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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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H01L21/2254from or through or into an applied layer

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Patents Grantslast 30 patents

Information Patent Grant
Method of forming a semiconductor device by driving hydrogen into a...
- Patent number 12,183,581
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hongfa Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and methods of forming same
- Patent number 12,132,107
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Hsiung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom-up formation of contact plugs
- Patent number 12,131,949
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom-up formation of contact plugs
- Patent number 12,125,747
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 12,125,908
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Ling Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monolithic multi-I region diode limiters
- Patent number 12,080,708
- Issue date Sep 3, 2024
- MACOM Technology Solutions Holdings, Inc.
- James Joseph Brogle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof, and electron...
- Patent number 12,046,672
- Issue date Jul 23, 2024
- Institute of Microelectronics, Chinese Academy of Sciences
- Huilong Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device including annealing a...
- Patent number 11,996,291
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Hsien Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a semiconductor fin comprising a sil...
- Patent number 11,978,632
- Issue date May 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Hsien Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method used in forming a memory array comprising strings of memory...
- Patent number 11,956,955
- Issue date Apr 9, 2024
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside contact structures and fabrication for metal on both sides...
- Patent number 11,935,933
- Issue date Mar 19, 2024
- Intel Corporation
- Patrick Morrow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembling of molecules on a 2D material and an electronic device
- Patent number 11,908,926
- Issue date Feb 20, 2024
- GRAPHENSIC AB
- Samuel Lara-Avila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 11,903,202
- Issue date Feb 13, 2024
- Kioxia Corporation
- Aki Maeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming barrier layer and method for manufacturing semic...
- Patent number 11,830,738
- Issue date Nov 28, 2023
- ASM IP Holding B.V.
- Ryu Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with spacer of gradually changed thickness and...
- Patent number 11,830,929
- Issue date Nov 28, 2023
- Institute of Microelectronics, Chinese Academy of Sciences
- Huilong Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor device by driving hydrogen into a d...
- Patent number 11,776,814
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hongfa Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
P+ or N+ type doping process for semiconductors
- Patent number 11,769,668
- Issue date Sep 26, 2023
- ISTITUTO NAZIONALE DI FISICA NUCLEARE (INFN)
- Gianluigi Maggioni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with spacer of gradually changed thickness and...
- Patent number 11,728,408
- Issue date Aug 15, 2023
- Institute of Microelectronics, Chinese Academy of Sciences
- Huilong Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monolithic multi-I region diode limiters
- Patent number 11,705,448
- Issue date Jul 18, 2023
- MACOM Technology Solutions Holdings, Inc.
- James Joseph Brogle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside contact structures and fabrication for metal on both sides...
- Patent number 11,658,221
- Issue date May 23, 2023
- Intel Corporation
- Patrick Morrow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembling of molecules on a 2D material and an electronic device
- Patent number 11,575,033
- Issue date Feb 7, 2023
- GRAPHENSIC AB
- Samuel Lara-Avila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 11,563,110
- Issue date Jan 24, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Yun Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with spacer of gradually changed thickness and...
- Patent number 11,502,184
- Issue date Nov 15, 2022
- Institute of Microelectronics, Chinese Academy of Sciences
- Huilong Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom-up formation of contact plugs
- Patent number 11,469,139
- Issue date Oct 11, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FinFET device and methods of forming
- Patent number 11,450,757
- Issue date Sep 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-metal dipole doping to offer multi-threshold voltage pairs wi...
- Patent number 11,393,725
- Issue date Jul 19, 2022
- International Business Machines Corporation
- Ruqiang Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bifacial photovoltaic cell
- Patent number 11,387,382
- Issue date Jul 12, 2022
- SolAround Ltd.
- Naftali Paul Eisenberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device including performing...
- Patent number 11,373,870
- Issue date Jun 28, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Hsien Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for integrated selective monolayer doping
- Patent number 11,373,871
- Issue date Jun 28, 2022
- Applied Materials, Inc.
- Benjamin Colombeau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and methods of forming same
- Patent number 11,355,635
- Issue date Jun 7, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Hsiung Tsai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Forming MEMS Super-Junction Meta...
- Publication number 20240405067
- Publication date Dec 5, 2024
- IceMos Technology Limited
- Samuel J. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming MEMS Super-Junction Meta...
- Publication number 20240405068
- Publication date Dec 5, 2024
- IceMos Technology Limited
- Samuel J. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOTTOM-UP FORMATION OF CONTACT PLUGS
- Publication number 20240371691
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yen-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240290618
- Publication date Aug 29, 2024
- RENESAS ELECTRONICS CORPORATION
- Yanzhe WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuitry Comprising A Memory Array Comprising Strings O...
- Publication number 20240251556
- Publication date Jul 25, 2024
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE CONTACT STRUCTURES AND FABRICATION FOR METAL ON BOTH SIDES...
- Publication number 20240154011
- Publication date May 9, 2024
- Intel Corporation
- Patrick MORROW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR APPLYING A CAP LAYER TO PROTECT ELECTRICAL COMPONENTS OF...
- Publication number 20240079240
- Publication date Mar 7, 2024
- Honeywell International Inc.
- Yong-Fa Alan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Forming SiGe Channel
- Publication number 20240072168
- Publication date Feb 29, 2024
- Shanghai Huali Integrated Circuit Corporation
- Xinhua Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOPANT DIFFUSION WITH SHORT HIGH TEMPERATURE ANNEAL PULSES
- Publication number 20230411183
- Publication date Dec 21, 2023
- Applied Materials, Inc.
- Wolfgang R. ADERHOLD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming a Semiconductor Device by Driving Hydrogen into a...
- Publication number 20230386847
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hongfa LUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bottom-up Formation of Contact Plugs
- Publication number 20230386917
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co, LTD.
- Yen-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE CONTACT STRUCTURES AND FABRICATION FOR METAL ON BOTH SIDES...
- Publication number 20230275135
- Publication date Aug 31, 2023
- Intel Corporation
- Patrick MORROW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONOLITHIC MULTI-I REGION DIODE LIMITERS
- Publication number 20230260992
- Publication date Aug 17, 2023
- MACOM Technology Solutions Holdings, Inc.
- James Joseph Brogle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLING OF MOLECULES ON A 2D MATERIAL AND AN ELECTRONIC DEVICE
- Publication number 20230187544
- Publication date Jun 15, 2023
- GRAPHENSIC AB
- Samuel LARA-AVILA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
P+ OR N+ TYPE DOPING PROCESS FOR SEMICONDUCTORS
- Publication number 20230170219
- Publication date Jun 1, 2023
- Istituto Nazionale Di Fisica Nucleare (INFN)
- Gianluigi MAGGIONI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20230120621
- Publication date Apr 20, 2023
- Macronix International Co., Ltd.
- CHIH-KAI YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SPACER OF GRADUALLY CHANGED THICKNESS AND...
- Publication number 20230066077
- Publication date Mar 2, 2023
- Institute of Microelectronics, Chinese Academy of Sciences
- Huilong Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SPACER OF GRADUALLY CHANGED THICKNESS AND...
- Publication number 20230063993
- Publication date Mar 2, 2023
- Institute of Microelectronics, Chinese Academy of Sciences
- Huilong Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA-SHALLOW DOPANT AND OHMIC CONTACT REGIONS BY SOLID STATE DIFFU...
- Publication number 20230058186
- Publication date Feb 23, 2023
- TOKYO ELECTRON LIMITED
- Robert D. Clark
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Bottom-up Formation of Contact Plugs
- Publication number 20220359285
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yen-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220328314
- Publication date Oct 13, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Hsien WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20220328315
- Publication date Oct 13, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Hsien WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20220302158
- Publication date Sep 22, 2022
- KIOXIA Corporation
- Aki MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20220285552
- Publication date Sep 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Ling Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure and Methods of Forming Same
- Publication number 20220262951
- Publication date Aug 18, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Hsiung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFUSING AGENT COMPOSITION AND METHOD FOR PRODUCING SEMICONDUCTOR...
- Publication number 20220235234
- Publication date Jul 28, 2022
- Tokyo Ohka Kogyo Co., Ltd.
- Shunichi MASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuitry Comprising A Memory Array Comprising Strings O...
- Publication number 20220231042
- Publication date Jul 21, 2022
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE CONTACT STRUCTURES AND FABRICATION FOR METAL ON BOTH SIDES...
- Publication number 20220069094
- Publication date Mar 3, 2022
- Intel Corporation
- Patrick MORROW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONOLITHIC MULTI-I REGION DIODE LIMITERS
- Publication number 20210343706
- Publication date Nov 4, 2021
- MACOM Technology Solutions Holdings, Inc.
- James Joseph Brogle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BIFACIAL PHOTOVOLTAIC CELL
- Publication number 20210328090
- Publication date Oct 21, 2021
- SolAround Ltd.
- Naftali Paul Eisenberg
- H01 - BASIC ELECTRIC ELEMENTS

from or through or into an applied layer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of forming a semiconductor device by driving hydrogen into a...

Semiconductor structure and methods of forming same

Bottom-up formation of contact plugs

Bottom-up formation of contact plugs

Semiconductor device and method

Monolithic multi-I region diode limiters

Semiconductor device and manufacturing method thereof, and electron...

Method for manufacturing semiconductor device including annealing a...

Semiconductor device including a semiconductor fin comprising a sil...

Method used in forming a memory array comprising strings of memory...

Backside contact structures and fabrication for metal on both sides...

Assembling of molecules on a 2D material and an electronic device

Method of manufacturing semiconductor device

Method for forming barrier layer and method for manufacturing semic...

Semiconductor device with spacer of gradually changed thickness and...

Method of forming semiconductor device by driving hydrogen into a d...

P+ or N+ type doping process for semiconductors

Semiconductor device with spacer of gradually changed thickness and...

Monolithic multi-I region diode limiters

Backside contact structures and fabrication for metal on both sides...

Assembling of molecules on a 2D material and an electronic device

Semiconductor structure and method for forming the same

Semiconductor device with spacer of gradually changed thickness and...

Bottom-up formation of contact plugs

FinFET device and methods of forming

Multi-metal dipole doping to offer multi-threshold voltage pairs wi...

Bifacial photovoltaic cell

Method for manufacturing semiconductor device including performing...

Methods and apparatus for integrated selective monolayer doping

Semiconductor structure and methods of forming same

Patents Applicationslast 30 patents

Semiconductor Device and Method of Forming MEMS Super-Junction Meta...

Semiconductor Device and Method of Forming MEMS Super-Junction Meta...

BOTTOM-UP FORMATION OF CONTACT PLUGS

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Integrated Circuitry Comprising A Memory Array Comprising Strings O...

BACKSIDE CONTACT STRUCTURES AND FABRICATION FOR METAL ON BOTH SIDES...

METHOD FOR APPLYING A CAP LAYER TO PROTECT ELECTRICAL COMPONENTS OF...

Method for Forming SiGe Channel

DOPANT DIFFUSION WITH SHORT HIGH TEMPERATURE ANNEAL PULSES

Method of Forming a Semiconductor Device by Driving Hydrogen into a...

Bottom-up Formation of Contact Plugs

BACKSIDE CONTACT STRUCTURES AND FABRICATION FOR METAL ON BOTH SIDES...

MONOLITHIC MULTI-I REGION DIODE LIMITERS

ASSEMBLING OF MOLECULES ON A 2D MATERIAL AND AN ELECTRONIC DEVICE

P+ OR N+ TYPE DOPING PROCESS FOR SEMICONDUCTORS

MEMORY DEVICE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE WITH SPACER OF GRADUALLY CHANGED THICKNESS AND...

SEMICONDUCTOR DEVICE WITH SPACER OF GRADUALLY CHANGED THICKNESS AND...

ULTRA-SHALLOW DOPANT AND OHMIC CONTACT REGIONS BY SOLID STATE DIFFU...

Bottom-up Formation of Contact Plugs

SEMICONDUCTOR DEVICE

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Semiconductor Device and Method

Semiconductor Structure and Methods of Forming Same

DIFFUSING AGENT COMPOSITION AND METHOD FOR PRODUCING SEMICONDUCTOR...

Integrated Circuitry Comprising A Memory Array Comprising Strings O...

BACKSIDE CONTACT STRUCTURES AND FABRICATION FOR METAL ON BOTH SIDES...

MONOLITHIC MULTI-I REGION DIODE LIMITERS

BIFACIAL PHOTOVOLTAIC CELL