Fuse

Industry

CPC
Y10S148/055

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Parent Industries

YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10USPC classification Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10S148/00Metal treatment

Current Industry

Y10S148/055Fuse

Industries

Patents Grantslast 30 patents

Information Patent Grant
Fuse in top level metal and in a step, process of making and proces...
- Patent number 6,331,739
- Issue date Dec 18, 2001
- Texas Instruments Incorporated
- Hideyuki Fukuhara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of jointly forming stacked capacitors and antifuses, method...
- Patent number 6,291,871
- Issue date Sep 18, 2001
- Micron Technology, Inc.
- Charles H. Dennison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a fuse
- Patent number 6,285,540
- Issue date Sep 4, 2001
- Samsung Electronics Co., Ltd.
- Dong-Hun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fuse window guard ring structure for nitride capped self aligned co...
- Patent number 6,255,715
- Issue date Jul 3, 2001
- Taiwan Semiconductor Manufacturing Company
- Jhon-Jhy Liaw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of jointly forming stacked capacitors and antifuses, method...
- Patent number 6,221,729
- Issue date Apr 24, 2001
- Micron Technology, Inc.
- Charles H. Dennison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mask reduction process with a method of forming a raised fuse and a...
- Patent number 6,174,753
- Issue date Jan 16, 2001
- Vanguard International Semiconductor Corporation
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric-polysilicon-dielectric-polysilicon-dielectric antifuse f...
- Patent number 6,150,705
- Issue date Nov 21, 2000
- Actel Corporation
- Wenn-Jei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of jointly forming stacked capacitors and antifuses method o...
- Patent number 6,146,925
- Issue date Nov 14, 2000
- Micron Technology, Inc.
- Charles H. Dennison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Programmable interconnect structures and programmable integrated ci...
- Patent number 6,097,077
- Issue date Aug 1, 2000
- QuickLogic Corporation
- Kathryn E. Gordon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a fuse in a semiconductor device and a semiconduct...
- Patent number 6,074,940
- Issue date Jun 13, 2000
- Samsung Eletronics Co., Ltd.
- Dong-Hun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fuse window guard ring structure for nitride capped self aligned co...
- Patent number 5,970,346
- Issue date Oct 19, 1999
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jhon-Jhy Liaw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit having an opening for a fuse
- Patent number 5,965,927
- Issue date Oct 12, 1999
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jin-Yuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having amorphous silicon antifuse structures
- Patent number 5,962,911
- Issue date Oct 5, 1999
- VLSI Technology, Inc.
- Martin Harold Manley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Programmable semiconductor element having an antifuse structure
- Patent number 5,936,297
- Issue date Aug 10, 1999
- Lg Semicon Co., Ltd.
- Young Kwon Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making an integrated circuit having an opening for a fuse
- Patent number 5,879,966
- Issue date Mar 9, 1999
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jin-Yuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Programmable interconnect structures and programmable integrated ci...
- Patent number 5,880,512
- Issue date Mar 9, 1999
- QuickLogic Corporation
- Kathryn E. Gordon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a field programmable device
- Patent number 5,856,233
- Issue date Jan 5, 1999
- STMicroelectronics, Inc.
- Frank Randolph Bryant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a fuse structure
- Patent number 5,827,759
- Issue date Oct 27, 1998
- Siemens Microelectronics, Inc.
- Karl-Heinz Froehner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fuse structure for an integrated circuit element
- Patent number 5,789,794
- Issue date Aug 4, 1998
- Siemens Aktiengesellschaft
- Karl-Heinz Froehner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for over-etching to improve voltage distribution
- Patent number 5,786,240
- Issue date Jul 28, 1998
- Xilinx, Inc.
- Kevin T. Look
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming programmable interconnect structures and program...
- Patent number 5,786,268
- Issue date Jul 28, 1998
- QuickLogic Corporation
- Kathryn E. Gordon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Moisture barrier layers for integrated circuit applications
- Patent number 5,760,453
- Issue date Jun 2, 1998
- Vanguard International Semiconductor Corporation
- Chung-zen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of jointly forming stacked capacitors and antifuses
- Patent number 5,756,393
- Issue date May 26, 1998
- Micron Technology, Inc.
- Charles H. Dennison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fuse structure and method for manufacturing it
- Patent number 5,754,089
- Issue date May 19, 1998
- Taiwan Semiconductor Manufacturing Company Ltd.
- Der-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective film for fuse window passivation for semiconductor integ...
- Patent number 5,729,041
- Issue date Mar 17, 1998
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chue-San Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of jointly forming stacked capacitors and antifuses, method...
- Patent number 5,726,483
- Issue date Mar 10, 1998
- Micron Technology, Inc.
- Charles H. Dennison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing amorphous silicon antifuse structures
- Patent number 5,723,358
- Issue date Mar 3, 1998
- VLSI Technology, Inc.
- Martin Harold Manley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming moisture barrier layers for integrated circuit ap...
- Patent number 5,712,206
- Issue date Jan 27, 1998
- Vanguard International Semiconductor Corporation
- Chung-zen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Programmable interconnect structures and programmable integrated ci...
- Patent number 5,701,027
- Issue date Dec 23, 1997
- QuickLogic Corporation
- Kathryn E. Gordon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric-polysilicon-dielectric antifuse for field programmable l...
- Patent number 5,670,403
- Issue date Sep 23, 1997
- Actel Corporation
- Wenn-Jei Chen
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Fuse in top level metal and in a step, process of making and proces...

Method of jointly forming stacked capacitors and antifuses, method...

Semiconductor device having a fuse

Fuse window guard ring structure for nitride capped self aligned co...

Method of jointly forming stacked capacitors and antifuses, method...

Mask reduction process with a method of forming a raised fuse and a...

Dielectric-polysilicon-dielectric-polysilicon-dielectric antifuse f...

Method of jointly forming stacked capacitors and antifuses method o...

Programmable interconnect structures and programmable integrated ci...

Method of making a fuse in a semiconductor device and a semiconduct...

Fuse window guard ring structure for nitride capped self aligned co...

Integrated circuit having an opening for a fuse

Semiconductor devices having amorphous silicon antifuse structures

Programmable semiconductor element having an antifuse structure

Method of making an integrated circuit having an opening for a fuse

Programmable interconnect structures and programmable integrated ci...

Method of forming a field programmable device

Method of manufacturing a fuse structure

Fuse structure for an integrated circuit element

Method for over-etching to improve voltage distribution

Method for forming programmable interconnect structures and program...

Moisture barrier layers for integrated circuit applications

Methods of jointly forming stacked capacitors and antifuses

Fuse structure and method for manufacturing it

Protective film for fuse window passivation for semiconductor integ...

Method of jointly forming stacked capacitors and antifuses, method...

Method of manufacturing amorphous silicon antifuse structures

Method of forming moisture barrier layers for integrated circuit ap...

Programmable interconnect structures and programmable integrated ci...

Dielectric-polysilicon-dielectric antifuse for field programmable l...