TREA

Gallium [Ga] as principal constituent

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  • CPC
  • H01L2224/05105
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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/05105Gallium [Ga] as principal constituent
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    RESIN COMPOSITION FOR ENCAPSULATION AND SEMICONDUCTOR DEVICE
    • Publication number 20240263004
    • Publication date Aug 8, 2024
    • Shin-Etsu Chemical Co., Ltd.
    • Shoichi OSADA
    • C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
  • Information Patent Application

    MULTI-METAL CONTACT STRUCTURE
    • Publication number 20240203917
    • Publication date Jun 20, 2024
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Rajesh Katkar
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE WITH ADVANCED PAD STRUCTURE AND METHOD FOR FOR...
    • Publication number 20240153897
    • Publication date May 9, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Fu-Chiang Kuo
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    RESIN COMPOSITION FOR ENCAPSULATION AND SEMICONDUCTOR DEVICE
    • Publication number 20220372274
    • Publication date Nov 24, 2022
    • Shin-Etsu Chemical Co., Ltd.
    • Shoichi OSADA
    • C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
  • Information Patent Application

    MULTI-METAL CONTACT STRUCTURE
    • Publication number 20210335737
    • Publication date Oct 28, 2021
    • INVENSAS BONDING TECHNOLOGIES, INC.
    • Rajesh KATKAR
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTI-METAL CONTACT STRUCTURE
    • Publication number 20200105692
    • Publication date Apr 2, 2020
    • INVENSAS BONDING TECHNOLOGIES INC.
    • Rajesh KATKAR
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Multi-metal contact structure
    • Publication number 20180269172
    • Publication date Sep 20, 2018
    • INVENSAS BONDING TECHNOLOGIES, INC.
    • Rajesh KATKAR
    • H01 - BASIC ELECTRIC ELEMENTS