Gallium nitride [GaN]

Industry

CPC
H01L2924/1033

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/1033Gallium nitride [GaN]

Industries

Patents Grantslast 30 patents

Information Patent Grant
Gallium nitride (GAN) three-dimensional integrated circuit technology
- Patent number 12,148,747
- Issue date Nov 19, 2024
- Intel Corporation
- Han Wui Then
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with protective lid
- Patent number 12,119,276
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing thereof
- Patent number 12,119,321
- Issue date Oct 15, 2024
- Epistar Corporation
- Shih-An Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package having an electronic component and an encapsulant encapsula...
- Patent number 12,112,992
- Issue date Oct 8, 2024
- Infineon Technologies AG
- Daniel Porwol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with encapsulant deposited along sides and sur...
- Patent number 12,094,729
- Issue date Sep 17, 2024
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 12,094,956
- Issue date Sep 17, 2024
- United Microelectronics Corp.
- Chin-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming chip packages and a chip package having a chipse...
- Patent number 12,087,734
- Issue date Sep 10, 2024
- Yibu Semiconductor Co., Ltd.
- Weiping Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package architecture utilizing wafer to wafer bonding
- Patent number 12,087,656
- Issue date Sep 10, 2024
- Qorvo US, Inc.
- Anthony Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with different types of semiconductor dies attached to a fl...
- Patent number 12,080,660
- Issue date Sep 3, 2024
- MACOM Technology Solutions Holdings, Inc.
- Xikun Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method to minimize stress on stack via
- Patent number 12,080,600
- Issue date Sep 3, 2024
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device packages with uniform components and methods of forming the...
- Patent number 12,074,149
- Issue date Aug 27, 2024
- MACOM Technology Solutions Holdings, Inc.
- Michael E. Watts
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power density 3D semiconductor module packaging
- Patent number 12,068,298
- Issue date Aug 20, 2024
- DYNEX SEMICONDUCTOR LIMITED
- Yangang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die fine grain integrated voltage regulation
- Patent number 12,068,324
- Issue date Aug 20, 2024
- Apple Inc.
- Jared L. Zerbe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,062,651
- Issue date Aug 13, 2024
- Kabushiki Kaisha Toshiba
- Yasuhiro Isobe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including source pad region and drain pad regi...
- Patent number 12,062,716
- Issue date Aug 13, 2024
- ANCORA SEMICONDUCTORS INC.
- Li-Fan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module
- Patent number 12,062,599
- Issue date Aug 13, 2024
- Mitsubishi Electric Corporation
- Tatsuro Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressure-contact-type semiconductor device
- Patent number 12,051,671
- Issue date Jul 30, 2024
- Mitsubishi Electric Corporation
- Jun Okada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and semiconductor device
- Patent number 12,051,662
- Issue date Jul 30, 2024
- Rohm Co., Ltd.
- Masatoshi Aketa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid device assemblies and method of fabrication
- Patent number 12,015,004
- Issue date Jun 18, 2024
- NXP USA, INC.
- Li Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation scheme for pad openings and trenches
- Patent number 12,002,774
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Hong Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,996,354
- Issue date May 28, 2024
- Rohm Co., Ltd.
- Koshun Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,990,455
- Issue date May 21, 2024
- Rohm Co., Ltd.
- Hiroyuki Sakairi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plurality of stacked transistors attached by solder balls
- Patent number 11,984,387
- Issue date May 14, 2024
- Kabushiki Kaisha Toshiba
- Toru Sugiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,955,398
- Issue date Apr 9, 2024
- Fuji Electric Co., Ltd.
- Eri Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,955,411
- Issue date Apr 9, 2024
- Rohm Co., Ltd.
- Koshun Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for a semiconductor device
- Patent number 11,935,848
- Issue date Mar 19, 2024
- Sumitomo Electric Device Innovations, Inc.
- Ikuo Nakashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated passive device (IPD) components and a package and proces...
- Patent number 11,935,879
- Issue date Mar 19, 2024
- Wolfspeed, Inc.
- Eng Wah Woo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bidirectional switch circuit and power conversion device
- Patent number 11,894,839
- Issue date Feb 6, 2024
- Mitsubishi Electric Corporation
- Koichi Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of stacking semiconductor die for s...
- Patent number 11,881,476
- Issue date Jan 23, 2024
- Semtech Corporation
- Changjun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including bond pad with fixing parts fixed ont...
- Patent number 11,876,061
- Issue date Jan 16, 2024
- Mitsubishi Electric Corporation
- Yasuki Aihara
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE ARCHITECTURE UTILIZING WAFER TO WAFER BONDING
- Publication number 20240379487
- Publication date Nov 14, 2024
- Qorvo US, Inc.
- Anthony Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240379579
- Publication date Nov 14, 2024
- Dynax Semiconductor, Inc.
- Yi PEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH PROTECTIVE LID
- Publication number 20240379475
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Yi LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND SEMICONDUCTOR DEVICE
- Publication number 20240339421
- Publication date Oct 10, 2024
- ROHM CO., LTD.
- Masatoshi AKETA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240339425
- Publication date Oct 10, 2024
- Murata Manufacturing Co., Ltd.
- Mari SAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240321799
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Kiwon Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20240321692
- Publication date Sep 26, 2024
- AMOSENSE CO., LTD.
- Jinhyuck BIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BIPOLAR TRANSISTOR AND SEMICONDUCTOR
- Publication number 20240321975
- Publication date Sep 26, 2024
- Murata Manufacturing Co., Ltd.
- Kenji SASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDED LEAD PACKAGE FOR HIGH VOLTAGE DEVICES
- Publication number 20240290676
- Publication date Aug 29, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Masamitsu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVATION SCHEME FOR PAD OPENINGS AND TRENCHES
- Publication number 20240282728
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hong Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICES HAVING NON-RECTANGULAR SEMICONDUCTOR DI...
- Publication number 20240274660
- Publication date Aug 15, 2024
- Wolfspeed, Inc.
- Edward Robert Van Brunt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR, POWER AMPLI...
- Publication number 20240274688
- Publication date Aug 15, 2024
- Huawei Technologies Co., Ltd
- Zhili ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240274513
- Publication date Aug 15, 2024
- ROHM CO., LTD.
- Koshun SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240266241
- Publication date Aug 8, 2024
- Fuji Electric Co., Ltd.
- Sota YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240258188
- Publication date Aug 1, 2024
- Mitsubishi Electric Corporation
- Shoji SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240243071
- Publication date Jul 18, 2024
- Mitsubishi Electric Corporation
- Shota YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFA...
- Publication number 20240234348
- Publication date Jul 11, 2024
- Mitsubishi Electric Corporation
- Yasunari HINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC SUBSTRATE WITH HEAT SINK AND MANUFACTURING METHOD THEREOF
- Publication number 20240234670
- Publication date Jul 11, 2024
- AMOGREENTECH CO., LTD.
- Jihyung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240234271
- Publication date Jul 11, 2024
- Mitsubishi Electric Corporation
- Norikazu SAKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES IN A SILICON CARBIDE LAYER COUPLED WITH DEVICES IN A GALLIU...
- Publication number 20240222228
- Publication date Jul 4, 2024
- Intel Corporation
- Abhishek Anil SHARMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240213106
- Publication date Jun 27, 2024
- DYNEX SEMICONDUCTOR LIMITED
- Robin Adam Simpson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED DIE PACKAGING OF POWER SEMICONDUCTOR DEVICES
- Publication number 20240213110
- Publication date Jun 27, 2024
- GaN Systems Inc.
- An-Sheng CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED PASSIVE DEVICES (IPD) HAVING A BASEBAND DAMPING RESISTOR...
- Publication number 20240213184
- Publication date Jun 27, 2024
- Wolfspeed, Inc.
- Haedong JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED DIE PACKAGING FOR POWER SEMICONDUCTOR DEVICES FOR IMPROVED...
- Publication number 20240213127
- Publication date Jun 27, 2024
- GAN SYSTEMS INC.
- Abhinandan DIXIT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240203929
- Publication date Jun 20, 2024
- Fuji Electric Co., Ltd.
- Yushi SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL WIRING BOARD
- Publication number 20240203928
- Publication date Jun 20, 2024
- Fuji Electric Co., Ltd.
- Yushi SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL PACKAGING STRUCTURE OF POWER SEMICONDUCTOR MODULE
- Publication number 20240203841
- Publication date Jun 20, 2024
- STARPOWER SEMICONDUCTOR LTD.
- Danting FENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDE COOLED POWER MODULES
- Publication number 20240178126
- Publication date May 30, 2024
- Virginia Tech Intellectual Properties, Inc.
- Guo-Quan LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF AMPLIFIERS WITH IMPROVED STABILITY BY SOURCE INDUCTANCE ADJUSTMENT
- Publication number 20240145414
- Publication date May 2, 2024
- Wolfspeed, Inc.
- Gerard Bouisse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240145349
- Publication date May 2, 2024
- DENSO CORPORATION
- TAKAHIRO HIRANO
- H01 - BASIC ELECTRIC ELEMENTS

Gallium nitride [GaN]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Gallium nitride (GAN) three-dimensional integrated circuit technology

Package structure with protective lid

Semiconductor device and a method of manufacturing thereof

Package having an electronic component and an encapsulant encapsula...

Semiconductor device with encapsulant deposited along sides and sur...

Semiconductor device and method for fabricating the same

Method for forming chip packages and a chip package having a chipse...

Package architecture utilizing wafer to wafer bonding

Package with different types of semiconductor dies attached to a fl...

Semiconductor device and method to minimize stress on stack via

Device packages with uniform components and methods of forming the...

High power density 3D semiconductor module packaging

Multi-die fine grain integrated voltage regulation

Semiconductor device

Semiconductor device including source pad region and drain pad regi...

Power semiconductor module

Pressure-contact-type semiconductor device

Electronic component and semiconductor device

Hybrid device assemblies and method of fabrication

Passivation scheme for pad openings and trenches

Semiconductor device

Semiconductor device

Plurality of stacked transistors attached by solder balls

Semiconductor device

Semiconductor device

Package for a semiconductor device

Integrated passive device (IPD) components and a package and proces...

Bidirectional switch circuit and power conversion device

Semiconductor device and method of stacking semiconductor die for s...

Semiconductor device including bond pad with fixing parts fixed ont...

Patents Applicationslast 30 patents

PACKAGE ARCHITECTURE UTILIZING WAFER TO WAFER BONDING

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE WITH PROTECTIVE LID

ELECTRONIC COMPONENT AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

POWER MODULE

BIPOLAR TRANSISTOR AND SEMICONDUCTOR

SHIELDED LEAD PACKAGE FOR HIGH VOLTAGE DEVICES

PASSIVATION SCHEME FOR PAD OPENINGS AND TRENCHES

POWER SEMICONDUCTOR DEVICES HAVING NON-RECTANGULAR SEMICONDUCTOR DI...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR, POWER AMPLI...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFA...

CERAMIC SUBSTRATE WITH HEAT SINK AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE

DEVICES IN A SILICON CARBIDE LAYER COUPLED WITH DEVICES IN A GALLIU...

SEMICONDUCTOR DEVICE

EMBEDDED DIE PACKAGING OF POWER SEMICONDUCTOR DEVICES

INTEGRATED PASSIVE DEVICES (IPD) HAVING A BASEBAND DAMPING RESISTOR...

EMBEDDED DIE PACKAGING FOR POWER SEMICONDUCTOR DEVICES FOR IMPROVED...

SEMICONDUCTOR MODULE

METAL WIRING BOARD

NOVEL PACKAGING STRUCTURE OF POWER SEMICONDUCTOR MODULE

DOUBLE-SIDE COOLED POWER MODULES

RF AMPLIFIERS WITH IMPROVED STABILITY BY SOURCE INDUCTANCE ADJUSTMENT

SEMICONDUCTOR DEVICE