nov 3, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Chien-Chang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS
- Publication number 20220189906
- Publication date Jun 16, 2022
- SK HYNIX INC.
- Jong Hyun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING AN ELECTRICAL CONNECTION BETWEEN SEMICO...
- Publication number 20200411465
- Publication date Dec 31, 2020
- MURATA MANUFACTURING CO., LTD.
- Shizuki Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MICROFEATURE DEVICES AND ASSOCIATED METHODS
- Publication number 20180358331
- Publication date Dec 13, 2018
- Micron Technology, Inc.
- Mung Suan Heng
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180096908
- Publication date Apr 5, 2018
- ROHM CO., LTD.
- Kensuke MIKADO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20180082977
- Publication date Mar 22, 2018
- RENESAS ELECTRONICS CORPORATION
- Yuki YAGYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREFORE
- Publication number 20180076188
- Publication date Mar 15, 2018
- VALLEY DEVICE MANAGEMENT
- Masanori Onodera
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CHIP ARRANGEMENT AND METHOD FOR FORMING A CONTACT CONNECTION
- Publication number 20180047697
- Publication date Feb 15, 2018
- Pac Tech - Packaging Technologies GmbH
- Heinrich Lüdeke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180005981
- Publication date Jan 4, 2018
- Rohm Co., Ltd.
- Motoharu HAGA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20170323848
- Publication date Nov 9, 2017
- RENESAS ELECTRONICS CORPORATION
- Takanori Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD OF REINFORCING A CONDUCTOR SOLDERING POINT OF...
- Publication number 20170207189
- Publication date Jul 20, 2017
- NANTONG FUJITSU MICROELECTRONICS CO., LTD.
- Haizhong SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MICROFEATURE DEVICES AND ASSOCIATED METHODS
- Publication number 20170084585
- Publication date Mar 23, 2017
- Micron Technology, Inc.
- Mung Suan Heng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND WIRE BONDING INTERCONNECTION METHOD
- Publication number 20150262963
- Publication date Sep 17, 2015
- Panasonic Intellectual Property Management Co., Ltd.
- Kenichi KOYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALUMINUM COATED COPPER RIBBON
- Publication number 20150137390
- Publication date May 21, 2015
- HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG
- Eugen Milke
- B32 - LAYERED PRODUCTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140374890
- Publication date Dec 25, 2014
- Renesas Electronics Corporation
- Takanori Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH OVERLAPPED LEAD TERMINALS
- Publication number 20140361444
- Publication date Dec 11, 2014
- Renesas Electronics Corporation
- Hiroaki NARITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140353822
- Publication date Dec 4, 2014
- RENESAS ELECTRONICS CORPORATION
- Kenji OYACHI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
STACKED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING STACK...
- Publication number 20140346683
- Publication date Nov 27, 2014
- Edmund Koon Tian Lua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A PLURALITY OF CIRCUITS ARRANGED ON A S...
- Publication number 20140339691
- Publication date Nov 20, 2014
- Masato NUMAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140306328
- Publication date Oct 16, 2014
- ROHM CO., LTD.
- Kensuke MIKADO
- H01 - BASIC ELECTRIC ELEMENTS

Forming additional members

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package including stacked semiconductor chips

Packages with electrical fuses

Stud bump for wirebonding high voltage isolation barrier connection

Stacked microfeature devices and associated methods

Semiconductor device packages with high angle wire bonding and non-...

Semiconductor package including stacked semiconductor chips

Semiconductor device having an electrical connection between semico...

Stacked microfeature devices and associated methods

Semiconductor device having an electrical connection between semico...

Printed adhesion deposition to mitigate integrated circuit package...

Electronic unit

Non-volatile memory with stacked semiconductor chips

Printed adhesion deposition to mitigate integrated circuit delamina...

Surface finish for wirebonding

Semiconductor device

Semiconductor device

Semiconductor device with overlapped lead terminals

Stacked microfeature devices and associated methods

Method of manufacturing semiconductor device

Semiconductor device

Non-volatile memory and devices that use the same

Structure and method of reinforcing a conductor soldering point of...

Semiconductor device

Semiconductor device and method for manufacturing the same

Thin plastic leadless package with exposed metal die paddle

Semiconductor device having a plurality of circuits arranged on a s...

Semiconductor device packaging having plurality of wires bonding to...

Stacked microfeature devices and associated methods

Automatic wire tail adjustment system for wire bonders

Semiconductor device

Patents Applicationslast 30 patents

PACKAGES WITH ELECTRICAL FUSES

STUD BUMP FOR WIREBONDING HIGH VOLTAGE ISOLATION BARRIER CONNECTION

BUMP-FORMING DEVICE, BUMP-FORMING METHOD, AND NON-TRANSITORY COMPUT...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND MANUFACTURING APPARATUS

IMAGING ELEMENT PACKAGE, METHOD OF MANUFACTURING THE SAME, AND ELEC...

LEADED SEMICONDUCTOR PACKAGE WITH LEAD MOLD FLASH REDUCTION

SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS

SEMICONDUCTOR DEVICE AND METHOD FOR PACKAGING

SEMICONDUCTOR DEVICE PACKAGES WITH HIGH ANGLE WIRE BONDING AND NON-...

STUD BUMP FOR WIREBONDING HIGH VOLTAGE ISOLATION BARRIER CONNECTION

SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS

SEMICONDUCTOR DEVICE HAVING AN ELECTRICAL CONNECTION BETWEEN SEMICO...

STACKED MICROFEATURE DEVICES AND ASSOCIATED METHODS

SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREFORE

CHIP ARRANGEMENT AND METHOD FOR FORMING A CONTACT CONNECTION

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

STRUCTURE AND METHOD OF REINFORCING A CONDUCTOR SOLDERING POINT OF...

STACKED MICROFEATURE DEVICES AND ASSOCIATED METHODS

SEMICONDUCTOR DEVICE AND WIRE BONDING INTERCONNECTION METHOD

ALUMINUM COATED COPPER RIBBON

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE WITH OVERLAPPED LEAD TERMINALS

SEMICONDUCTOR DEVICE

STACKED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING STACK...

SEMICONDUCTOR DEVICE HAVING A PLURALITY OF CIRCUITS ARRANGED ON A S...

SEMICONDUCTOR DEVICE