Four-layer coating

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H01L2224/05584

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/05584Four-layer coating

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method of fabricating a semiconductor device
- Patent number 12,136,602
- Issue date Nov 5, 2024
- Samsung Electronics Co., Ltd.
- Ju-Il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming semiconductor struct...
- Patent number 12,100,677
- Issue date Sep 24, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Hua Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including interconnection structure including...
- Patent number 11,152,317
- Issue date Oct 19, 2021
- Samsung Electronics Co., Ltd.
- Ju-Il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip packaging rework
- Patent number 11,121,101
- Issue date Sep 14, 2021
- International Business Machines Corporation
- Charles Leon Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level chip-scale package including power semiconductor and ma...
- Patent number 10,991,637
- Issue date Apr 27, 2021
- MagnaChip Semiconductor, Ltd.
- Myung Ho Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal pillar in a film-type seconductor package
- Patent number 10,867,948
- Issue date Dec 15, 2020
- Samsung Electronics Co., Ltd.
- Jung-woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level chip-scale package including power semiconductor and ma...
- Patent number 10,573,571
- Issue date Feb 25, 2020
- MagnaChip Semiconductor, Ltd.
- Myung Ho Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal pillar in a film-type semiconductor package
- Patent number 10,354,967
- Issue date Jul 16, 2019
- Samsung Electronics Co., Ltd.
- Jung-woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming conductive vias using ba...
- Patent number 9,865,524
- Issue date Jan 9, 2018
- STATS ChipPAC Pte. Ltd.
- Duk Ju Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radiation detector UBM electrode structure body, radiation detector...
- Patent number 9,823,362
- Issue date Nov 21, 2017
- JX Nippon Mining & Metals Corporation
- Masaomi Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Under-bump metal structures for interconnecting semiconductor dies...
- Patent number 9,704,781
- Issue date Jul 11, 2017
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a structure for microelectronic device assembly
- Patent number 9,241,403
- Issue date Jan 19, 2016
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Gabriel Pares
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structures and methods for detecting solder wetting of pedestal sid...
- Patent number 8,629,557
- Issue date Jan 14, 2014
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFA...
- Publication number 20240234348
- Publication date Jul 11, 2024
- Mitsubishi Electric Corporation
- Yasunari HINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR PREPARING CHIP PACKAGE STRUCTURE
- Publication number 20240178167
- Publication date May 30, 2024
- Huawei Technologies Co., Ltd
- Ran HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFA...
- Publication number 20240136309
- Publication date Apr 25, 2024
- Mitsubishi Electric Corporation
- Yasunari HINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOCUMENT STRUCTURE FORMATION
- Publication number 20240105669
- Publication date Mar 28, 2024
- INFINEON TECHNOLOGIES AG
- Jens Pohl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230352371
- Publication date Nov 2, 2023
- Rohm Co., Ltd.
- Yuki NAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SEMICONDUCTOR STRUCT...
- Publication number 20230145031
- Publication date May 11, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Hua Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING A SEMICONDUCTOR DEVICE
- Publication number 20220068852
- Publication date Mar 3, 2022
- Samsung Electronics Co., Ltd.
- Ju-Il CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP PACKAGING REWORK
- Publication number 20210242146
- Publication date Aug 5, 2021
- International Business Machines Corporation
- Charles Leon Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20200098711
- Publication date Mar 26, 2020
- Samsung Electronics Co., Ltd.
- Ju-Il CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM-TYPE SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20190304941
- Publication date Oct 3, 2019
- Samsung Electronics Co., Ltd.
- Jung-woo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM-TYPE SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20180090459
- Publication date Mar 29, 2018
- Samsung Electronics Co., Ltd.
- Jung-woo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Conductive Vias Using Ba...
- Publication number 20140300002
- Publication date Oct 9, 2014
- STATS ChipPAC, Ltd.
- Duk Ju Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Modules and Methods of Formation Thereof
- Publication number 20140232015
- Publication date Aug 21, 2014
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonded System with Coated Copper Conductor
- Publication number 20140197539
- Publication date Jul 17, 2014
- INFINEON TECHNOLOGIES AG
- Reinhold Bayerer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A STRUCTURE FOR MICROELECTRONIC DEVICE ASSEMBLY
- Publication number 20140144690
- Publication date May 29, 2014
- COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENE. ALT.
- Gabriel Pares
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE FOR SEMICONDUCTOR PACKAGE
- Publication number 20140061928
- Publication date Mar 6, 2014
- Siliconware Precision Industries Co., Ltd.
- Chang-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP WITH EXPANSIVE UNDERBUMP METALLIZATION STRUCTURES
- Publication number 20130341785
- Publication date Dec 26, 2013
- Lei Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES AND METHODS FOR DETECTING SOLDER WETTING OF PEDESTAL SID...
- Publication number 20130234315
- Publication date Sep 12, 2013
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Under bump metallurgy structure of a package and method of making same
- Publication number 20080169539
- Publication date Jul 17, 2008
- Silicon Storage Tech., Inc.
- Sychyi Fang
- H01 - BASIC ELECTRIC ELEMENTS

Four-layer coating

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of fabricating a semiconductor device

Semiconductor structure and method for forming semiconductor struct...

Semiconductor device including interconnection structure including...

Flip chip packaging rework

Wafer-level chip-scale package including power semiconductor and ma...

Metal pillar in a film-type seconductor package

Wafer-level chip-scale package including power semiconductor and ma...

Metal pillar in a film-type semiconductor package

Semiconductor device and method of forming conductive vias using ba...

Radiation detector UBM electrode structure body, radiation detector...

Under-bump metal structures for interconnecting semiconductor dies...

Method for producing a structure for microelectronic device assembly

Structures and methods for detecting solder wetting of pedestal sid...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFA...

CHIP PACKAGE STRUCTURE AND METHOD FOR PREPARING CHIP PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFA...

DOCUMENT STRUCTURE FORMATION

SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SEMICONDUCTOR STRUCT...

METHOD OF FABRICATING A SEMICONDUCTOR DEVICE

FLIP CHIP PACKAGING REWORK

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

FILM-TYPE SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

FILM-TYPE SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Semiconductor Device and Method of Forming Conductive Vias Using Ba...

Semiconductor Modules and Methods of Formation Thereof

Bonded System with Coated Copper Conductor

METHOD FOR PRODUCING A STRUCTURE FOR MICROELECTRONIC DEVICE ASSEMBLY

INTERCONNECTION STRUCTURE FOR SEMICONDUCTOR PACKAGE

SEMICONDUCTOR CHIP WITH EXPANSIVE UNDERBUMP METALLIZATION STRUCTURES

STRUCTURES AND METHODS FOR DETECTING SOLDER WETTING OF PEDESTAL SID...

Under bump metallurgy structure of a package and method of making same