Geometry or layout of the interconnection structure

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H01L23/5386

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/5386Geometry or layout of the interconnection structure

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure
- Patent number 12,210,187
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 12,211,802
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jhih-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate-free semiconductor device assemblies with multiple semico...
- Patent number 12,211,798
- Issue date Jan 28, 2025
- Micron Technology, Inc.
- Hung Wen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods for forming the same
- Patent number 12,211,799
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Han Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method of forming the same
- Patent number 12,211,801
- Issue date Jan 28, 2025
- Parabellum Strategic Opportunities Fund LLC
- Yu-Hsiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Highly protective wafer edge sidewall protection layer
- Patent number 12,211,766
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Su-Jen Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having topside power delivery structures
- Patent number 12,211,796
- Issue date Jan 28, 2025
- Intel Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with shunt and patterned metal trace
- Patent number 12,211,800
- Issue date Jan 28, 2025
- Texas Instruments Incorporated
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method of forming thereof
- Patent number 12,211,707
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible substrate
- Patent number 12,211,797
- Issue date Jan 28, 2025
- Japan Display Inc.
- Takumi Sano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming discrete antenna modules
- Patent number 12,211,808
- Issue date Jan 28, 2025
- STATS ChipPAC Pte. Ltd.
- HunTeak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package for improving power integrity characteristics
- Patent number 12,213,256
- Issue date Jan 28, 2025
- Samsung Electronics Co., Ltd.
- Junghwa Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having package substrate
- Patent number 12,205,925
- Issue date Jan 21, 2025
- Samsung Electronics Co., Ltd.
- Yongkwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,205,939
- Issue date Jan 21, 2025
- Samsung Electronics Co., Ltd.
- Doohwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-density interconnects for integrated circuit packages
- Patent number 12,205,902
- Issue date Jan 21, 2025
- Intel Corporation
- Veronica Strong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Honeycomb pattern for conductive features
- Patent number 12,205,916
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shenggao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,205,903
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Chi Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die to die high-speed communication without discrete amplifiers bet...
- Patent number 12,205,908
- Issue date Jan 21, 2025
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, circuit board structure and manufacturing met...
- Patent number 12,205,923
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tin-Hao Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and fabrication method thereof
- Patent number 12,205,906
- Issue date Jan 21, 2025
- Siliconware Precision Industries Co., Ltd.
- Yu-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct bonding in microelectronic assemblies
- Patent number 12,199,018
- Issue date Jan 14, 2025
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical devices and methods of manufacture
- Patent number 12,199,046
- Issue date Jan 14, 2025
- Faraday Semi, Inc.
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous nested interposer package for IC chips
- Patent number 12,199,048
- Issue date Jan 14, 2025
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package, package-on-package structure, and manuf...
- Patent number 12,198,996
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer structure containing embedded silicon-less link chiplet
- Patent number 12,199,025
- Issue date Jan 14, 2025
- Chengdu ECHINT Technology Co., Ltd.
- Minghao Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure and method
- Patent number 12,199,051
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 12,199,022
- Issue date Jan 14, 2025
- Fuji Electric Co., Ltd.
- Masayoshi Nakazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna apparatus and method
- Patent number 12,191,265
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Feng-Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,191,238
- Issue date Jan 7, 2025
- Samsung Electronics Co., Ltd.
- Aenee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package with recessed memory
- Patent number 12,191,281
- Issue date Jan 7, 2025
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250038113
- Publication date Jan 30, 2025
- Siliconware Precision Industries Co., Ltd.
- Chao-Chiang Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY MODULE AND SYSTEM APPLICATIONS
- Publication number 20250038160
- Publication date Jan 30, 2025
- Apple Inc.
- Andreas Bibl
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250038116
- Publication date Jan 30, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Da Hee JOUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL INTERCONNECT BRIDGE
- Publication number 20250038114
- Publication date Jan 30, 2025
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS
- Publication number 20250038119
- Publication date Jan 30, 2025
- SK HYNIX INC.
- Hyun Chul SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR PROVIDING DYNAMIC SECURITY FABRIC INTERPOSE...
- Publication number 20250038132
- Publication date Jan 30, 2025
- The Charles Stark Draper Laboratory, Inc.
- Douglas La Tulipe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND MANUFACTURING METHOD THEREOF, AND FUNCTIONAL BACKP...
- Publication number 20250040049
- Publication date Jan 30, 2025
- BOE MLED TECHNOLOGY CO., LTD.
- Chao LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250038042
- Publication date Jan 30, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC SUBSTRATE WITH SUPPORT STRUCTURE AND FUNCTIONAL INLAYS THEREIN
- Publication number 20250038117
- Publication date Jan 30, 2025
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald WEIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP HAVING AN INTERCONNECTION AREA AND SEMICONDUCTOR...
- Publication number 20250038118
- Publication date Jan 30, 2025
- Samsung Electronics Co., Ltd.
- YOUNG-DEUK KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HOMOGENEOUS CHIPLETS CONFIGURABLE AS A TWO-DIMENSIONAL SYSTEM OR A...
- Publication number 20250038120
- Publication date Jan 30, 2025
- Microsoft Technology Licensing, LLC
- Haohua ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHODS OF FORMING THE SAME
- Publication number 20250029885
- Publication date Jan 23, 2025
- Samsung Electronics Co., Ltd.
- Donggyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250029932
- Publication date Jan 23, 2025
- LG Innotek Co., Ltd.
- Yu Lim CHOE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR CHIPLET SYSTEM
- Publication number 20250029971
- Publication date Jan 23, 2025
- Zero ASIC Corporation
- Andreas Olofsson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND MANUFACTURING METHODS THEREOF, CHIP PACKA...
- Publication number 20250029954
- Publication date Jan 23, 2025
- Yangtze Memory Technologies Co., Ltd.
- Min Wen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE ULTRAFINE PITCH PATCH ARCHITECTURE AND METHOD OF MAKING
- Publication number 20250029929
- Publication date Jan 23, 2025
- Intel Corporation
- Sanka GANESAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250031455
- Publication date Jan 23, 2025
- Advantest Corporation
- Shinji SUGATANI
- G11 - INFORMATION STORAGE
Information Patent Application
Selectable Monolithic or External Scalable Die-to-Die Interconnecti...
- Publication number 20250029921
- Publication date Jan 23, 2025
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250029933
- Publication date Jan 23, 2025
- RENESAS ELECTRONICS CORPORATION
- Ryuichi OIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250022806
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Hong Jin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP STACKING STRUCTURES AND METHODS FOR FORMING THE SAME
- Publication number 20250022850
- Publication date Jan 16, 2025
- Yangtze Memory Technologies Co., Ltd.
- Xinru ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP STACKING STRUCTURES AND METHODS FOR FORMING THE SAME
- Publication number 20250022851
- Publication date Jan 16, 2025
- Yangtze Memory Technologies Co., Ltd.
- Xinru ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DEVICE SEMICONDUCTOR CHIP WITH ELECTRICAL ACCESS TO DEVICES A...
- Publication number 20250022872
- Publication date Jan 16, 2025
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING PROCESSING ELEMENT AND I/O ELEMENT
- Publication number 20250022848
- Publication date Jan 16, 2025
- Advanced Semiconductor Engineering, Inc.
- Chang Chi LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FACE-TO-FACE THROUGH-SILICON VIA MULTI-CHIP SEMICONDUCTOR APPARATUS...
- Publication number 20250022774
- Publication date Jan 16, 2025
- Altera Corporation
- Loke Yip FOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRONT END OF LINE INTERCONNECT STRUCTURES AND ASSOCIATED SYSTEMS AN...
- Publication number 20250022804
- Publication date Jan 16, 2025
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250015064
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Yoon Young JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGULATION OF MICROELECTRONIC COMPONENTS WITH DIRECT BONDING INTER...
- Publication number 20250015028
- Publication date Jan 9, 2025
- Intel Corporation
- Bhaskar Jyoti Krishnatreya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250014977
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Yun-Seok CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES
- Publication number 20250015004
- Publication date Jan 9, 2025
- Intel Corporation
- Yueli Liu
- H01 - BASIC ELECTRIC ELEMENTS

Geometry or layout of the interconnection structure

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor structure

Package structure and method of fabricating the same

Substrate-free semiconductor device assemblies with multiple semico...

Semiconductor packages and methods for forming the same

Chip package and method of forming the same

Highly protective wafer edge sidewall protection layer

Microelectronic assemblies having topside power delivery structures

Semiconductor package with shunt and patterned metal trace

Integrated circuit package and method of forming thereof

Flexible substrate

Semiconductor device and method of forming discrete antenna modules

Semiconductor package for improving power integrity characteristics

Semiconductor package having package substrate

Semiconductor package

High-density interconnects for integrated circuit packages

Honeycomb pattern for conductive features

Semiconductor package and manufacturing method thereof

Die to die high-speed communication without discrete amplifiers bet...

Semiconductor device, circuit board structure and manufacturing met...

Electronic package and fabrication method thereof

Direct bonding in microelectronic assemblies

Electrical devices and methods of manufacture

Heterogeneous nested interposer package for IC chips

Integrated fan-out package, package-on-package structure, and manuf...

Interposer structure containing embedded silicon-less link chiplet

Integrated circuit structure and method

Semiconductor module

Antenna apparatus and method

Semiconductor package

Multi-chip package with recessed memory

Patents Applicationslast 30 patents

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

DISPLAY MODULE AND SYSTEM APPLICATIONS

PRINTED CIRCUIT BOARD

ELECTRICAL INTERCONNECT BRIDGE

SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS

SYSTEMS AND METHODS FOR PROVIDING DYNAMIC SECURITY FABRIC INTERPOSE...

WIRING BOARD AND MANUFACTURING METHOD THEREOF, AND FUNCTIONAL BACKP...

SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF

IC SUBSTRATE WITH SUPPORT STRUCTURE AND FUNCTIONAL INLAYS THEREIN

SEMICONDUCTOR CHIP HAVING AN INTERCONNECTION AREA AND SEMICONDUCTOR...

HOMOGENEOUS CHIPLETS CONFIGURABLE AS A TWO-DIMENSIONAL SYSTEM OR A...

SEMICONDUCTOR PACKAGE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR PACKAGE

MODULAR CHIPLET SYSTEM

SEMICONDUCTOR DEVICES AND MANUFACTURING METHODS THEREOF, CHIP PACKA...

MULTI-DIE ULTRAFINE PITCH PATCH ARCHITECTURE AND METHOD OF MAKING

THREE-DIMENSIONAL DEVICE AND MANUFACTURING METHOD THEREOF

Selectable Monolithic or External Scalable Die-to-Die Interconnecti...

ELECTRONIC DEVICE

SEMICONDUCTOR PACKAGE

FLIP-CHIP STACKING STRUCTURES AND METHODS FOR FORMING THE SAME

FLIP-CHIP STACKING STRUCTURES AND METHODS FOR FORMING THE SAME

MULTI-DEVICE SEMICONDUCTOR CHIP WITH ELECTRICAL ACCESS TO DEVICES A...

SEMICONDUCTOR PACKAGE INCLUDING PROCESSING ELEMENT AND I/O ELEMENT

FACE-TO-FACE THROUGH-SILICON VIA MULTI-CHIP SEMICONDUCTOR APPARATUS...

FRONT END OF LINE INTERCONNECT STRUCTURES AND ASSOCIATED SYSTEMS AN...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SINGULATION OF MICROELECTRONIC COMPONENTS WITH DIRECT BONDING INTER...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES