Gallium [Ga] as principal constituent

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H01L2224/13105

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/13105Gallium [Ga] as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and manufacturing method thereof
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- Issue date Oct 8, 2024
- Advanced Semiconductor Engineering, Inc.
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced device assembly structures and methods
- Patent number 11,999,001
- Issue date Jun 4, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method
- Patent number 11,764,139
- Issue date Sep 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superconducting bump bonds for quantum computing systems
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- Issue date Mar 7, 2023
- Google LLC
- Zhimin Jamie Yao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Structures for bonding a group III-V device to a substrate by stack...
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- Issue date Oct 26, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jhih-Bin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D packaging with low-force thermocompression bonding of oxidizable...
- Patent number 11,134,598
- Issue date Sep 28, 2021
- SET North America, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,062,987
- Issue date Jul 13, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures for bonding a group III-V device to a substrate by stack...
- Patent number 10,643,964
- Issue date May 5, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jhih-Bin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 10,622,297
- Issue date Apr 14, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of forming thereof
- Patent number 10,262,959
- Issue date Apr 16, 2019
- Infineon Technologies AG
- Evelyn Napetschnig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing metal ball, joining material, and metal ball
- Patent number 10,150,185
- Issue date Dec 11, 2018
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Self-aligned under bump metal
- Patent number 9,865,555
- Issue date Jan 9, 2018
- Texas Instruments Incorporated
- Manoj K. Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid metal flip chip devices
- Patent number 9,761,542
- Issue date Sep 12, 2017
- International Business Machines Corporation
- Julien Sylvestre
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead-free solder ball
- Patent number 9,700,963
- Issue date Jul 11, 2017
- Senju Metal Industry Co., Ltd.
- Tsukasa Ohnishi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Localized sealing of interconnect structures in small gaps
- Patent number 9,685,420
- Issue date Jun 20, 2017
- Invensas Corporation
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packaging method and chip package using hydrophobic surface
- Patent number 9,570,415
- Issue date Feb 14, 2017
- KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
- Hyo Hoon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of forming thereof
- Patent number 9,484,316
- Issue date Nov 1, 2016
- Infineon Technologies AG
- Evelyn Napetschnig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced device assembly structures and methods
- Patent number 9,024,205
- Issue date May 5, 2015
- Invensas Corporation
- Cyprian Emeka Uzoh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit assembly and method of making
- Patent number 8,912,646
- Issue date Dec 16, 2014
- Silanna Semiconductor U.S.A., Inc.
- Michael A. Stuber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip mounting method and bump forming method
- Patent number 8,283,246
- Issue date Oct 9, 2012
- Panasonic Corporation
- Takashi Kitae
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit/substrate interconnect system and method of manu...
- Patent number 8,198,727
- Issue date Jun 12, 2012
- NVIDIA Corporation
- Inderjit Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip mounting method and bump forming method
- Patent number 7,951,700
- Issue date May 31, 2011
- Panasonic Corporation
- Takashi Kitae
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing metal chips by plasma from a layer compris...
- Patent number 7,691,735
- Issue date Apr 6, 2010
- Commissariat a l'Energie Atomique
- Laurent Grenouillet
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device including an insulating film and insulating pi...
- Patent number 7,675,183
- Issue date Mar 9, 2010
- Kabushiki Kaisha Toshiba
- Hiroshi Toyoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder structures for out of plane connections
- Patent number 7,659,621
- Issue date Feb 9, 2010
- Unitive International Limited
- Glenn A. Rinne
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of providing solder structures for out plane connections
- Patent number 7,049,216
- Issue date May 23, 2006
- Unitive International Limited
- Glenn A. Rinne
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder compositions for attaching a die to a substrate
- Patent number 6,740,544
- Issue date May 25, 2004
- Freescale Semiconductor, Inc.
- Floyd Strouse
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with improved bonding
- Patent number 6,727,593
- Issue date Apr 27, 2004
- Kabushiki Kaisha Toshiba
- Hiroshi Toyoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices having metallurgies containing copper-semiconduc...
- Patent number 5,855,993
- Issue date Jan 5, 1999
- International Business Machines Corporation
- Michael John Brady
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE
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- Publication date Oct 31, 2024
- Innolux Corporation
- Wei-Yuan Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240332158
- Publication date Oct 3, 2024
- InnoLux Corporation
- Ker-Yih KAO
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CIRCUIT BOARD
- Publication number 20240282685
- Publication date Aug 22, 2024
- LG Innotek Co., Ltd.
- Jae Hun JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20240243108
- Publication date Jul 18, 2024
- InnoLux Corporation
- Jui-Jen YUEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240162185
- Publication date May 16, 2024
- InnoLux Corporation
- Chin-Ming HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL SHIELD FOR FINE PITCH INTERCONNECTS
- Publication number 20240145420
- Publication date May 2, 2024
- Intel Corporation
- Bok Eng CHEAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL BASED FIRST LEVEL INTERCONNECTS
- Publication number 20240006400
- Publication date Jan 4, 2024
- Intel Corporation
- Kyle J. Arrington
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING NANOWIRE AND SOLDER INTERCONNECTS
- Publication number 20230299032
- Publication date Sep 21, 2023
- Intel Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Superconducting Bump Bonds for Quantum Computing Systems
- Publication number 20230207507
- Publication date Jun 29, 2023
- Google LLC
- Zhimin Jamie Yao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Advanced Device Assembly Structures And Methods
- Publication number 20220097166
- Publication date Mar 31, 2022
- Invensas Corporation
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HYBRID BONDING STRUCTURES, SEMICONDUCTOR DEVICES HAVING THE SAME, A...
- Publication number 20220093549
- Publication date Mar 24, 2022
- Samsung Electronics Co., Ltd.
- Kunmo CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20210335701
- Publication date Oct 28, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20200243435
- Publication date Jul 30, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES FOR BONDING A GROUP III-V DEVICE TO A SUBSTRATE BY STACK...
- Publication number 20200227369
- Publication date Jul 16, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Jhih-Bin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES FOR BONDING A GROUP III-V DEVICE TO A SUBSTRATE
- Publication number 20200006271
- Publication date Jan 2, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Jhih-Bin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20190096796
- Publication date Mar 28, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermocompression Bonding with Passivated Gold Contacting Metal
- Publication number 20180132397
- Publication date May 10, 2018
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- B32 - LAYERED PRODUCTS
Information Patent Application
Thermocompression Bonding with Passivated Silver-Based Contacting M...
- Publication number 20180132398
- Publication date May 10, 2018
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- B32 - LAYERED PRODUCTS
Information Patent Application
Thermocompression Bonding with Passivated Indium-Based Contacting M...
- Publication number 20180132395
- Publication date May 10, 2018
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- B32 - LAYERED PRODUCTS
Information Patent Application
Thermocompression Bonding with Passivated Copper-Based Contacting M...
- Publication number 20180132396
- Publication date May 10, 2018
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- B32 - LAYERED PRODUCTS
Information Patent Application
Thermocompression Bonding Using Metastable Gas Atoms
- Publication number 20180132394
- Publication date May 10, 2018
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- B32 - LAYERED PRODUCTS
Information Patent Application
System for Low-Force Thermocompression Bonding
- Publication number 20180132393
- Publication date May 10, 2018
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- B32 - LAYERED PRODUCTS
Information Patent Application
Thermocompression Bonding with Passivated Nickel-Based Contacting M...
- Publication number 20180132399
- Publication date May 10, 2018
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- B32 - LAYERED PRODUCTS
Information Patent Application
SELF-ALIGNED UNDER BUMP METAL
- Publication number 20170179053
- Publication date Jun 22, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Manoj K. JAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead-Free Solder Ball
- Publication number 20160339543
- Publication date Nov 24, 2016
- SENJU METAL INDUSTRY CO., LTD.
- Tsukasa Ohnishi
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Semiconductor Package Configured for Connection to a Board
- Publication number 20160329292
- Publication date Nov 10, 2016
- INFINEON TECHNOLOGIES AG
- Carlo Marbella
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING METHOD AND CHIP PACKAGE USING HYDROPHOBIC SURFACE
- Publication number 20150311177
- Publication date Oct 29, 2015
- Korea Advanced Institute of Science and Technology
- Hyo Hoon PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED DEVICE ASSEMBLY STRUCTURES AND METHODS
- Publication number 20140153210
- Publication date Jun 5, 2014
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN INTEGRATED CIRCUIT CHIP-ON-BOARD ASSEMBLY AND METHOD OF MAKING
- Publication number 20140035129
- Publication date Feb 6, 2014
- IO SEMICONDUCTOR, INC.
- Michael A. Stuber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D Packaging With Low-Force Thermocompression Bonding Of Oxidizable...
- Publication number 20130270329
- Publication date Oct 17, 2013
- Eric Frank Schulte
- B32 - LAYERED PRODUCTS

Gallium [Ga] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package and manufacturing method thereof

Advanced device assembly structures and methods

Semiconductor device and method

Superconducting bump bonds for quantum computing systems

Structures for bonding a group III-V device to a substrate by stack...

3D packaging with low-force thermocompression bonding of oxidizable...

Semiconductor device

Structures for bonding a group III-V device to a substrate by stack...

Semiconductor device and method

Semiconductor devices and methods of forming thereof

Method for producing metal ball, joining material, and metal ball

Self-aligned under bump metal

Liquid metal flip chip devices

Lead-free solder ball

Localized sealing of interconnect structures in small gaps

Chip packaging method and chip package using hydrophobic surface

Semiconductor devices and methods of forming thereof

Advanced device assembly structures and methods

Integrated circuit assembly and method of making

Flip chip mounting method and bump forming method

Integrated circuit/substrate interconnect system and method of manu...

Flip chip mounting method and bump forming method

Method for manufacturing metal chips by plasma from a layer compris...

Semiconductor device including an insulating film and insulating pi...

Solder structures for out of plane connections

Methods of providing solder structures for out plane connections

Solder compositions for attaching a die to a substrate

Semiconductor device with improved bonding

Electronic devices having metallurgies containing copper-semiconduc...

Patents Applicationslast 30 patents

ELECTRONIC DEVICE

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

CIRCUIT BOARD

ELECTRONIC DEVICE AND METHOD FOR FORMING THE SAME

ELECTRONIC DEVICE

LIQUID METAL SHIELD FOR FINE PITCH INTERCONNECTS

LIQUID METAL BASED FIRST LEVEL INTERCONNECTS

MICROELECTRONIC ASSEMBLIES INCLUDING NANOWIRE AND SOLDER INTERCONNECTS

Superconducting Bump Bonds for Quantum Computing Systems

Advanced Device Assembly Structures And Methods

HYBRID BONDING STRUCTURES, SEMICONDUCTOR DEVICES HAVING THE SAME, A...

SEMICONDUCTOR DEVICE AND METHOD

Semiconductor Device and Method

STRUCTURES FOR BONDING A GROUP III-V DEVICE TO A SUBSTRATE BY STACK...

STRUCTURES FOR BONDING A GROUP III-V DEVICE TO A SUBSTRATE

Semiconductor Device and Method

Thermocompression Bonding with Passivated Gold Contacting Metal

Thermocompression Bonding with Passivated Silver-Based Contacting M...

Thermocompression Bonding with Passivated Indium-Based Contacting M...

Thermocompression Bonding with Passivated Copper-Based Contacting M...

Thermocompression Bonding Using Metastable Gas Atoms

System for Low-Force Thermocompression Bonding

Thermocompression Bonding with Passivated Nickel-Based Contacting M...

SELF-ALIGNED UNDER BUMP METAL

Lead-Free Solder Ball

Semiconductor Package Configured for Connection to a Board

CHIP PACKAGING METHOD AND CHIP PACKAGE USING HYDROPHOBIC SURFACE

ADVANCED DEVICE ASSEMBLY STRUCTURES AND METHODS

THIN INTEGRATED CIRCUIT CHIP-ON-BOARD ASSEMBLY AND METHOD OF MAKING

3D Packaging With Low-Force Thermocompression Bonding Of Oxidizable...