3006067

Information

• Patent Grant
• 3006067

• References
• Source

• Patent Number

  3,006,067

• Date Filed

  Not available

• Date Issued

  Tuesday, October 31, 1961
  63 years ago

• CPC

  • H01L24/85 - using a wire connector
  • H01L21/00 - Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/24 - Alloying of impurity materials
  • H01L21/48 - Manufacture or treatment of parts
  • H01L21/52 - Mounting semiconductor bodies in containers
  • H01L23/08 - the material being an electrical insulator
  • H01L23/10 - characterised by the material or arrangement of seals between parts,ween cap
  • H01L23/14 - characterised by the material or its electrical properties
  • H01L24/48 - of an individual wire connector
  • H01L24/78 - Apparatus for connecting with wire connectors
  • H01L24/45 - of an individual wire connector
  • H01L24/49 - of a plurality of wire connectors
  • H01L2224/05553 - being rectangular
  • H01L2224/45015 - being circular
  • H01L2224/451 - with a principal constituent of the material being a metal or a metalloid
  • H01L2224/45124 - Aluminium (Al) as principal constituent
  • H01L2224/45139 - Silver (Ag) as principal constituent
  • H01L2224/45144 - Gold (Au) as principal constituent
  • H01L2224/45147 - Copper (Cu) as principal constituent
  • H01L2224/4554 - Coating
  • H01L2224/45565 - Single coating layer
  • H01L2224/45605 - Gallium (Ga) as principal constituent
  • H01L2224/45609 - Indium (In) as principal constituent
  • H01L2224/45611 - Tin (Sn) as principal constituent
  • H01L2224/4562 - Antimony (Sb) as principal constituent
  • H01L2224/45639 - Silver (Ag) as principal constituent
  • H01L2224/48463 - the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
  • H01L2224/4847 - the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
  • H01L2224/48599 - Principal constituent of the connecting portion of the wire connector being Gold (Au)
  • H01L2224/48699 - Principal constituent of the connecting portion of the wire connector being Aluminium (Al)
  • H01L2224/48799 - Principal constituent of the connecting portion of the wire connector being Copper (Cu)
  • H01L2224/49171 - Fan-out arrangements
  • H01L2224/78 - Apparatus for connecting with wire connectors
  • H01L2224/85201 - Compression bonding
  • H01L2224/85203 - Thermocompression bonding
  • H01L2924/01005 - Boron [B]
  • H01L2924/01006 - Carbon [C]
  • H01L2924/01013 - Aluminum [Al]
  • H01L2924/01014 - Silicon [Si]
  • H01L2924/01015 - Phosphorus [P]
  • H01L2924/01019 - Potassium [K]
  • H01L2924/01022 - Titanium [Ti]
  • H01L2924/01027 - Cobalt [Co]
  • H01L2924/01029 - Copper [Cu]
  • H01L2924/01031 - Gallium [Ga]
  • H01L2924/01032 - Germanium [Ge]
  • H01L2924/01033 - Arsenic [As]
  • H01L2924/01043 - Technetium [Tc]
  • H01L2924/01047 - Silver [Ag]
  • H01L2924/01049 - Indium [In]
  • H01L2924/0105 - Tin [Sn]
  • H01L2924/01051 - Antimony [Sb]
  • H01L2924/01056 - Barium [Ba]
  • H01L2924/01067 - Holmium [Ho]
  • H01L2924/01074 - Tungsten [W]
  • H01L2924/01075 - Rhenium [Re]
  • H01L2924/01079 - Gold [Au]
  • H01L2924/01082 - Lead [Pb]
  • H01L2924/01322 - Eutectic Alloys
  • H01L2924/014 - Solder alloys
  • H01L2924/09701 - Low temperature co-fired ceramic [LTCC]
  • H01L2924/12033 - Gunn diode
  • H01L2924/20751 - larger or equal to 10 microns less than 20 microns
  • Y10S228/903 - Metal to nonmetal
  • Y10T29/49169 - Assembling electrical component directly to terminal or elongated conductor

• US Classifications

  • 228 - Metal fusion bonding
  • 029 - Metal working
  • 257 - Active solid-state devices