Geometry or layout of the interconnection structure

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H01L23/5386

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/5386Geometry or layout of the interconnection structure

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Architecture for computing system package
- Patent number 12,327,796
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic structures including glass cores
- Patent number 12,327,797
- Issue date Jun 10, 2025
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Logic drive based on chip scale package comprising standardized com...
- Patent number 12,327,816
- Issue date Jun 10, 2025
- iCometrue Company Ltd.
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with underfill containment barrier
- Patent number 12,327,773
- Issue date Jun 10, 2025
- Intel Corporation
- Rahul Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Logic drive based on multichip package using interconnection bridge
- Patent number 12,327,813
- Issue date Jun 10, 2025
- iCometrue Company
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die coupling using a substrate with a glass core
- Patent number 12,327,794
- Issue date Jun 10, 2025
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
ASIC package with photonics and vertical power delivery
- Patent number 12,327,817
- Issue date Jun 10, 2025
- Google LLC
- Woon-Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including redistribution substrate
- Patent number 12,327,824
- Issue date Jun 10, 2025
- Samsung Electronics Co., Ltd.
- Dongkyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Eccentric via structures for stress reduction
- Patent number 12,322,703
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with underfill
- Patent number 12,322,704
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 12,322,705
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,322,729
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Weiming Chris Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip including through electrode, and semiconductor p...
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- Issue date Jun 3, 2025
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- Seung Hwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna in package having antenna on package substrate
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- Issue date Jun 3, 2025
- Texas Instruments Incorporated
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method of forming the same
- Patent number 12,322,706
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Lung Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board assembly and manufacturing method thereof
- Patent number 12,324,100
- Issue date Jun 3, 2025
- Unimicron Technology Corp.
- Yu-Shen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing die stack structure
- Patent number 12,322,728
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and semiconductor manufacturing pro...
- Patent number 12,322,672
- Issue date Jun 3, 2025
- Advanced Semiconductor Engineering, Inc.
- Ian Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipating features for laser drilling process
- Patent number 12,322,716
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,322,742
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsiang-Tai Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming RDLs and structure formed thereof
- Patent number 12,315,819
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate, electronic device package and method for manufac...
- Patent number 12,315,828
- Issue date May 27, 2025
- Advanced Semiconductor Engineering, Inc.
- Wu Chou Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 12,315,831
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring structure including low- and high-density conductive structures
- Patent number 12,315,820
- Issue date May 27, 2025
- Advanced Semiconductor Engineering, Inc.
- Wen Hung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board, semiconductor device, and method of manufacturing wir...
- Patent number 12,317,416
- Issue date May 27, 2025
- Kioxia Corporation
- Tomonori Kawata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing a fan-out panel level semiconductor package
- Patent number 12,315,822
- Issue date May 27, 2025
- Samsung Electronics Co., Ltd.
- Jeongho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure of a semiconductor chip having pads of di...
- Patent number 12,315,818
- Issue date May 27, 2025
- Samsung Electronics Co., Ltd.
- Keumhee Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor configurations for multi-deck memory devices
- Patent number 12,310,116
- Issue date May 20, 2025
- Micron Technology, Inc.
- Fatma Arzum Simsek-Ege
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chiplet first architecture for die tiling applications
- Patent number 12,308,329
- Issue date May 20, 2025
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrating and accessing passive components in wafer-level packages
- Patent number 12,308,335
- Issue date May 20, 2025
- Intel Corporation
- Gianni Signorini
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

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PACKAGE STRUCTURE AND PACKGING METHOD
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SEMICONDUCTOR PACKAGE
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MICROELECTRONIC ASSEMBLIES WITH POST-SINGULATION EDGE FEATURES IN G...
- Publication number 20250192070
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- Publication number 20250192080
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SEMICONDUCTOR PACKAGE INCLUDING INTERPOSER AND METHOD FOR MANUFACTU...
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BRIDGE DIE IN SUBSTRATE CORE LAYER
- Publication number 20250183178
- Publication date Jun 5, 2025
- QUALCOMM Incorporated
- Joan Rey Villarba BUOT
- H01 - BASIC ELECTRIC ELEMENTS
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ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250183185
- Publication date Jun 5, 2025
- Siliconware Precision Industries Co., Ltd.
- Hsin-Yin CHANG
- H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE
- Publication number 20250183186
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Sungoh Ahn
- H01 - BASIC ELECTRIC ELEMENTS
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ELECTRONIC DEVICE
- Publication number 20250183187
- Publication date Jun 5, 2025
- DENSO CORPORATION
- Tetsuya OKI
- H01 - BASIC ELECTRIC ELEMENTS
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MODULE
- Publication number 20250183190
- Publication date Jun 5, 2025
- Murata Manufacturing Co., Ltd.
- Yoshihito OTSUBO
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METHOD OF FORMING PACKAGE STRUCTURE, RDL STRUCTURE COMPRISING REDIS...
- Publication number 20250183143
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
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WIRING BOARD AND SEMICONDUCTOR DEVICE
- Publication number 20250183184
- Publication date Jun 5, 2025
- Shinko Electric Industries Co., Ltd.
- Hiroshi TANEDA
- H01 - BASIC ELECTRIC ELEMENTS
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PANEL SCALE PACKAGING OF A PLURALITY OF TRANSFORMER DEVICES FOR RED...
- Publication number 20250183201
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- Danger Devices Inc.
- Nicholas SUTARDJA
- H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE
- Publication number 20250183163
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Juyoun Choi
- H01 - BASIC ELECTRIC ELEMENTS
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HIGH-DENSITY SEMICONDUCTOR CHIP PACKAGE
- Publication number 20250183227
- Publication date Jun 5, 2025
- Micron Technology, Inc.
- Kelvin Aik Boo TAN
- H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE
- Publication number 20250183121
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- JUBIN SEO
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DISPLAY APPARATUS
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- SAMSUNG DISPLAY CO., LTD.
- WONTAE KIM
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
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Electric Device and Manufacturing Method thereof
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- Publication date Jun 5, 2025
- InnoLux Corporation
- Kuang-Ming FAN
- G06 - COMPUTING CALCULATING COUNTING
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CHIP-LET PACKAGE INCLUDING A SUBSTRATE FOR SESMICONDIUCTOR PACKAGIN...
- Publication number 20250183189
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- UNIST (ULSAN NATIONAL INSTITUTE OF SCIENCE AND TECHNOLOGY)
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CROSS-WAFER RDLS IN CONSTRUCTED WAFERS
- Publication number 20250183058
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE
- Publication number 20250183107
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Kwangyong Lee
- H01 - BASIC ELECTRIC ELEMENTS
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METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE...
- Publication number 20250174504
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- Resonac Corporation
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- H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20250174534
- Publication date May 29, 2025
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- Publication date May 29, 2025
- Fuji Electric Co., Ltd.
- Kazuya OKADA
- H01 - BASIC ELECTRIC ELEMENTS
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LOW PROFILE SENSOR PACKAGES
- Publication number 20250174616
- Publication date May 29, 2025
- STMicroelectronics Pte Ltd
- Jing-En LUAN
- H01 - BASIC ELECTRIC ELEMENTS

Geometry or layout of the interconnection structure

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Architecture for computing system package

Microelectronic structures including glass cores

Logic drive based on chip scale package comprising standardized com...

Package with underfill containment barrier

Logic drive based on multichip package using interconnection bridge

Die coupling using a substrate with a glass core

ASIC package with photonics and vertical power delivery

Semiconductor package including redistribution substrate

Eccentric via structures for stress reduction

Package structure with underfill

Chip package and manufacturing method thereof

Semiconductor device

Semiconductor chip including through electrode, and semiconductor p...

Antenna in package having antenna on package substrate

Chip package and method of forming the same

Circuit board assembly and manufacturing method thereof

Method of manufacturing die stack structure

Semiconductor package structure and semiconductor manufacturing pro...

Heat dissipating features for laser drilling process

Semiconductor structure and manufacturing method thereof

Method of forming RDLs and structure formed thereof

Package substrate, electronic device package and method for manufac...

Package structure and manufacturing method thereof

Wiring structure including low- and high-density conductive structures

Wiring board, semiconductor device, and method of manufacturing wir...

Methods of manufacturing a fan-out panel level semiconductor package

Interconnection structure of a semiconductor chip having pads of di...

Transistor configurations for multi-deck memory devices

Chiplet first architecture for die tiling applications

Integrating and accessing passive components in wafer-level packages

Patents Applicationslast 30 patents

POWER MODULE

MODULAR PACKAGE STRUCTURES WITH INTERPOSERS HAVING ALIGNMENT FEATURES

PACKAGE COMPRISING A SUBSTRATE WITH CAVITY AND AN INTEGRATED DEVICE...

SEMICONDUCTOR DEVICE AND DATA TRANSFERRING METHOD FOR SEMICONDUCTOR...

PACKAGE STRUCTURE AND PACKGING METHOD

SEMICONDUCTOR PACKAGE

MICROELECTRONIC ASSEMBLIES WITH POST-SINGULATION EDGE FEATURES IN G...

Integrated Devices in Semiconductor Packages and Methods of Forming...

SEMICONDUCTOR PACKAGE INCLUDING INTERPOSER AND METHOD FOR MANUFACTU...

Semiconductor Module and Power Conversion Device

BRIDGE DIE IN SUBSTRATE CORE LAYER

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE

ELECTRONIC DEVICE

MODULE

METHOD OF FORMING PACKAGE STRUCTURE, RDL STRUCTURE COMPRISING REDIS...

WIRING BOARD AND SEMICONDUCTOR DEVICE

PANEL SCALE PACKAGING OF A PLURALITY OF TRANSFORMER DEVICES FOR RED...

SEMICONDUCTOR PACKAGE

HIGH-DENSITY SEMICONDUCTOR CHIP PACKAGE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE

DISPLAY APPARATUS

Electric Device and Manufacturing Method thereof

CHIP-LET PACKAGE INCLUDING A SUBSTRATE FOR SESMICONDIUCTOR PACKAGIN...

CROSS-WAFER RDLS IN CONSTRUCTED WAFERS

SEMICONDUCTOR PACKAGE

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE...

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

LOW PROFILE SENSOR PACKAGES