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H01L2224/3351

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/3351Function

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Display device including connection pad part and electronic compone...
- Patent number 12,057,430
- Issue date Aug 6, 2024
- Samsung Display Co., Ltd.
- Jungyun Jo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and display device using the same
- Patent number 12,021,056
- Issue date Jun 25, 2024
- LG Display Co., Ltd.
- Chang Hyun Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC packaging with hot spot thermal management features
- Patent number 11,961,779
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. (TSMC)
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and forming method thereof
- Patent number 11,955,441
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jian-Hong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 11,855,067
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of forming the same
- Patent number 11,742,323
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chien Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing semiconductor packaging device and heat di...
- Patent number 11,658,091
- Issue date May 23, 2023
- Global Unichip Corporation
- Jia-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with enhanced thermal dissipation and method f...
- Patent number 11,626,343
- Issue date Apr 11, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yang-Che Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 11,502,072
- Issue date Nov 15, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation structure, semiconductor packaging device, and man...
- Patent number 11,450,586
- Issue date Sep 20, 2022
- Global Unichip Corporation
- Jia-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro LED display and manufacturing method with conductive film
- Patent number 11,417,627
- Issue date Aug 16, 2022
- Samsung Electronics Co., Ltd.
- Jamyeong Koo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tiled light emitting diode display panel having different resistanc...
- Patent number 11,355,473
- Issue date Jun 7, 2022
- A.U. VISTA, INC.
- Fang-Chen Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor device including dummy via anch...
- Patent number 11,302,654
- Issue date Apr 12, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jian-Hong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC packaging with hot spot thermal management features
- Patent number 11,037,852
- Issue date Jun 15, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including dummy via anchored to dummy metal layer
- Patent number 10,777,510
- Issue date Sep 15, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jian-Hong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Warpage control in package-on-package structures
- Patent number 10,535,616
- Issue date Jan 14, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip modules and methods of fabrication
- Patent number 10,490,520
- Issue date Nov 26, 2019
- Invensas Corporation
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
3DIC packaging with hot spot thermal management features
- Patent number 10,461,009
- Issue date Oct 29, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer board and electronic device
- Patent number 10,354,939
- Issue date Jul 16, 2019
- Murata Manufacturing Co., Ltd.
- Kuniaki Yosui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low thermal resistance hanging die package
- Patent number 10,347,558
- Issue date Jul 9, 2019
- Intel IP Corporation
- Christian Geissler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor package
- Patent number 10,256,203
- Issue date Apr 9, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Lipu Kris Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Warpage control in package-on-package structures
- Patent number 10,170,434
- Issue date Jan 1, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip modules and methods of fabrication
- Patent number 10,163,833
- Issue date Dec 25, 2018
- Invensas Corporation
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
3DIC packaging with hot spot thermal management features
- Patent number 10,157,813
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package semiconductor device
- Patent number 10,083,940
- Issue date Sep 25, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 9,991,221
- Issue date Jun 5, 2018
- Renesas Electronics Corporation
- Jun Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Warpage control in package-on-package structures
- Patent number 9,941,221
- Issue date Apr 10, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method for the semiconductor...
- Patent number 9,847,311
- Issue date Dec 19, 2017
- Toyota Jidosha Kabushiki Kaisha
- Takuya Kadoguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 9,818,715
- Issue date Nov 14, 2017
- Renesas Electronics Corporation
- Jun Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC packaging with hot spot thermal management features
- Patent number 9,735,082
- Issue date Aug 15, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE AND SUBSTRATE STRUCTURE THEREOF
- Publication number 20240363577
- Publication date Oct 31, 2024
- Siliconware Precision Industries Co., Ltd.
- Pin-Jing SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND DISPLAY DEVICE USING THE SAME
- Publication number 20240312945
- Publication date Sep 19, 2024
- LG Display Co., Ltd.
- Chang Hyun SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240234261
- Publication date Jul 11, 2024
- Fuji Electric Co., Ltd.
- Masaharu Yamaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC PACKAGING WITH HOT SPOT THERMAL MANAGEMENT FEATURES
- Publication number 20240222218
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Co, LTD.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND FORMING METHOD THEREOF
- Publication number 20240213180
- Publication date Jun 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jian-Hong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240203960
- Publication date Jun 20, 2024
- Samsung Electronics Co., Ltd.
- Seokhyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED PASSIVE DEVICE WITH VIA FORMED IN ISOLATION TRENCH
- Publication number 20240105586
- Publication date Mar 28, 2024
- Saras Mirco Devices, Inc.
- Courtney Timms
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF ELECTRONIC PACKAGE
- Publication number 20240096835
- Publication date Mar 21, 2024
- Siliconware Precision Industries Co., Ltd.
- Pin-Jing SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package and Method
- Publication number 20240088123
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240079366
- Publication date Mar 7, 2024
- Samsung Electronics Co., Ltd.
- Jonggyu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR PREPARING SEMICONDUC...
- Publication number 20240055408
- Publication date Feb 15, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Kaimin LV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20230378130
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Chien Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHTING ELEMENT ALIGNMENT
- Publication number 20230268457
- Publication date Aug 24, 2023
- Lumileds LLC
- Michael DECKERS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD FOR FABRICATION THEREOF
- Publication number 20230053037
- Publication date Feb 16, 2023
- SAMSUNG DISPLAY CO., LTD.
- Jin Woo CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20230020955
- Publication date Jan 19, 2023
- SHARP KABUSHIKI KAISHA
- JUN SAKUMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package and Method
- Publication number 20220392884
- Publication date Dec 8, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING SEMICONDUCTOR PACKAGING DEVICE AND HEAT DI...
- Publication number 20220367313
- Publication date Nov 17, 2022
- Global Unichip Corporation
- Jia-Liang CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH ENHANCED THERMAL DISSIPATION AND METHOD F...
- Publication number 20220367318
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yang-Che CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20220344304
- Publication date Oct 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Chien Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION STRUCTURE, SEMICONDUCTOR PACKAGING DEVICE, AND MAN...
- Publication number 20220262701
- Publication date Aug 18, 2022
- Global Unichip Corporation
- Jia-Liang CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD FOR MANUFACTURING THEREOF
- Publication number 20220216177
- Publication date Jul 7, 2022
- JUNGYUN JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND FORMING METHOD THEREOF
- Publication number 20220216165
- Publication date Jul 7, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jian-Hong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Module, Use of Chip Module, Test Arrangement and Test Method
- Publication number 20220181247
- Publication date Jun 9, 2022
- FIRST SENSOR AG
- Stephan Dobritz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND DISPLAY DEVICE USING THE SAME
- Publication number 20210398933
- Publication date Dec 23, 2021
- LG Display Co., Ltd.
- Chang Hyun SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD
- Publication number 20210327866
- Publication date Oct 21, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO LED DISPLAY AND MANUFACTURING METHOD THEREOF
- Publication number 20210050336
- Publication date Feb 18, 2021
- Samsung Electronics Co., Ltd.
- Jamyeong KOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20200411452
- Publication date Dec 31, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jian-Hong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH ENHANCED THERMAL DISSIPATION AND METHOD F...
- Publication number 20200135613
- Publication date Apr 30, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yang-Che CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Warpage Control in Package-on-Package Structures
- Publication number 20190131254
- Publication date May 2, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC Packaging with Hot Spot Thermal Management Features
- Publication number 20190096781
- Publication date Mar 28, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Display device including connection pad part and electronic compone...

Electronic device and display device using the same

3DIC packaging with hot spot thermal management features

Interconnect structure and forming method thereof

Integrated circuit package and method

Semiconductor structure and method of forming the same

Methods of manufacturing semiconductor packaging device and heat di...

Semiconductor device with enhanced thermal dissipation and method f...

Integrated circuit package and method

Heat dissipation structure, semiconductor packaging device, and man...

Micro LED display and manufacturing method with conductive film

Tiled light emitting diode display panel having different resistanc...

Method of fabricating semiconductor device including dummy via anch...

3DIC packaging with hot spot thermal management features

Semiconductor device including dummy via anchored to dummy metal layer

Warpage control in package-on-package structures

Multichip modules and methods of fabrication

3DIC packaging with hot spot thermal management features

Multilayer board and electronic device

Low thermal resistance hanging die package

Semiconductor device and semiconductor package

Warpage control in package-on-package structures

Multichip modules and methods of fabrication

3DIC packaging with hot spot thermal management features

Package-on-package semiconductor device

Semiconductor integrated circuit device

Warpage control in package-on-package structures

Semiconductor device and manufacturing method for the semiconductor...

Semiconductor integrated circuit device

3DIC packaging with hot spot thermal management features

Patents Applicationslast 30 patents

ELECTRONIC PACKAGE AND SUBSTRATE STRUCTURE THEREOF

ELECTRONIC DEVICE AND DISPLAY DEVICE USING THE SAME

SEMICONDUCTOR DEVICE

3DIC PACKAGING WITH HOT SPOT THERMAL MANAGEMENT FEATURES

INTERCONNECT STRUCTURE AND FORMING METHOD THEREOF

SEMICONDUCTOR PACKAGE

INTEGRATED PASSIVE DEVICE WITH VIA FORMED IN ISOLATION TRENCH

MANUFACTURING METHOD OF ELECTRONIC PACKAGE

Integrated Circuit Package and Method

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR PREPARING SEMICONDUC...

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

LIGHTING ELEMENT ALIGNMENT

DISPLAY DEVICE AND METHOD FOR FABRICATION THEREOF

DISPLAY DEVICE

Integrated Circuit Package and Method

METHODS OF MANUFACTURING SEMICONDUCTOR PACKAGING DEVICE AND HEAT DI...

SEMICONDUCTOR DEVICE WITH ENHANCED THERMAL DISSIPATION AND METHOD F...

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

HEAT DISSIPATION STRUCTURE, SEMICONDUCTOR PACKAGING DEVICE, AND MAN...

DISPLAY DEVICE AND METHOD FOR MANUFACTURING THEREOF

INTERCONNECT STRUCTURE AND FORMING METHOD THEREOF

Chip Module, Use of Chip Module, Test Arrangement and Test Method

ELECTRONIC DEVICE AND DISPLAY DEVICE USING THE SAME

INTEGRATED CIRCUIT PACKAGE AND METHOD

MICRO LED DISPLAY AND MANUFACTURING METHOD THEREOF

METHOD OF FABRICATING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE WITH ENHANCED THERMAL DISSIPATION AND METHOD F...

Warpage Control in Package-on-Package Structures

3DIC Packaging with Hot Spot Thermal Management Features