TREA

Gallium (Ga) as principal constituent

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  • CPC
  • H01L2224/45605
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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/45605Gallium (Ga) as principal constituent
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Patents Grantslast 30 patents

  • Information Patent Grant

    Bonding wire for semiconductor devices
    • Patent number 11,929,343
    • Issue date Mar 12, 2024
    • Nippon Micrometal Corporation
    • Daizo Oda
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Bonding wire for semiconductor device
    • Patent number 10,840,208
    • Issue date Nov 17, 2020
    • NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
    • Tetsuya Oyamada
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Reliable wire method
    • Patent number 9,245,670
    • Issue date Jan 26, 2016
    • Tessera, Inc.
    • Cyprian Uzoh
    • Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Information Patent Grant

    Reliable wire structure and method
    • Patent number 8,692,118
    • Issue date Apr 8, 2014
    • Tessera, Inc.
    • Cyprian Uzoh
    • Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Information Patent Grant

    3006067
    • Patent number 3,006,067
    • Issue date Oct 31, 1961
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICES
    • Publication number 20230387066
    • Publication date Nov 30, 2023
    • NIPPON MICROMETAL CORPORATION
    • Daizo ODA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICES
    • Publication number 20230245995
    • Publication date Aug 3, 2023
    • NIPPON MICROMETAL CORPORATION
    • Daizo ODA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICE
    • Publication number 20170365576
    • Publication date Dec 21, 2017
    • NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
    • Tetsuya OYAMADA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    RELIABLE WIRE STRUCTURE AND METHOD
    • Publication number 20140157592
    • Publication date Jun 12, 2014
    • Tessera, Inc.
    • Cyprian Uzoh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    RELIABLE WIRE STRUCTURE AND METHOD
    • Publication number 20120325517
    • Publication date Dec 27, 2012
    • Tessera, Inc.
    • Cyprian Uzoh
    • H01 - BASIC ELECTRIC ELEMENTS