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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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Patents Grants
last 30 patents
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Patent Grant
Bonding wire for semiconductor devices
Patent number
11,929,343
Issue date
Mar 12, 2024
Nippon Micrometal Corporation
Daizo Oda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dual solder methodologies for ultrahigh density first level interco...
Patent number
11,908,820
Issue date
Feb 20, 2024
Intel Corporation
Chandramouleeswaran Subramani
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
Patent number
11,876,053
Issue date
Jan 16, 2024
Intel Corporation
Henning Braunisch
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming a semiconductor device having TSV formed through...
Patent number
11,854,990
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Hsien-Pin Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
Patent number
11,824,008
Issue date
Nov 21, 2023
Intel Corporation
Henning Braunisch
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor memory device structure
Patent number
11,742,307
Issue date
Aug 29, 2023
OVONYX MEMORY TECHNOLOGY, LLC
John Moore
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor die contact structure and method
Patent number
11,515,272
Issue date
Nov 29, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Chung-Shi Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor chip with redundant thru-silicon-vias
Patent number
11,469,212
Issue date
Oct 11, 2022
Advanced Micro Devices, Inc.
Bryan Black
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stretchable form of single crystal silicon for high performance ele...
Patent number
11,456,258
Issue date
Sep 27, 2022
The Board of Trustees of the University of Illinois
John A. Rogers
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Dual solder methodologies for ultrahigh density first level interco...
Patent number
11,322,469
Issue date
May 3, 2022
Intel Corporation
Chandramouleeswaran Subramani
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Semiconductor device and method of manufacturing semiconductor device
Patent number
11,315,854
Issue date
Apr 26, 2022
Fuji Electric Co., Ltd.
Ryoichi Kato
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for permanent connection of two metal surfaces
Patent number
11,282,801
Issue date
Mar 22, 2022
EV Group E. Thallner GmbH
Viorel Dragoi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor memory device structure
Patent number
11,264,344
Issue date
Mar 1, 2022
OVONYX MEMORY TECHNOLOGY, LLC
John Moore
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of making a pillar structure having a non-metal sidewall pro...
Patent number
11,257,714
Issue date
Feb 22, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Chien Ling Hwang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-junction LED with eutectic bonding and method of manufacturin...
Patent number
11,251,167
Issue date
Feb 15, 2022
SUNDIODE KOREA
James Chinmo Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Structures for bonding a group III-V device to a substrate by stack...
Patent number
11,158,593
Issue date
Oct 26, 2021
Taiwan Semiconductor Manufacturing Company, Ltd
Jhih-Bin Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D packaging with low-force thermocompression bonding of oxidizable...
Patent number
11,134,598
Issue date
Sep 28, 2021
SET North America, LLC
Eric Frank Schulte
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods and devices for fabricating and assembling printable semico...
Patent number
11,088,268
Issue date
Aug 10, 2021
The Board of Trustees of the University of Illinois
Ralph G. Nuzzo
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Semiconductor device manufacturing method
Patent number
11,069,643
Issue date
Jul 20, 2021
Fuji Electric Co., Ltd.
Kenshi Kai
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor device and method of making a semiconductor device
Patent number
11,011,446
Issue date
May 18, 2021
Nexperia B.V.
Tonny Kamphuis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Cu alloy bonding wire for semiconductor device
Patent number
10,985,130
Issue date
Apr 20, 2021
NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
Tetsuya Oyamada
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information
Patent Grant
Bonding wire for semiconductor device
Patent number
10,950,571
Issue date
Mar 16, 2021
NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
Tetsuya Oyamada
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Lead free solder columns and methods for making same
Patent number
10,937,752
Issue date
Mar 2, 2021
TOPLINE CORPORATION
Martin B. Hart
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Chip arrangements
Patent number
10,930,614
Issue date
Feb 23, 2021
Infineon Technologies AG
Manfred Mengel
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Multi-chip package and method of providing die-to-die interconnects...
Patent number
10,923,429
Issue date
Feb 16, 2021
Intel Corporation
Henning Braunisch
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming a 3D IC architecture including forming a first d...
Patent number
10,923,431
Issue date
Feb 16, 2021
Taiwan Semiconductor Manufacturing Company, Ltd.
Hsien-Pin Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and apparatus for creating a bond between objects based on f...
Patent number
10,923,454
Issue date
Feb 16, 2021
Seyed Amir Paknejad
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for fabricating low resistance, low inductance interconnecti...
Patent number
RE48420
Issue date
Feb 2, 2021
Texas Instruments Incorporated
Bernhard P. Lange
Information
Patent Grant
Load sensing devices, packages, and systems
Patent number
10,910,500
Issue date
Feb 2, 2021
STMicroelectronics S.r.l.
Mohammad Abbasi Gavarti
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor die contact structure and method
Patent number
10,847,459
Issue date
Nov 24, 2020
Taiwan Semiconductor Manufacturing Company, Ltd.
Chung-Shi Liu
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
Publication number
20230387066
Publication date
Nov 30, 2023
NIPPON MICROMETAL CORPORATION
Daizo ODA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
Publication number
20230245995
Publication date
Aug 3, 2023
NIPPON MICROMETAL CORPORATION
Daizo ODA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RESIN-SEALED SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING RESI...
Publication number
20230132513
Publication date
May 4, 2023
Mitsubishi Electric Corporation
Ryuichi ISHII
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Die Contact Structure and Method
Publication number
20230085696
Publication date
Mar 23, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Chung-Shi Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREFOR
Publication number
20230060577
Publication date
Mar 2, 2023
Showa Denko Materials Co., Ltd.
Kunihiko AKAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PHASE CHANGE INTERCONNECTS AND METHODS FOR FORMING THE SAME
Publication number
20230058704
Publication date
Feb 23, 2023
TOKYO ELECTRON LIMITED
Robert D. Clark
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR CHIP WITH REDUNDANT THRU-SILICON-VIAS
Publication number
20230031099
Publication date
Feb 2, 2023
ADVANCED MICRO DEVICES, INC.
BRYAN BLACK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICES
Publication number
20230018430
Publication date
Jan 19, 2023
NIPPON MICROMETAL CORPORATION
Daizo ODA
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD FOR WAFER BONDING AND COMPOUND SEMICONDUCTOR WAFER
Publication number
20220238501
Publication date
Jul 28, 2022
Stefan Hampl
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Light-Emitting Device and Displayer
Publication number
20220231206
Publication date
Jul 21, 2022
FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD
Kuai QIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR MEMORY DEVICE STRUCTURE
Publication number
20220157753
Publication date
May 19, 2022
Ovonyx Memory Technology, LLC
John Moore
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COMPOSITION FOR CONDUCTIVE ADHESIVE, SEMICONDUCTOR PACKAGE COMPRISI...
Publication number
20220077099
Publication date
Mar 10, 2022
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
Gwang-Mun CHOI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND DEVICES FOR FABRICATING AND ASSEMBLING PRINTABLE SEMICO...
Publication number
20210343862
Publication date
Nov 4, 2021
THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
Ralph G. NUZZO
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
CHIP ARRANGEMENTS
Publication number
20210167034
Publication date
Jun 3, 2021
INFINEON TECHNOLOGIES AG
Manfred MENGEL
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD AND APPARATUS FOR CREATING A BOND BETWEEN OBJECTS BASED ON F...
Publication number
20210167035
Publication date
Jun 3, 2021
Seyed Amir Paknejad
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3DIC Architecture with Interposer or Bonding Dies
Publication number
20210167018
Publication date
Jun 3, 2021
Taiwan Semiconductor Manufacturing Co., Ltd.
Hsien-Pin Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR PRODUCING A COMPONENT WHICH IS CONNECTED TO A SOLDER PRE...
Publication number
20210129245
Publication date
May 6, 2021
Heraeus Deutschland GmbH & Co. KG
Michael Schäfer
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Semiconductor Die Contact Structure and Method
Publication number
20210074627
Publication date
Mar 11, 2021
Taiwan Semiconductor Manufacturing Co., Ltd.
Chung-Shi Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20210066158
Publication date
Mar 4, 2021
Fuji Electric Co., Ltd.
Ryoichi KATO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Cu ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE
Publication number
20210043599
Publication date
Feb 11, 2021
NIPPON STREET CHEMICAL & MATERTIAL CORPORATION CO., LTD.
Tetsuya Oyamada
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-JUNCTION LED WITH EUTECTIC BONDING AND METHOD OF MANUFACTURIN...
Publication number
20200402964
Publication date
Dec 24, 2020
SUNDIODE KOREA
James Chinmo KIM
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information
Patent Application
SEMICONDUCTOR MEMORY DEVICE STRUCTURE
Publication number
20200357761
Publication date
Nov 12, 2020
Ovonyx Memory Technology, LLC
John Moore
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICES
Publication number
20200312808
Publication date
Oct 1, 2020
NIPPON MICROMETAL CORPORATION
Daizo ODA
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
STRUCTURES FOR BONDING A GROUP III-V DEVICE TO A SUBSTRATE BY STACK...
Publication number
20200227369
Publication date
Jul 16, 2020
Taiwan Semiconductor Manufacturing Co., LTD
Jhih-Bin Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Cu ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE
Publication number
20200168578
Publication date
May 28, 2020
NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
Tetsuya OYAMADA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
Publication number
20200098717
Publication date
Mar 26, 2020
Fuji Electric Co., Ltd.
Kenshi KAI
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS...
Publication number
20200075493
Publication date
Mar 5, 2020
Intel Corporation
Henning BRAUNISCH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Stretchable Form of Single Crystal Silicon for High Performance Ele...
Publication number
20200013720
Publication date
Jan 9, 2020
THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
John A. ROGERS
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
METHODS AND DEVICES FOR FABRICATING AND ASSEMBLING PRINTABLE SEMICO...
Publication number
20200006540
Publication date
Jan 2, 2020
THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
Ralph G. NUZZO
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
STRUCTURES FOR BONDING A GROUP III-V DEVICE TO A SUBSTRATE
Publication number
20200006271
Publication date
Jan 2, 2020
Taiwan Semiconductor Manufacturing Co., LTD
Jhih-Bin Chen
H01 - BASIC ELECTRIC ELEMENTS