Gallium [Ga]

Industry

CPC
H01L2924/01031

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/01031Gallium [Ga]

Industries

Patents Grantslast 30 patents

Information Patent Grant
Bonding wire for semiconductor devices
- Patent number 12,166,006
- Issue date Dec 10, 2024
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a soldered joint with one or more inter...
- Patent number 12,166,005
- Issue date Dec 10, 2024
- Infineon Technologies Austria AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor devices
- Patent number 12,132,026
- Issue date Oct 29, 2024
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection structure and manufacturing method therefor
- Patent number 12,100,923
- Issue date Sep 24, 2024
- Resonac Corporation
- Kunihiko Akai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures for low temperature bonding using nanoparticles
- Patent number 12,027,487
- Issue date Jul 2, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for low temperature bonding using nanoparticles
- Patent number 11,973,056
- Issue date Apr 30, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating a semiconductor device
- Patent number 11,817,417
- Issue date Nov 14, 2023
- Infineon Technologies Austria AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diffusion soldering preform with varying surface profile
- Patent number 11,764,185
- Issue date Sep 19, 2023
- Infineon Technologies Austria AG
- Kirill Trunov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for low temperature bonding using nanoparticles
- Patent number 11,710,718
- Issue date Jul 25, 2023
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Preform diffusion soldering
- Patent number 11,605,608
- Issue date Mar 14, 2023
- Infineon Technologies Austria AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superconducting bump bonds for quantum computing systems
- Patent number 11,600,588
- Issue date Mar 7, 2023
- Google LLC
- Zhimin Jamie Yao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Gallium arsenide radio frequency circuit and millimeter wave front-...
- Patent number 11,387,199
- Issue date Jul 12, 2022
- WIN Semiconductors Corp.
- Shao-Cheng Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,950,571
- Issue date Mar 16, 2021
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tetsuya Oyamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for low temperature bonding using nanoparticles
- Patent number 10,892,246
- Issue date Jan 12, 2021
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for low temperature bonding using nanoparticles
- Patent number 10,886,250
- Issue date Jan 5, 2021
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cu alloy bonding wire for semiconductor device
- Patent number 10,790,259
- Issue date Sep 29, 2020
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tetsuya Oyamada
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Method for minimizing average surface roughness of soft metal layer...
- Patent number 10,643,848
- Issue date May 5, 2020
- MIKRO MESA TECHNOLOGY CO., LTD.
- Li-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for minimizing average surface roughness of soft metal layer...
- Patent number 10,629,439
- Issue date Apr 21, 2020
- MIKRO MESA TECHNOLOGY CO., LTD.
- Li-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for low temperature bonding using nanoparticles
- Patent number 10,535,626
- Issue date Jan 14, 2020
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package, integrated fan-out package array, and m...
- Patent number 10,276,421
- Issue date Apr 30, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sih-Hao Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component
- Patent number 10,186,494
- Issue date Jan 22, 2019
- E I du Pont de Nemours and Company
- Akira Inaba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a trench penetrating a main body
- Patent number 10,056,325
- Issue date Aug 21, 2018
- Advanced Semiconductor Engineering, Inc.
- Chin-Li Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink
- Patent number 10,043,732
- Issue date Aug 7, 2018
- United Arab Emirates University
- Salah Addin Burhan Al Omari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,032,741
- Issue date Jul 24, 2018
- Nippon Micrometal Corporation
- Daizo Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating nanostructures and nanowires and devices fab...
- Patent number 9,881,999
- Issue date Jan 30, 2018
- The Regents of the University of California
- Arun Majumdar
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Power module package having patterned insulation metal substrate
- Patent number 9,865,531
- Issue date Jan 9, 2018
- Delta Electronics, Inc.
- Hsin-Chang Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming pillar bumps on semiconductor wafers
- Patent number 9,831,201
- Issue date Nov 28, 2017
- Guy F. Burgess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic component and method of producing an optoelectronic...
- Patent number 9,768,360
- Issue date Sep 19, 2017
- Osram Opto Semiconductors GmbH
- Michael Fehrer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic system
- Patent number 9,748,449
- Issue date Aug 29, 2017
- Epistar Corporation
- Min-Hsun Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epoxy resin composition for encapsulating semiconductor device and...
- Patent number 9,735,076
- Issue date Aug 15, 2017
- Samsung SDI Co., Ltd.
- Yoon Man Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
OPTOELECTRONIC SYSTEM
- Publication number 20240421266
- Publication date Dec 19, 2024
- EPISTAR CORPORATION
- Min-Hsun HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE HAVING A HEAT DISSIPATION STRUCTURE
- Publication number 20240395654
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING REDISTRIBUTION STRUCTURE AND METHOD...
- Publication number 20240321804
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Dowan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
- Publication number 20240312954
- Publication date Sep 19, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20240297142
- Publication date Sep 5, 2024
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20240290743
- Publication date Aug 29, 2024
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- G01 - MEASURING TESTING
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20240290745
- Publication date Aug 29, 2024
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- G01 - MEASURING TESTING
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20240266313
- Publication date Aug 8, 2024
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tomohiro UNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS THEREOF
- Publication number 20240242999
- Publication date Jul 18, 2024
- BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC
- Jeffrey Fitzgerald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D PACKAGING WITH SILICON DIE AS THERMAL SINK FOR HIGH-POWER LOW TH...
- Publication number 20240047295
- Publication date Feb 8, 2024
- Qorvo US, Inc.
- George Maxim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method for Fabricating a Semiconductor Device
- Publication number 20240038714
- Publication date Feb 1, 2024
- Infineon Technologies Austria AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
- Publication number 20230335531
- Publication date Oct 19, 2023
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Superconducting Bump Bonds for Quantum Computing Systems
- Publication number 20230207507
- Publication date Jun 29, 2023
- Google LLC
- Zhimin Jamie Yao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING INTERCONNECTS WITH DIFFERENT S...
- Publication number 20230197679
- Publication date Jun 22, 2023
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE LIQUID METAL CONNECTION DEVICE AND METHOD
- Publication number 20230187337
- Publication date Jun 15, 2023
- Karumbu Meyyappan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
- Publication number 20230132060
- Publication date Apr 27, 2023
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A SOLDERED JOINT WITH ONE OR MORE INTER...
- Publication number 20230130092
- Publication date Apr 27, 2023
- Infineon Technologies Austria AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREFOR
- Publication number 20230060577
- Publication date Mar 2, 2023
- Showa Denko Materials Co., Ltd.
- Kunihiko AKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFUSION SOLDERING PREFORM WITH VARYING SURFACE PROFILE
- Publication number 20230065738
- Publication date Mar 2, 2023
- Kirill Trunov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20230018430
- Publication date Jan 19, 2023
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT INSULATING INTERCONNECT FEATURES IN A COMPONENT OF A COMPOSITE...
- Publication number 20220415853
- Publication date Dec 29, 2022
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITION FOR CONDUCTIVE ADHESIVE, SEMICONDUCTOR PACKAGE COMPRISI...
- Publication number 20220077099
- Publication date Mar 10, 2022
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Gwang-Mun CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Gallium Arsenide Radio Frequency Circuit and Millimeter Wave Front-...
- Publication number 20210257319
- Publication date Aug 19, 2021
- WIN Semiconductors Corp.
- Shao-Cheng Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structures And Methods For Low Temperature Bonding Using Nanoparticles
- Publication number 20210225801
- Publication date Jul 22, 2021
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Preform Diffusion Soldering
- Publication number 20210143120
- Publication date May 13, 2021
- Infineon Technologies Austria AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE
- Publication number 20210111143
- Publication date Apr 15, 2021
- Infineon Technologies Austria AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20200312808
- Publication date Oct 1, 2020
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Cu ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20200168578
- Publication date May 28, 2020
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tetsuya OYAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structures And Methods For Low Temperature Bonding Using Nanoparticles
- Publication number 20200152598
- Publication date May 14, 2020
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20190326246
- Publication date Oct 24, 2019
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tetsuya OYAMADA
- H01 - BASIC ELECTRIC ELEMENTS

Gallium [Ga]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding wire for semiconductor devices

Semiconductor device having a soldered joint with one or more inter...

Bonding wire for semiconductor devices

Connection structure and manufacturing method therefor

Structures for low temperature bonding using nanoparticles

Methods for low temperature bonding using nanoparticles

Semiconductor device and method for fabricating a semiconductor device

Diffusion soldering preform with varying surface profile

Structures and methods for low temperature bonding using nanoparticles

Preform diffusion soldering

Superconducting bump bonds for quantum computing systems

Gallium arsenide radio frequency circuit and millimeter wave front-...

Bonding wire for semiconductor device

Structures and methods for low temperature bonding using nanoparticles

Structures and methods for low temperature bonding using nanoparticles

Cu alloy bonding wire for semiconductor device

Method for minimizing average surface roughness of soft metal layer...

Method for minimizing average surface roughness of soft metal layer...

Structures and methods for low temperature bonding using nanoparticles

Integrated fan-out package, integrated fan-out package array, and m...

Electronic component

Semiconductor package having a trench penetrating a main body

Heat sink

Bonding wire for semiconductor device

Methods of fabricating nanostructures and nanowires and devices fab...

Power module package having patterned insulation metal substrate

Methods for forming pillar bumps on semiconductor wafers

Optoelectronic component and method of producing an optoelectronic...

Optoelectronic system

Epoxy resin composition for encapsulating semiconductor device and...

Patents Applicationslast 30 patents

OPTOELECTRONIC SYSTEM

STACKED SEMICONDUCTOR DEVICE HAVING A HEAT DISSIPATION STRUCTURE

SEMICONDUCTOR PACKAGE INCLUDING REDISTRIBUTION STRUCTURE AND METHOD...

STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES

BONDING WIRE FOR SEMICONDUCTOR DEVICES

BONDING WIRE FOR SEMICONDUCTOR DEVICES

BONDING WIRE FOR SEMICONDUCTOR DEVICES

BONDING WIRE FOR SEMICONDUCTOR DEVICES

SEMICONDUCTOR PACKAGES AND METHODS THEREOF

3D PACKAGING WITH SILICON DIE AS THERMAL SINK FOR HIGH-POWER LOW TH...

Semiconductor Device and Method for Fabricating a Semiconductor Device

STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES

Superconducting Bump Bonds for Quantum Computing Systems

MICROELECTRONIC ASSEMBLIES INCLUDING INTERCONNECTS WITH DIFFERENT S...

FLEXIBLE LIQUID METAL CONNECTION DEVICE AND METHOD

METHODS FOR LOW TEMPERATURE BONDING USING NANOPARTICLES

SEMICONDUCTOR DEVICE HAVING A SOLDERED JOINT WITH ONE OR MORE INTER...

CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREFOR

DIFFUSION SOLDERING PREFORM WITH VARYING SURFACE PROFILE

COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICES

HEAT INSULATING INTERCONNECT FEATURES IN A COMPONENT OF A COMPOSITE...

COMPOSITION FOR CONDUCTIVE ADHESIVE, SEMICONDUCTOR PACKAGE COMPRISI...

Gallium Arsenide Radio Frequency Circuit and Millimeter Wave Front-...

Structures And Methods For Low Temperature Bonding Using Nanoparticles

Preform Diffusion Soldering

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE

COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICES

Cu ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE

Structures And Methods For Low Temperature Bonding Using Nanoparticles

BONDING WIRE FOR SEMICONDUCTOR DEVICE