Geometry or layout of the interconnection structure

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H01L23/5386

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/5386Geometry or layout of the interconnection structure

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electronic package
- Patent number 12,368,104
- Issue date Jul 22, 2025
- Advanced Semiconductor Engineering, Inc.
- Hung-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module and electronic device
- Patent number 12,368,108
- Issue date Jul 22, 2025
- Canon Kabushiki Kaisha
- Nobuaki Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 12,368,084
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device having a silane coupling agent in an insulating l...
- Patent number 12,368,105
- Issue date Jul 22, 2025
- Innolux Corporation
- Ker-Yih Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diagonal vias in semiconductor structures
- Patent number 12,368,106
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Wei Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Supporting InFO packages to reduce warpage
- Patent number 12,368,115
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Parameter exchange for a die-to-die interconnect
- Patent number 12,360,934
- Issue date Jul 15, 2025
- Intel Corporation
- Debendra Das Sharma
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for manufacturing semiconductor device, semiconductor device...
- Patent number 12,362,248
- Issue date Jul 15, 2025
- Goki Toshima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,362,282
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clock-gating in die-to-die (D2D) interconnects
- Patent number 12,362,306
- Issue date Jul 15, 2025
- Intel Corporation
- Narasimha Lanka
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package and method of manufacturing semiconductor pac...
- Patent number 12,362,326
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with underfill
- Patent number 12,362,196
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,362,283
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Hung Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 12,362,228
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,362,321
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Ding Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional integrated circuit
- Patent number 12,362,323
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,362,339
- Issue date Jul 15, 2025
- Kabushiki Kaisha Toshiba
- Kenichi Agawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 12,362,291
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with redistribution structure and method for f...
- Patent number 12,354,965
- Issue date Jul 8, 2025
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package assembly, electronic device, and preparation method of...
- Patent number 12,354,967
- Issue date Jul 8, 2025
- Huawei Technologies Co., Ltd.
- Zhaozheng Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising a substrate and a high-density interconnect inte...
- Patent number 12,355,000
- Issue date Jul 8, 2025
- QUALCOMM Incorporated
- Yangyang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D package configuration
- Patent number 12,354,942
- Issue date Jul 8, 2025
- CCS TECHNOLOGY CORPORATION
- Tung-Po Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Logic drive based on chip scale package comprising standardized com...
- Patent number 12,354,966
- Issue date Jul 8, 2025
- iCometrue Company Ltd.
- Mou-Shiung Lin
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor package structure and method for forming the same
- Patent number 12,355,001
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen-Chu Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Under chip bridge
- Patent number 12,354,964
- Issue date Jul 8, 2025
- FRONTGRADE TECHNOLOGIES INC.
- Sean Thorne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reconstituted substrate structure and fabrication methods for heter...
- Patent number 12,354,968
- Issue date Jul 8, 2025
- Applied Materials, Inc.
- Han-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including photo imageable dielectric
- Patent number 12,354,974
- Issue date Jul 8, 2025
- Samsung Electronics Co., Ltd.
- Yuseon Heo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged electronic system formed by electrically connected and gal...
- Patent number 12,354,998
- Issue date Jul 8, 2025
- STMicroelectronics S.r.l.
- Dario Paci
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stretchable display device
- Patent number 12,347,346
- Issue date Jul 1, 2025
- LG Display Co., Ltd.
- KiHan Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated circuit package with flipped high bandwidth memory device
- Patent number 12,347,780
- Issue date Jul 1, 2025
- Intel Corporation
- Krishna Vasanth Valavala
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20250239533
- Publication date Jul 24, 2025
- TDK Corporation
- Reo HANADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE COMPRISING AN END-FIRE ANTENNA ARRAY
- Publication number 20250239542
- Publication date Jul 24, 2025
- Intel Corporation
- Tae Young YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL CONNECTOR UNIT FOR A PHOTONIC ASSEMBLY AND METHODS FOR FORM...
- Publication number 20250239578
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Tso-Jung Chang
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A HEAT DISSIPATION STRUCTURE CONNECTED...
- Publication number 20250239528
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20250239529
- Publication date Jul 24, 2025
- TDK Corporation
- Reo HANADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250239534
- Publication date Jul 24, 2025
- Innolux Corporation
- Jen-Hai Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20250239536
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND A METHOD FOR FORMING THE SAME
- Publication number 20250239531
- Publication date Jul 24, 2025
- STATS ChipPAC Pte Ltd.
- TaeWoo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MODULE
- Publication number 20250239532
- Publication date Jul 24, 2025
- SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
- Yuji MORINAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250239554
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Wonil Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20250233094
- Publication date Jul 17, 2025
- Samsung Electronics Co., Ltd.
- Kyung Don Mun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE
- Publication number 20250233077
- Publication date Jul 17, 2025
- Mitsubishi Electric Corporation
- Maki HASEGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA IN PACKAGE HAVING ANTENNA ON PACKAGE SUBSTRATE
- Publication number 20250233301
- Publication date Jul 17, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250226326
- Publication date Jul 10, 2025
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CORELESS SUBSTRATE FORMED FROM STACKED EMBEDDED TRACE SU...
- Publication number 20250226328
- Publication date Jul 10, 2025
- QUALCOMM Incorporated
- Kyudong KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250226329
- Publication date Jul 10, 2025
- Chung W. Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250226283
- Publication date Jul 10, 2025
- Samsung Electronics Co., Ltd.
- Wooseup HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC COMPONENT HAVING MOLDED REGIONS WITH THROUGH-MOLD VIAS
- Publication number 20250226323
- Publication date Jul 10, 2025
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED COMPONENT PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250227849
- Publication date Jul 10, 2025
- Advanced Semiconductor Engineering, Inc.
- Chien-Fan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ASSEMBLY, CHIP INTERPOSER AND FABRICATING METHOD FOR CHIP ASSE...
- Publication number 20250226327
- Publication date Jul 10, 2025
- HYGON INFORMATION TECHNOLOGY CO., LTD.
- Xiaodi Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE-TO-DIE PROBE PAD CONNECTION IN A STACKED SEMICONDUCTOR DEVICE
- Publication number 20250226324
- Publication date Jul 10, 2025
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND SEMICONDUCTOR WIRING SUBSTRATE THE...
- Publication number 20250226330
- Publication date Jul 10, 2025
- Global Unichip Corporation
- Wei-Chiao WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER SUBSTRATES AND METHODS FOR MANUFACTURING SAME, POWER MOD...
- Publication number 20250226273
- Publication date Jul 10, 2025
- Shenzhen STS Microelectronics Co., Ltd.
- Qiao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRIDGE CHIP, SEMICONDUCTOR PACKAGE INCLUDING BRIDGE CHIP AND METHOD...
- Publication number 20250226331
- Publication date Jul 10, 2025
- Samsung Electronics Co., Ltd.
- Seokbeom YONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES
- Publication number 20250226332
- Publication date Jul 10, 2025
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250226317
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250218969
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Hongwon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR MOUNTING SEMICONDUCTOR DEVICES IN CAVITIES
- Publication number 20250218956
- Publication date Jul 3, 2025
- Intel Corporation
- Shayan Kaviani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO EMBED A SEMICONDUCTOR DEVICE IN A GLASS CORE
- Publication number 20250218957
- Publication date Jul 3, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PEDESTALS FOR SEMICONDUCTOR COMPONENTS EMBEDDED IN PACKAGE SUBSTRAT...
- Publication number 20250218958
- Publication date Jul 3, 2025
- Intel Corporation
- Brandon Christian Marin
- H01 - BASIC ELECTRIC ELEMENTS

Geometry or layout of the interconnection structure

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic package

Electronic module and electronic device

Package structure and manufacturing method thereof

Electronic device having a silane coupling agent in an insulating l...

Diagonal vias in semiconductor structures

Supporting InFO packages to reduce warpage

Parameter exchange for a die-to-die interconnect

Method for manufacturing semiconductor device, semiconductor device...

Semiconductor structure and manufacturing method thereof

Clock-gating in die-to-die (D2D) interconnects

Semiconductor package and method of manufacturing semiconductor pac...

Package structure with underfill

Semiconductor device and method of manufacturing the same

Semiconductor package and method

Semiconductor package

Three-dimensional integrated circuit

Semiconductor device

Semiconductor device and method

Semiconductor device with redistribution structure and method for f...

Chip package assembly, electronic device, and preparation method of...

Package comprising a substrate and a high-density interconnect inte...

3D package configuration

Logic drive based on chip scale package comprising standardized com...

Semiconductor package structure and method for forming the same

Under chip bridge

Reconstituted substrate structure and fabrication methods for heter...

Semiconductor package including photo imageable dielectric

Packaged electronic system formed by electrically connected and gal...

Stretchable display device

Integrated circuit package with flipped high bandwidth memory device

Patents Applicationslast 30 patents

SEMICONDUCTOR MODULE

SEMICONDUCTOR PACKAGE COMPRISING AN END-FIRE ANTENNA ARRAY

OPTICAL CONNECTOR UNIT FOR A PHOTONIC ASSEMBLY AND METHODS FOR FORM...

SEMICONDUCTOR DEVICE HAVING A HEAT DISSIPATION STRUCTURE CONNECTED...

SEMICONDUCTOR MODULE

ELECTRONIC DEVICE

SEMICONDUCTOR PACKAGES

ELECTRONIC DEVICE AND A METHOD FOR FORMING THE SAME

ELECTRONIC MODULE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGES

POWER SEMICONDUCTOR DEVICE

ANTENNA IN PACKAGE HAVING ANTENNA ON PACKAGE SUBSTRATE

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

MULTILAYER CORELESS SUBSTRATE FORMED FROM STACKED EMBEDDED TRACE SU...

CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

MICROELECTRONIC COMPONENT HAVING MOLDED REGIONS WITH THROUGH-MOLD VIAS

EMBEDDED COMPONENT PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

CHIP ASSEMBLY, CHIP INTERPOSER AND FABRICATING METHOD FOR CHIP ASSE...

DIE-TO-DIE PROBE PAD CONNECTION IN A STACKED SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE DEVICE AND SEMICONDUCTOR WIRING SUBSTRATE THE...

MULTILAYER SUBSTRATES AND METHODS FOR MANUFACTURING SAME, POWER MOD...

BRIDGE CHIP, SEMICONDUCTOR PACKAGE INCLUDING BRIDGE CHIP AND METHOD...

MICROELECTRONIC ASSEMBLIES

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

METHODS AND APPARATUS FOR MOUNTING SEMICONDUCTOR DEVICES IN CAVITIES

METHODS AND APPARATUS TO EMBED A SEMICONDUCTOR DEVICE IN A GLASS CORE

PEDESTALS FOR SEMICONDUCTOR COMPONENTS EMBEDDED IN PACKAGE SUBSTRAT...