Geometry or layout of the interconnection structure

Industry

CPC
H01L23/5386

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/5386Geometry or layout of the interconnection structure

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Carrier structure including pockets for accommodating semiconductor...
- Patent number 12,230,575
- Issue date Feb 18, 2025
- Samsung Electronics Co., Ltd.
- Hyeongmun Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chiplet device
- Patent number 12,230,578
- Issue date Feb 18, 2025
- Global Unichip Corporation
- Sheng-Fan Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate z-disaggregation with liquid metal interconnects
- Patent number 12,230,564
- Issue date Feb 18, 2025
- Intel Corporation
- Brandon Christian Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including power management die in a stack and...
- Patent number 12,230,607
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Double-sided substrate with cavities for direct die-to-die intercon...
- Patent number 12,230,610
- Issue date Feb 18, 2025
- Intel Corporation
- Pooya Tadayon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy metal bonding pads for underfill application in semiconductor...
- Patent number 12,232,307
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Ming-Chih Yew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-device graded embedding package substrate and manufacturing m...
- Patent number 12,230,581
- Issue date Feb 18, 2025
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Local density control for metal capacitance reduction
- Patent number 12,230,577
- Issue date Feb 18, 2025
- Intel Corporation
- Burak Baylav
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic components for soft, flexible circuitry layers and metho...
- Patent number 12,230,579
- Issue date Feb 18, 2025
- LOOMIA Technologies, Inc.
- Madison Thea Maxey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cross-wafer RDLs in constructed wafers
- Patent number 12,230,513
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer chip scale packaging with ball attach before repassivation
- Patent number 12,230,539
- Issue date Feb 18, 2025
- Texas Instruments Incorporated
- Daiki Komatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low profile sensor packages
- Patent number 12,230,619
- Issue date Feb 18, 2025
- STMicroelectronics Pte Ltd
- Jing-En Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate and semiconductor structure with same
- Patent number 12,224,244
- Issue date Feb 11, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Hailin Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded die architecture and method of making
- Patent number 12,224,245
- Issue date Feb 11, 2025
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and testing method
- Patent number 12,216,157
- Issue date Feb 4, 2025
- Advanced Semiconductor Engineering, Inc.
- Chen-Chao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through electrode substrate, electronic unit, method for manufactur...
- Patent number 12,218,068
- Issue date Feb 4, 2025
- Dai Nippon Printing Co., Ltd.
- Hiroshi Kudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package with high density interconnects
- Patent number 12,218,069
- Issue date Feb 4, 2025
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,218,070
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Hae-Jung Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus
- Patent number 12,219,710
- Issue date Feb 4, 2025
- Samsung Display Co., Ltd.
- Wontae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,218,082
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Ming Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembling on adhesion layer or dielectric layer, extending be...
- Patent number 12,218,098
- Issue date Feb 4, 2025
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation structure with planar top surfaces
- Patent number 12,218,022
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,218,044
- Issue date Feb 4, 2025
- Renesas Electronics Corporation
- Nobuhiro Kinoshita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with reinforced element
- Patent number 12,218,080
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EMIB architecture with dedicated metal layers for improving power d...
- Patent number 12,218,063
- Issue date Feb 4, 2025
- Intel Corporation
- Jianyong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded silicon interconnects in bridges for integrated-circuit pack...
- Patent number 12,218,064
- Issue date Feb 4, 2025
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 12,210,187
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 12,211,802
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jhih-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate-free semiconductor device assemblies with multiple semico...
- Patent number 12,211,798
- Issue date Jan 28, 2025
- Micron Technology, Inc.
- Hung Wen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods for forming the same
- Patent number 12,211,799
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Han Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR REMOVING RESISTOR LAYER, AND METHOD OF MANUFACTURING SEM...
- Publication number 20250060676
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Very Fine Pitch and Wiring Density Organic Side by Side Chiplet Int...
- Publication number 20250062236
- Publication date Feb 20, 2025
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF SEMICONDUCTOR CHIPS
- Publication number 20250062241
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Kyungdon MUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL CHANNEL, MODULE SUBSTRATE, AND SEMICONDUCTOR SYSTEM INCLUDIN...
- Publication number 20250062239
- Publication date Feb 20, 2025
- UIF (UNIVERSITY INDUSTRY FOUNDATION), YONSEI UNIVERSITY
- HYUN JUN PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH IMPROVED STRUCTURAL STABILITY
- Publication number 20250062240
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- MyungDo Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND METHOD FOR MANUFACTURING A POWER MODULE
- Publication number 20250062242
- Publication date Feb 20, 2025
- Hitachi Energy Ltd
- Fabian FISCHER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250062266
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Gyunghwan Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING TRENCH STRUCTURES
- Publication number 20250062268
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Teageon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND INTEGRATED CIRCUIT DEVICE
- Publication number 20250062238
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Bong Wee YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED INTEGRATED CIRCUIT DEVICES
- Publication number 20250062285
- Publication date Feb 20, 2025
- QUALCOMM Incorporated
- Yue LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20250054869
- Publication date Feb 13, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Jae Yoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250054917
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- Eunseok Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND METHOD FOR PRODUCING SAME
- Publication number 20250054907
- Publication date Feb 13, 2025
- ROBERT BOSCH GmbH
- Irfan AYDOGMUS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME
- Publication number 20250054870
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- WOONCHUN KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250054900
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Yen Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Density 3D Interconnect Configuration
- Publication number 20250046715
- Publication date Feb 6, 2025
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PACKAGE
- Publication number 20250046724
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Eunsu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING A SEMICONDUCTOR DEVICE WITH V2V RAIL
- Publication number 20250046719
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung-Chan YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS FOR FORMING THE SAME
- Publication number 20250046726
- Publication date Feb 6, 2025
- STATS ChipPAC Pte Ltd.
- MingYu KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250046754
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Hyun-Mook Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...
- Publication number 20250046770
- Publication date Feb 6, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- In Su Mok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE PACKAGES INCLUDING COMMAND/ADDRESS CONNECTIONS, AND RELATED...
- Publication number 20250046710
- Publication date Feb 6, 2025
- Micron Technology Inc.
- Scott Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE ASSEMBLIES WITH DECOMPOSABLE MATERIALS AND ASSOCI...
- Publication number 20250046723
- Publication date Feb 6, 2025
- Micron Technology, Inc.
- Fatma Arzum Simsek-Ege
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250046725
- Publication date Feb 6, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Seok Hwan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING ANTENNA
- Publication number 20250046737
- Publication date Feb 6, 2025
- Yongkoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250046749
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250046755
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Myungsam KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250038113
- Publication date Jan 30, 2025
- Siliconware Precision Industries Co., Ltd.
- Chao-Chiang Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY MODULE AND SYSTEM APPLICATIONS
- Publication number 20250038160
- Publication date Jan 30, 2025
- Apple Inc.
- Andreas Bibl
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250038116
- Publication date Jan 30, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Da Hee JOUNG
- H01 - BASIC ELECTRIC ELEMENTS

Geometry or layout of the interconnection structure

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Carrier structure including pockets for accommodating semiconductor...

Semiconductor chiplet device

Package substrate z-disaggregation with liquid metal interconnects

Semiconductor device including power management die in a stack and...

Double-sided substrate with cavities for direct die-to-die intercon...

Dummy metal bonding pads for underfill application in semiconductor...

Multi-device graded embedding package substrate and manufacturing m...

Local density control for metal capacitance reduction

Electronic components for soft, flexible circuitry layers and metho...

Cross-wafer RDLs in constructed wafers

Wafer chip scale packaging with ball attach before repassivation

Low profile sensor packages

Package substrate and semiconductor structure with same

Embedded die architecture and method of making

Package structure and testing method

Through electrode substrate, electronic unit, method for manufactur...

Multi-chip package with high density interconnects

Semiconductor package and method of fabricating the same

Display apparatus

Package structure

Chip assembling on adhesion layer or dielectric layer, extending be...

Passivation structure with planar top surfaces

Semiconductor device

Package structure with reinforced element

EMIB architecture with dedicated metal layers for improving power d...

Molded silicon interconnects in bridges for integrated-circuit pack...

Semiconductor structure

Package structure and method of fabricating the same

Substrate-free semiconductor device assemblies with multiple semico...

Semiconductor packages and methods for forming the same

Patents Applicationslast 30 patents

METHOD FOR REMOVING RESISTOR LAYER, AND METHOD OF MANUFACTURING SEM...

Very Fine Pitch and Wiring Density Organic Side by Side Chiplet Int...

SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF SEMICONDUCTOR CHIPS

SIGNAL CHANNEL, MODULE SUBSTRATE, AND SEMICONDUCTOR SYSTEM INCLUDIN...

SEMICONDUCTOR PACKAGE WITH IMPROVED STRUCTURAL STABILITY

POWER MODULE AND METHOD FOR MANUFACTURING A POWER MODULE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGES HAVING TRENCH STRUCTURES

SEMICONDUCTOR PACKAGE AND INTEGRATED CIRCUIT DEVICE

STACKED INTEGRATED CIRCUIT DEVICES

SEMICONDUCTOR DEVICES METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

POWER MODULE AND METHOD FOR PRODUCING SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

High Density 3D Interconnect Configuration

SUBSTRATE PACKAGE

METHOD OF MAKING A SEMICONDUCTOR DEVICE WITH V2V RAIL

SEMICONDUCTOR DEVICES AND METHODS FOR FORMING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...

DEVICE PACKAGES INCLUDING COMMAND/ADDRESS CONNECTIONS, AND RELATED...

SEMICONDUCTOR DIE ASSEMBLIES WITH DECOMPOSABLE MATERIALS AND ASSOCI...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING ANTENNA

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

DISPLAY MODULE AND SYSTEM APPLICATIONS

PRINTED CIRCUIT BOARD