forming tapered edges on substrate or adjacent layers

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CPC
Y10S438/978

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Parent Industries

YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10USPC classification Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10S438/00Semiconductor device manufacturing: process

Current Industry

Y10S438/978forming tapered edges on substrate or adjacent layers

Industries

Patents Grantslast 30 patents

Information Patent Grant
Nonplanar device with thinned lower body portion and method of fabr...
- Patent number 10,236,356
- Issue date Mar 19, 2019
- Intel Corporation
- Uday Shah
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Nonplanar device with thinned lower body portion and method of fabr...
- Patent number 9,741,809
- Issue date Aug 22, 2017
- Intel Corporation
- Uday Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nonplanar device with thinned lower body portion and method of fabr...
- Patent number 9,190,518
- Issue date Nov 17, 2015
- Intel Corporation
- Uday Shah
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
GaN vertical superjunction device structures and fabrication methods
- Patent number 9,029,210
- Issue date May 12, 2015
- Avogy, Inc.
- Hui Nie
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Via structure and via etching process of forming the same
- Patent number 8,896,127
- Issue date Nov 25, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Pin Chang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Nonplanar device with thinned lower body portion and method of fabr...
- Patent number 8,749,026
- Issue date Jun 10, 2014
- Intel Corporation
- Uday Shah
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Nonplanar device with thinned lower body portion and method of fabr...
- Patent number 8,502,351
- Issue date Aug 6, 2013
- Intel Corporation
- Uday Shah
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Via structure and via etching process of forming the same
- Patent number 8,329,578
- Issue date Dec 11, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Pin Chang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Nonplanar device with thinned lower body portion and method of fabr...
- Patent number 8,067,818
- Issue date Nov 29, 2011
- Intel Corporation
- Uday Shah
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Thin-film circuit device having a low strength region, method for m...
- Patent number 7,843,041
- Issue date Nov 30, 2010
- Seiko Epson Corporation
- Taimei Kodaira
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Structure and method for fabricating cladded conductive lines in ma...
- Patent number 7,833,806
- Issue date Nov 16, 2010
- EVERSPIN TECHNOLOGIES, INC.
- Kenneth H. Smith
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 7,800,114
- Issue date Sep 21, 2010
- Semiconductor Energy Laboratory Co., Ltd.
- Satoru Okamoto
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of forming a semiconductor device featuring copper wiring la...
- Patent number 7,741,214
- Issue date Jun 22, 2010
- NEC Electronics Corporation
- Toshiyuki Takewaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for fabricating self-assembling microstructures
- Patent number 7,727,804
- Issue date Jun 1, 2010
- The Regents of the University of California
- John Stephen Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of the same
- Patent number 7,670,955
- Issue date Mar 2, 2010
- Sanyo Electric Co., Ltd.
- Kojiro Kameyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with gate spacer of positive slope and fabrica...
- Patent number 7,566,924
- Issue date Jul 28, 2009
- Samsung Electronics Co., Ltd.
- Chang-Huhn Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor device
- Patent number 7,556,985
- Issue date Jul 7, 2009
- Fujitsu Microelectronics Limited
- Norio Fukasawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing conductive element substrate, conductive e...
- Patent number 7,550,183
- Issue date Jun 23, 2009
- Sharp Kabushiki Kaisha
- Kazuhiro Ishizuka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Nonplanar device with thinned lower body portion and method of fabr...
- Patent number 7,550,333
- Issue date Jun 23, 2009
- Intel Corporation
- Uday Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 7,537,979
- Issue date May 26, 2009
- Semiconductor Energy Laboratory Co., Ltd.
- Atsuo Isobe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dry-etching method
- Patent number 7,531,460
- Issue date May 12, 2009
- Tokyo Electron Limited
- Etsuo Iijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor apparatus with a tapered ap...
- Patent number 7,517,638
- Issue date Apr 14, 2009
- Sony Corporation
- Fumikatsu Uesawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device featuring copper wiring layers of different wi...
- Patent number 7,479,700
- Issue date Jan 20, 2009
- NEC Electronics Corporation
- Toshiyuki Takewaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 7,374,983
- Issue date May 20, 2008
- Semiconductor Energy Laboratory Co., Ltd.
- Satoru Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterojunction bipolar transistor with dielectric assisted planariz...
- Patent number 7,354,820
- Issue date Apr 8, 2008
- Teledyne Licensing, LLC
- Richard L. Pierson, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a via hole having a diameter at the surfa...
- Patent number 7,339,273
- Issue date Mar 4, 2008
- Sanyo Electric Co., LTD
- Kojiro Kameyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Engagement Probes
- Patent number 7,330,036
- Issue date Feb 12, 2008
- Micron Technology, Inc.
- Warren M. Farnworth
- G01 - MEASURING TESTING
Information Patent Grant
Via etch process
- Patent number 7,303,648
- Issue date Dec 4, 2007
- Intel Corporation
- Hyun-Mog Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Combined wet etching method for stacked films and wet etching syste...
- Patent number 7,291,283
- Issue date Nov 6, 2007
- NEC LCD Technologies, Ltd.
- Tadanori Uesugi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor structure and fabrication therefor
- Patent number 7,273,824
- Issue date Sep 25, 2007
- United Microelectronics Corp.
- Yi-Ching Wu
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
NONPLANAR DEVICE WITH THINNED LOWER BODY PORTION AND METHOD OF FABR...
- Publication number 20170365677
- Publication date Dec 21, 2017
- Intel Corporation
- Uday SHAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAN VERTICAL SUPERJUNCTION DEVICE STRUCTURES AND FABRICATION METHODS
- Publication number 20140295652
- Publication date Oct 2, 2014
- Hui Nie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NONPLANAR DEVICE WITH THINNED LOWER BODY PORTION AND METHOD OF FABR...
- Publication number 20140239358
- Publication date Aug 28, 2014
- Uday Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAN VERTICAL SUPERJUNCTION DEVICE STRUCTURES AND FABRICATION METHODS
- Publication number 20130341677
- Publication date Dec 26, 2013
- AVOGY, INC.
- Hui Nie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NONPLANAR DEVICE WITH THINNED LOWER BODY PORTION AND METHOD OF FABR...
- Publication number 20130264642
- Publication date Oct 10, 2013
- Uday Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA STRUCTURE AND VIA ETCHING PROCESS OF FORMING THE SAME
- Publication number 20130062767
- Publication date Mar 14, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Pin CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NONPLANAR DEVICE WITH THINNED LOWER BODY PORTION AND METHOD OF FABR...
- Publication number 20120012934
- Publication date Jan 19, 2012
- Uday Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NONPLANAR DEVICE WITH THINNED LOWER BODY PORTION AND METHOD OF FABR...
- Publication number 20110062512
- Publication date Mar 17, 2011
- Uday Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA STRUCTURE AND VIA ETCHING PROCESS OF FORMING THE SAME
- Publication number 20100244247
- Publication date Sep 30, 2010
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Pin CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR FABRICATING CLADDED CONDUCTIVE LINES IN MA...
- Publication number 20100197043
- Publication date Aug 5, 2010
- EVERSPIN TECHNOLOGIES, INC.
- Nicholas D. RIZZO
- G11 - INFORMATION STORAGE
Information Patent Application
Method and apparatus for fabricating self-assembling microstructures
- Publication number 20100075463
- Publication date Mar 25, 2010
- The Regents of the University of California
- John Stephen Smith
- G02 - OPTICS
Information Patent Application
METHOD OF FORMING A SEMICONDUCTOR DEVICE FEATURING COPPER WIRING LA...
- Publication number 20090081870
- Publication date Mar 26, 2009
- NEC Electronics Corporation
- Toshiyuki Takewaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Manufacturing Method Thereof
- Publication number 20080251845
- Publication date Oct 16, 2008
- Semiconductor Energy Laboratory Co., Ltd
- Satoru Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20080132038
- Publication date Jun 5, 2008
- SANYO ELECTRIC CO., LTD.
- Kojiro Kameyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN-FILM CIRCUIT DEVICE, METHOD FOR MANUFACTURING THIN-FILM CIRCUI...
- Publication number 20070173031
- Publication date Jul 26, 2007
- SEIKO EPSON CORPORATION
- Taimei Kodaira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing Semiconductor Device
- Publication number 20060281318
- Publication date Dec 14, 2006
- Semiconductor Energy Laboratory Co., Ltd.
- Atsuo Isobe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Nonplanar device with thinned lower body portion and method of fabr...
- Publication number 20060214231
- Publication date Sep 28, 2006
- Uday Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dry-etching method
- Publication number 20060172546
- Publication date Aug 3, 2006
- TOKYO ELECTON LIMITED
- Etsuo Iijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device featuring copper wiring layers of different wi...
- Publication number 20060157854
- Publication date Jul 20, 2006
- NEC Electronics Corporation
- Toshiyuki Takewaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heterojunction bipolar transistor with dielectric assisted planariz...
- Publication number 20060121669
- Publication date Jun 8, 2006
- INNOVATIVE TECHNOLOGY LICENSING, LLC
- Richard L. Pierson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method of the same
- Publication number 20060108695
- Publication date May 25, 2006
- SANYO ELECTRIC CO., LTD.
- Kojiro Kameyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Nonplanar device with thinned lower body portion and method of fabr...
- Publication number 20060086977
- Publication date Apr 27, 2006
- Uday Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device with gate space of positive slope and fabricat...
- Publication number 20060027875
- Publication date Feb 9, 2006
- Samsung Electronics Co., Ltd.
- Chang-Huhn Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of fabricating semiconductor device
- Publication number 20060030127
- Publication date Feb 9, 2006
- FUJITSU LIMITED
- Norio Fukasawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
[SEMICONDUCTOR STRUCTURE AND FABRICATION THEREFOR]
- Publication number 20060006545
- Publication date Jan 12, 2006
- Yi-Ching Wu
- B24 - GRINDING POLISHING
Information Patent Application
Method for forming a metal line in a semiconductor device
- Publication number 20060009024
- Publication date Jan 12, 2006
- Hynix Semiconductor Inc.
- Jae Jung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Via etch process
- Publication number 20050274690
- Publication date Dec 15, 2005
- Hyun-Mog Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20050227419
- Publication date Oct 13, 2005
- Semiconductor Energy Laboratory Co., Ltd
- Satoru Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for fabricating self-assembling microstructures
- Publication number 20050186712
- Publication date Aug 25, 2005
- The Regents of the University of California
- John Stephen Smith
- G02 - OPTICS
Information Patent Application
Method for manufacturing conductive element substrate, conductive e...
- Publication number 20050186359
- Publication date Aug 25, 2005
- Sharp Kabushiki Kaisha
- Kazuhiro Ishizuka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

forming tapered edges on substrate or adjacent layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Nonplanar device with thinned lower body portion and method of fabr...

Nonplanar device with thinned lower body portion and method of fabr...

Nonplanar device with thinned lower body portion and method of fabr...

GaN vertical superjunction device structures and fabrication methods

Via structure and via etching process of forming the same

Nonplanar device with thinned lower body portion and method of fabr...

Nonplanar device with thinned lower body portion and method of fabr...

Via structure and via etching process of forming the same

Nonplanar device with thinned lower body portion and method of fabr...

Thin-film circuit device having a low strength region, method for m...

Structure and method for fabricating cladded conductive lines in ma...

Semiconductor device and manufacturing method thereof

Method of forming a semiconductor device featuring copper wiring la...

Method and apparatus for fabricating self-assembling microstructures

Semiconductor device and manufacturing method of the same

Semiconductor device with gate spacer of positive slope and fabrica...

Method of fabricating semiconductor device

Method for manufacturing conductive element substrate, conductive e...

Nonplanar device with thinned lower body portion and method of fabr...

Method of manufacturing semiconductor device

Dry-etching method

Method of manufacturing a semiconductor apparatus with a tapered ap...

Semiconductor device featuring copper wiring layers of different wi...

Semiconductor device and manufacturing method thereof

Heterojunction bipolar transistor with dielectric assisted planariz...

Semiconductor device with a via hole having a diameter at the surfa...

Engagement Probes

Via etch process

Combined wet etching method for stacked films and wet etching syste...

Semiconductor structure and fabrication therefor

Patents Applicationslast 30 patents

NONPLANAR DEVICE WITH THINNED LOWER BODY PORTION AND METHOD OF FABR...

GAN VERTICAL SUPERJUNCTION DEVICE STRUCTURES AND FABRICATION METHODS

NONPLANAR DEVICE WITH THINNED LOWER BODY PORTION AND METHOD OF FABR...

GAN VERTICAL SUPERJUNCTION DEVICE STRUCTURES AND FABRICATION METHODS

NONPLANAR DEVICE WITH THINNED LOWER BODY PORTION AND METHOD OF FABR...

VIA STRUCTURE AND VIA ETCHING PROCESS OF FORMING THE SAME

NONPLANAR DEVICE WITH THINNED LOWER BODY PORTION AND METHOD OF FABR...

NONPLANAR DEVICE WITH THINNED LOWER BODY PORTION AND METHOD OF FABR...

VIA STRUCTURE AND VIA ETCHING PROCESS OF FORMING THE SAME

STRUCTURE AND METHOD FOR FABRICATING CLADDED CONDUCTIVE LINES IN MA...

Method and apparatus for fabricating self-assembling microstructures

METHOD OF FORMING A SEMICONDUCTOR DEVICE FEATURING COPPER WIRING LA...

Semiconductor Device and Manufacturing Method Thereof

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

THIN-FILM CIRCUIT DEVICE, METHOD FOR MANUFACTURING THIN-FILM CIRCUI...

Method of Manufacturing Semiconductor Device

Nonplanar device with thinned lower body portion and method of fabr...

Dry-etching method

Semiconductor device featuring copper wiring layers of different wi...

Heterojunction bipolar transistor with dielectric assisted planariz...

Semiconductor device and manufacturing method of the same

Nonplanar device with thinned lower body portion and method of fabr...

Semiconductor device with gate space of positive slope and fabricat...

Method of fabricating semiconductor device

[SEMICONDUCTOR STRUCTURE AND FABRICATION THEREFOR]

Method for forming a metal line in a semiconductor device

Via etch process

Semiconductor device and manufacturing method thereof

Method and apparatus for fabricating self-assembling microstructures

Method for manufacturing conductive element substrate, conductive e...